폴리시안아미드 화합물 및 그의 제조 방법
    11.
    发明授权
    폴리시안아미드 화합물 및 그의 제조 방법 失效
    聚酰胺化合物及其生产方法

    公开(公告)号:KR1019960010249B1

    公开(公告)日:1996-07-26

    申请号:KR1019920022562

    申请日:1992-11-27

    Abstract: The polycyanamide compound of formula (I) is prepared by conducting diazotization of polycyanamide of formula(II) in sulfuric acid; coupling diazotized polycyanamide with alizarin yellow GG of formula (IIIa), sudan III of formula(IIIb), orange II of formula(IIIc), acriflavine of formula(IIId), bordeaux R of formula(IIIe), K2 of formulas(IIIf). In formula, x is 10-30.

    Abstract translation: 式(I)的聚氰胺化合物通过在硫酸中进行式(II)的聚氰胺的重氮化来制备; 将式(IIIa)的茜素黄GG,式(IIIb)的苏丹III,式(IIIc)的橙色II,式(IIId)的吖啶啉,式(IIIe)的波尔多R,式(IIIf)的K2与重氮化的聚氰胺 。 在式中,x为10-30。

    초소수성 표면의 제조방법 및 이에 의하여 제조된 초소수성표면체
    12.
    发明授权
    초소수성 표면의 제조방법 및 이에 의하여 제조된 초소수성표면체 有权
    超级表面和超级表面体系的制造方法

    公开(公告)号:KR100845744B1

    公开(公告)日:2008-07-11

    申请号:KR1020070070284

    申请日:2007-07-12

    CPC classification number: H01L21/033 H01L21/02631 H01L21/3065 H01L21/324

    Abstract: A fabricating method of a super-hydrophobic surface and a super-hydrophobic surface body fabricated therefrom are provided to enhance super-hydrophobic characteristics of a final surface by forming a double protrusion structure. A mask pattern(20) is formed on a wafer(10). A plurality of first protrusions(11) and a plurality of second protrusions(12) formed between the first protrusions are simultaneously formed by etching the wafer exposed by the mask pattern. A hydrophobic thin film is formed on the first protrusions and the second protrusions. The process for forming the first and second protrusions is performed by a plasma etch process using CF4 gas. The process for forming the first and second protrusions is performed under conditions of etch pressure of 2Pa-5pa and RF power of 100W-300W.

    Abstract translation: 提供由其制造的超疏水表面和超疏水表面体的制造方法,以通过形成双突起结构来增强最终表面的超疏水特性。 在晶片(10)上形成掩模图案(20)。 通过蚀刻由掩模图案曝光的晶片,同时形成在第一突起之间形成的多个第一突起(11)和多个第二突起(12)。 在第一突起和第二突起上形成疏水性薄膜。 通过使用CF 4气体的等离子体蚀刻工艺来进行用于形成第一和第二突起的工艺。 用于形成第一和第二突起的工艺在蚀刻压力为2Pa-5pa和RF功率为100W-300W的条件下进行。

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