저온소성용 저유전율 유전체 세라믹 조성물
    11.
    发明公开
    저온소성용 저유전율 유전체 세라믹 조성물 有权
    低火电介质陶瓷组合物

    公开(公告)号:KR1020100000945A

    公开(公告)日:2010-01-06

    申请号:KR1020080060633

    申请日:2008-06-26

    Abstract: PURPOSE: A low fired dielectric ceramic composition is provided to ensure 220 MPa or more strength value and low dielectric loss. CONSTITUTION: A brosilicate glass frit contains 60-70 mole% of SiO2, 15-30 mole% of B2O3, 1-5 mole% of Al2O3, 0.1-3 mole% of Li2O and 0.5-15 mole% of at least two or more selected from MgO, CaO, SrO, and ZnO. A low fired dielectric ceramic composition contains borodilicate glass frit; at least one or more filler selected from single and complex oxide comprising Al2O3, SiO2, cordierite, Mullite, MgAl2O4, ZnAl2O4, Mg2SiO4, and ZrSiO4; at least one or more ceramic selected from CaTiO3, SrTiO3, and BaTiO3.

    Abstract translation: 目的:提供低烧电介质陶瓷组合物,以确保220 MPa或更高的强度值和低介电损耗。 构成:硼硅酸盐玻璃料含有60-70摩尔%的SiO 2,15-30摩尔%的B2O3,1-5摩尔%的Al2O3,0.1-3摩尔%的Li 2 O和0.5-15摩尔%的至少两个或更多个 选自MgO,CaO,SrO和ZnO。 低烧烧介电陶瓷组合物含有硼硅酸盐玻璃料; 选自包含Al 2 O 3,SiO 2,堇青石,莫来石,MgAl 2 O 4,ZnAl 2 O 4,Mg 2 SiO 4和ZrSiO 4的单一和复合氧化物的至少一种或多种填料; 选自CaTiO 3,SrTiO 3和BaTiO 3中的至少一种或多种陶瓷。

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