Abstract:
An anisotropic conductive adhesive composition is provided to realize high reliability even in a circuit connection process less than 10 seconds by using acryl rubber with excellent flexibility and adhesion as a binder. An anisotropic conductive adhesive composition comprises (A) acrylic rubber 5~60 weight% having the weight average molecular weight of 100,000-1,000,000 as a binder; (B) a material 30~70 weight% having one or two (meth)acrylate functional groups; (C) a material 1~10 weight% having at least three (meth)acrylate functional groups; (D) organic peroxides 1~10 weight%; and (E) conductive particles 1 ~ 10 weight%.
Abstract:
A semi-thermosetting anisotropic conductive film composition is provided to improve cutting property, compression property, compression reworkability, the reliance for a long time and the stability of adhesive strength. A semi-thermosetting anisotropic conductive film composition comprises 100 parts by weight of a thermoplastic resin having a weight average molecular weight of 150,000-600,000; 100-400 parts by weight of a thermosetting material having an acrylate or methacrylate functional group and having a weight average molecular weight of 100-10,000; 0.3-10 parts by weight of an organic peroxide; a silane coupling agent; and a conductive particle.
Abstract:
An anisotropic conductive film composition is provided to have excellent long-term reliance because the composition shows high adhesiveness by heating and pressing and retains good adhesion even under a severe condition of high temperature and high humidity. An anisotropic conductive film composition includes 20-60wt% of a cross-linkable rubber resin, 36-76wt% of a radically polymerizable material, 0.8-4.0wt% of a radical initiator combination comprising at least one first radical initiator selected from the group containing diacylperoxide, peroxydicarbonate, and peroxyester, and at least one second radical initiator selected from peroxyketal and dialkylperoxide, and 0.2-20wt% of conductive particles.
Abstract:
An anisotropic conductive film composition, an anisotropic conductive film formed from the composition, and a precompression method using the film are provided to allow an anisotropic conductive film to be adhered to a substrate without using high heat in precompression process. An anisotropic conductive film composition comprises 5-15 wt% of a curing additive which is at least one resin selected from the compound represented by C-[(CH2)n1-O(CH2)n2-R1]4 and the compound represented by the formula 2; a thermoplastic resin having a molecular weight of 10,000 or more; a radical polymerizable material; a conductive particle; and a radical initiator, wherein R1 and R2 are independently a C2-C8 epoxy group; n1 to n3 are an integer of 1-10; and a is 2-4.
Abstract:
An anisotropic conductive adhesive composition, and an anisotropic conductive adhesive film formed by using the composition are provided to improve adhesive strength, heat resistance, humidity resistance, flowability and electrical conductive stability. An anisotropic conductive adhesive composition comprises 100 parts by weight of an ethylene-vinyl acetate copolymer; 10-100 parts by weight of a carboxyl-modified polyacetal resin having a molecular weight of 10,000 or more; 40-180 parts by weight of a radical polymerizable material; 0.3-10 parts by weight of a radical initiator based on 100 parts by weight of the copolymer, the polyacetal resin and the radical polymerizable material; and 0.2-30 parts by weight of a conductive particle based on 100 parts by weight of the radical polymerizable material and the polyacetal resin.
Abstract:
본 발명은 접속 신뢰성을 높이고 안정적인 접속 저항을 구현할 수 있는 이방성 도전 필름에 관한 것이다. 구체적으로, 상기 이방성 도전 필름은 유리 전이 온도가 200 내지 300 ℃ 인 에폭시 수지, 유리 전이 온도가 130 내지 200 ℃인 에폭시 수지 및 30% K 값이 1000 내지 3000 N/mm 2 인 도전 입자를 포함하여, 접속 신뢰성이 우수하고 버블 발생이 낮은 이방성 도전 필름에 관한 것이다.
Abstract translation:本发明涉及能够提高连接可靠性并实现稳定的连接电阻的各向异性导电膜,更具体地说,涉及具有优异的连接可靠性并通过包含玻璃化转变温度为200℃的环氧树脂产生较少气泡的各向异性导电膜 300℃,玻璃化转变温度为130〜200℃的环氧树脂,K值为1000〜3000N / mm ^ 2的导电性粒子。