Abstract:
본 발명은 이방 전도성 필름에 CICP(complex inorganic color pigment)를 특정 함량으로 포함시킴으로써, 전기적 특성 및 열적 특성을 저하시키지 않으면서 회로 부재에 가압착한 후 필름의 유무를 쉽게 인식할 수 있게 하는 이방 전도성 필름에 관한 것이다.
Abstract:
본 발명은 이방 도전성 필름용 릴 및 이를 위한 지지클립에 관한 것으로, 옆면에 이방 도전성 필름이 권취되는 원통형의 코어와, 상기 코어의 윗면 및 밑면에 쌍으로 형성되어, 상기 이방 도전성 필름 및 상기 코어를 보호하는 원반형 릴 가이드 및 상기 릴 가이드의 측면에 끼워지는 형태로 형성되어 상기 릴 가이드 사이의 간격을 유지시키는 지지클립을 포함하도록 하여, 풀림 시 이형 필름과 이방 도전성 접착층 사이에 박리가 일어나는 것을 방지할 수 있고, 정상적인 이방 도전성 필름을 확보할 수 있도록 하는 발명에 관한 것이다. 이방 도전성 필름, 릴, 지지클립, 코어, 릴 가이드
Abstract:
PURPOSE: An adhesive film composition for electronic devices is provided to secure the reliability of the adhesive film and to obtain stable adhesive strength and a contact resistance by preventing the hydrolysis of an ester bond at a high temperature and high humidity. CONSTITUTION: An adhesive film composition for electronic devices comprises 100.0 parts by weight of a binder resin, 0.1-10 parts by weight of a compound having a carbodiimide group, 10-120 parts by weight of a compound having a (meta)acrylate group, and 0.1-10 parts by weight of organic peroxide. The binder resin comprises: 3-50 weight% of acrylonitrile butadiene rubber having a modified carboxyl group; 5-50 weight% of acrylic copolymers; and 5-70 weight% of a resin including an ester bond.
Abstract:
본 발명의 구현예들은 중량평균분자량 15만 내지 60만의 열가소성 수지, 중량평균분자량 100 내지 1만의 아크릴레이트 또는 메타크릴레이트 관능기를 갖는 열경화성 물질, 유기과산화물, 실란 커플링제 및 도전성 입자를 포함하는 것을 특징으로 하는 반열경화성 이방 도전성 필름 조성물에 관한 것이다. 이방 도전성 필름, 반열경화성, 조액 안정성, 필름 코팅성, 항복 응력, 절단신도, 접착력, 접속저항, 신뢰성
Abstract:
An anisotropic conductive adhesive composition, and an anisotropic conductive adhesive film prepared from the composition are provided to improve adhesive strength, moisture resistance, heat resistance and mechanical properties. An anisotropic conductive adhesive composition comprises 100 parts by weight of a thermoplastic resin which is at least one selected from the group consisting of an olefin resin, a butadiene resin, an acrylonitrile-butadiene copolymer, a carboxyl-terminated acrylonitrile-butadiene copolymer and a phenoxy resin; 40-100 parts by weight of a carboxyl modified polyacetal resin having a weight average molecular weight of 10,000-500,000; 80-150 parts by weight of a radical polymerizable material; a radical initiator; and a conductive particle.
Abstract:
PURPOSE: An aniotropically conductive film composition is provided to obtain adhesion while enduring stress generated from both ends of a connection substrate under compression due to heat and pressure. CONSTITUTION: An aniotropically conductive film composition has an elastic modulus of 4,000-10,000 MPa at 50°C after curing, and a glass transition temperature(Tg) of 110-150 °C after curing. The aniotropically conductive film composition comprises an acrylate-modified urethane resin, a diene-based rubber, an elastically reinforced resin, a radically polymerizable material, a polymerization initiator, and conductive particles. The elastically reinforced resin is one or more selected from a cellulose based resin and a styrene based resin. The elastically reinforced resin comprises 20-50 weight% of the cellulose based resin and 50-80 weight% of the styrene based resin.
Abstract:
PURPOSE: An anisotropic conductive adhesive film and a manufacturing method thereof are provided to reduce the processing time for improving the productivity of the adhesive film, and to improve the press bonding process of the film. CONSTITUTION: An anisotropic conductive adhesive film(100) comprises the following: a release film(130); and an anisotropic conductive adhesive layer(120) formed on one side of the release film, including anisotropic conductive adhesives(110) arranged with constant intervals in a stripe pattern. The anisotropic conductive adhesives are attached with at least one adherend of an electrode. The intervals among adhesives are 30~120 microns. The width of the anisotropic conductive adhesives is 100micron~5millimeters.
Abstract:
An anisotropic conductive adhesive composition is provided to realize high reliability even in a circuit connection process less than 10 seconds by using acryl rubber with excellent flexibility and adhesion as a binder. An anisotropic conductive adhesive composition comprises (A) acrylic rubber 5~60 weight% having the weight average molecular weight of 100,000-1,000,000 as a binder; (B) a material 30~70 weight% having one or two (meth)acrylate functional groups; (C) a material 1~10 weight% having at least three (meth)acrylate functional groups; (D) organic peroxides 1~10 weight%; and (E) conductive particles 1 ~ 10 weight%.
Abstract:
A semi-thermosetting anisotropic conductive film composition is provided to improve cutting property, compression property, compression reworkability, the reliance for a long time and the stability of adhesive strength. A semi-thermosetting anisotropic conductive film composition comprises 100 parts by weight of a thermoplastic resin having a weight average molecular weight of 150,000-600,000; 100-400 parts by weight of a thermosetting material having an acrylate or methacrylate functional group and having a weight average molecular weight of 100-10,000; 0.3-10 parts by weight of an organic peroxide; a silane coupling agent; and a conductive particle.