플라즈마를 이용한 레이저 가공상태 모니터링 장치 및 방법
    11.
    发明公开
    플라즈마를 이용한 레이저 가공상태 모니터링 장치 및 방법 有权
    使用等离子体监测激光加工状态的装置和方法

    公开(公告)号:KR1020120039212A

    公开(公告)日:2012-04-25

    申请号:KR1020100100780

    申请日:2010-10-15

    Abstract: PURPOSE: Laser processing condition monitoring apparatus and method using plasma are provided to effectively monitor and analyze the processed condition of objects using the plasma generated from the processed objects. CONSTITUTION: A laser processing condition monitoring method comprises the following steps: irradiating an object(102) with a pulse laser(107) for processing; and detecting light(200) transmitted from the plasma(106) generated from the object for monitoring the processed condition of the object. The peak power of the pulse laser is controlled to process the object with a nonlinear optic phenomenon.

    Abstract translation: 目的:提供使用等离子体的激光加工状态监测装置和方法,以有效地监测和分析使用从被处理物体产生的等离子体的物体的处理状态。 构成:激光加工状态监测方法包括以下步骤:用脉冲激光器(107)照射物体(102)进行处理; 以及检测从所述对象产生的等离子体(106)发送的光(200),用于监视对象的处理状态。 控制脉冲激光器的峰值功率以用非线性光学现象来处理物体。

    펨토초 펄스 레이저의 시간에 따른 광강도 조절을 통한 절단방법
    12.
    发明公开
    펨토초 펄스 레이저의 시간에 따른 광강도 조절을 통한 절단방법 有权
    通过优化的超声波强度分布的有效衬底

    公开(公告)号:KR1020110137031A

    公开(公告)日:2011-12-22

    申请号:KR1020100057008

    申请日:2010-06-16

    Abstract: PURPOSE: A cutting method through control of light intensity depending on the time of femtosecond pulse laser is provided to maximize the effect of a processing mechanism, which bases on multi photon ionization and avalanche ionization. CONSTITUTION: A cutting method through control of light intensity depending on the time of femtosecond pulse laser comprises next steps. At least two femtosecond laser pulses are generated separately to have a time interval using pulse delay(120). Each pulse excites electrons on a target(200) based on multi photon Ionization. The electrons excited from the multi photon ionization through avalanche ionization are used as seeds to increase the ionization of a material. Each of at least two femtosecond laser pulses is output, wherein one or more of their pulse width, pulse energy threshold, and inter-pulse interval are different.

    Abstract translation: 目的:提供根据飞秒脉冲激光器的时间控制光强度的切割方法,以最大化基于多光子电离和雪崩电离的处理机制的影响。 构成:根据飞秒脉冲激光器的时间控制光强度的切割方法包括以下步骤。 至少两个飞秒激光脉冲被分开产生以具有使用脉冲延迟的时间间隔(120)。 每个脉冲基于多光子电离在靶(200)上激发电子。 通过雪崩电离从多光子电离激发的电子被用作种子以增加材料的电离。 输出至少两个飞秒激光脉冲中的每一个,其中它们的脉冲宽度,脉冲能量阈值和脉冲间间隔中的一个或多个是不同的。

    펨토초 펄스 레이저 응용 PZT 소자를 이용한 가공면 절단 방법
    13.
    发明公开
    펨토초 펄스 레이저 응용 PZT 소자를 이용한 가공면 절단 방법 有权
    使用FEMTOSECOND脉冲激光应用PZT元件切割加工侧的方法

    公开(公告)号:KR1020110132004A

    公开(公告)日:2011-12-07

    申请号:KR1020100051774

    申请日:2010-06-01

    CPC classification number: B23K26/36 H01L21/304

    Abstract: PURPOSE: A processed-surface cutting method using a PZT(piezoelectric) element applying femtosecond pulse laser is provided to enhance the cutting speed since the temtosecond pulse laser is used for a bendable or expandable PZT element, and the modified area of a target is separated along a cutting line quickly. CONSTITUTION: A processed-surface cutting method using a PZT(piezoelectric) element applying femtosecond pulse laser is as follows. A transparent material, a wafer, and a target(101) like a substrate are attached to an expanding tape(103), and the expanding tape is attached onto a bendable PZT element(102). The femtosecond pulse laser is irradiated to the cut part of the target for several tens of femtosecond, and modified areas are formed in the cut part of the target. Voltage is supplied to the bendable PZT element, and the middle part of the PZT element is protruded to generate bending stress.

    Abstract translation: 目的:提供使用飞秒脉冲激光器的PZT(压电)元件的加工面切割方法,以提高切割速度,因为立体脉冲激光器用于可弯曲或可扩展的PZT元件,并且目标的修改区域被分离 沿着切割线很快。 构成:使用使用飞秒脉冲激光器的PZT(压电)元件的加工面切割方法如下。 将透明材料,晶片和像基板的靶(101)连接到扩张带(103)上,将扩张带附接到可弯曲的PZT元件(102)上。 飞秒脉冲激光被照射到目标的切割部分数十飞秒,并且在靶的切割部分中形成改质区域。 电压被提供给可弯曲的PZT元件,并且PZT元件的中间部分突出以产生弯曲应力。

    극초단 펄스 레이저를 이용한 투명시편 절단방법 및 다이싱 장치
    14.
    发明授权
    극초단 펄스 레이저를 이용한 투명시편 절단방법 및 다이싱 장치 有权
    透明材料切割方法使用超声波脉冲激光及其定位装置

    公开(公告)号:KR101358672B1

    公开(公告)日:2014-02-11

    申请号:KR1020130034212

    申请日:2013-03-29

    Abstract: The present invention relates to a transparent material processing method and a dicing apparatus for processing a transparent material. The transparent material processing method comprises: a step for forming a focusing point by generating and focusing a ultrafast pulse laser, where a peak wavelength corresponds to a pass band of a transparent material, having a pulse width of 10 fs-10 ps from a laser source; a step for delivering energy to an inside of the transparent material by the focusing pulse laser beam by locating a focusing point of the pulse laser beam in order to locate the focusing point in an inside of both surfaces of the transparent material; and a step for generating and propagating a crack to include that the crack on the transparent material is separated from a movement line of the focusing point at regular intervals and propagated by relatively moving the focusing point or the transparent material along a cutting line of a desired shape.

    Abstract translation: 本发明涉及一种用于处理透明材料的透明材料处理方法和切割装置。 透明材料处理方法包括:通过产生和聚焦超快脉冲激光器形成聚焦点的步骤,其中峰值波长对应于透明材料的通带,其具有来自激光器的10fs-10ps的脉冲宽度 资源; 通过定位脉冲激光束的聚焦点,通过聚焦脉冲激光束将能量传递到透明材料的内部以将聚焦点定位在透明材料的两个表面的内部的步骤; 以及用于产生和传播裂纹以包括透明材料上的裂纹以规则的间隔从聚焦点的移动线分离出来并通过相对移动聚焦点或透明材料沿着期望的切割线而传播的步骤 形状。

    0.1 ∼ 30 MHz의 반복률을 갖는 광섬유 레이저 시스템 및 이를 이용한 시편 가공
    15.
    发明授权
    0.1 ∼ 30 MHz의 반복률을 갖는 광섬유 레이저 시스템 및 이를 이용한 시편 가공 有权
    基于光纤的激光系统,重复率为0.1〜30 MHz,采用这些激光源制作样品

    公开(公告)号:KR101268568B1

    公开(公告)日:2013-05-28

    申请号:KR1020110012349

    申请日:2011-02-11

    Abstract: 본발명은, 두가지방법을통해 0.1 ~ 30 MHz의반복률을가지는레이저를생성한다. 첫번째방법은레이저펌핑광을출사하는펌핑광원, 상기광원에서출사되는펌핑광의파장을공진기로입사시키는파장분할기, 상기파장분할기를통해입사하는광을이용하여공진기내부공진광을증폭시키는이터븀첨가광섬유, 공진기내부의편광을조절하여 NPE(nonlinear polarization evolution)을통한편광기반모드잠금을유발하는데필요한제 1파장판, 광차폐기, 제 2파장판, 혹은광량기반모드잠금현상을유발하기위해필요한포화광흡수체를이용하여 30 ~ 200 MHz의반복률을갖는레이저공진기를구성하고, 상기공진기에서출력되는레이저를펄스추출기를이용하여 0.1 ~ 30 MHz의반복률을가지는레이저를생성하는것을특징으로한다. 두번째방법은첫 번째방법과는달리공진기외부에펄스추출기를사용하지않고, 공진기자체적으로 0.1 ~ 30 MHz에해당하는펄스를생성하는것으로, 이를위해단일모드광섬유를추가로공진기내에연결하며, 이로인해발생한과도한분산을보상하기위한분산보상부를삽입하고, 편광기반모드잠금과광량기반모드잠금방법을동시에적용하여안정적인모드잠금이유지되도록하는것을특징으로한다. 또한, 0.1 ~ 30 MHz의반복률을갖는레이저를증폭단을통해증폭하여가공에적용함으로써, 높은수율을보이는가공시스템을구성할수 있다.

    펨토초 레이저에 의해 나노 보이드 어레이 형성을 통한 절단방법
    16.
    发明授权
    펨토초 레이저에 의해 나노 보이드 어레이 형성을 통한 절단방법 有权
    使用飞秒脉冲激光器的纳米空心阵列形成的基板切割方法

    公开(公告)号:KR101181719B1

    公开(公告)日:2012-09-19

    申请号:KR1020100059233

    申请日:2010-06-22

    Abstract: 본 발명은 펨토초 레이저에 의해 나노 보이드 어레이 형성을 통한 절단방법에 관한 것으로, 극초단 펨토초 레이저를 개구수(NA)가 0.7 내지 0.95를 가지는 집광렌즈로 집광시켜 투명재료 또는 기판에 조사함으로써, 비선형 커렌즈(Kerr Lens) 현상에 의한 자체 집속(Self Focusing)과 다중광자이온화(Multi-Photon Ionization) 현상에 의한 플라즈마 디포커싱(Plasma Defocusing) 되도록 하여 기판에 나노 보이드 어레이(Nano-Void Array)를 형성한 후 절단하는 것을 특징으로 한다. 이와 같이 구성되는 본 발명은 나노 보이드 어레이를 형성하여 투명재료의 절단 및 가공 효율을 향상시킬 수 있고, 기존에 불가능한 얇은 투명재료의 효율적인 절단 및 가공을 가능한 이점이 있다.

    0.1 ∼ 30 MHz의 반복률을 갖는 광섬유 레이저 시스템 및 이를 이용한 시편 가공
    17.
    发明公开
    0.1 ∼ 30 MHz의 반복률을 갖는 광섬유 레이저 시스템 및 이를 이용한 시편 가공 有权
    具有0.1〜30 MHZ重复率的光纤激光系统和使用这些激光源的样品制造

    公开(公告)号:KR1020120092350A

    公开(公告)日:2012-08-21

    申请号:KR1020110012349

    申请日:2011-02-11

    CPC classification number: H01S3/1115 B23K26/382 H01S3/06791 H01S3/115

    Abstract: PURPOSE: A fiber laser systems with the repetition rate of 0.1-30 mhz and specimen manufacturing using the same are provided to implement a stable manual mode lock by simultaneously applying an NPE(Nonlinear Polarization Rotation) phenomenon and a saturable absorber. CONSTITUTION: Pump light generated from a laser diode(301) enters a resonator through a wavelength splitter(300). The pump light is absorbed in a ytterbium additional optical fiber(303). The light letting the resonator resonating passes through a wave plate(304) and a light shielding unit(305). One polarizing component is amplified in the ytterbium additional optical fiber. The amplified polarizing component is outputted through an opto-coupler(302). The outputted light reduces a repetition rate through a pulse extractor(306).

    Abstract translation: 目的:提供重复率为0.1-30 mhz的光纤激光系统,并通过同时施加NPE(非线性极化旋转)现象和可饱和吸收器实现稳定的手动模式锁定。 构成:从激光二极管(301)产生的泵浦光通过波长分离器(300)进入谐振器。 泵浦光被镱附加光纤吸收(303)。 谐振器谐振的光通过波片(304)和遮光单元(305)。 在镱附加光纤中放大一个偏振分量。 放大的偏振分量通过光耦合器(302)输出。 输出的光通过脉冲提取器(306)减少重复率。

    극초단 펄스 레이저와 수분 응고를 이용한 절단 장치 및 방법
    18.
    发明公开
    극초단 펄스 레이저와 수분 응고를 이용한 절단 장치 및 방법 有权
    超短脉冲激光和水切割装置及使用凝结法

    公开(公告)号:KR1020120058276A

    公开(公告)日:2012-06-07

    申请号:KR1020100119980

    申请日:2010-11-29

    Abstract: PURPOSE: A cutting device and method using ultra-short pulse laser and water freezing are provided to prevent the residue on a work piece by forming a void on the underside of the work piece using ultra-short pulse laser and reduce cut scraps by using stress generated from the freezing of water in the void. CONSTITUTION: A cutting device using ultra-short pulse laser and water freezing comprises a laser source, a base plate(104), a vapor supply unit(108), and a cooling gas supply unit(109). The laser source condenses a laser(100) through a condensing lens(110) to a work piece(102) and outputs ultra-short pulse laser to form a void(103) in the work piece. The base plate comprises a vapor supply part(106) and a cooling gas supply part(107) on both sides thereof. The cooling gas supply unit supplies cooling gas to the cooling gas supply part. A crack is generated in the work piece by the laser of the laser source. Vapor and cooling gas are successively supplied and the work piece is cut by expansion resulting from the freezing of vapor.

    Abstract translation: 目的:提供使用超短脉冲激光和水冷冻的切割装置和方法,以通过使用超短脉冲激光在工件的下侧上形成空隙来防止工件上的残留物,并通过应力减少切割屑 由空隙中的水冻结产生。 构成:使用超短脉冲激光和水冷冻的切割装置包括激光源,基板(104),蒸气供应单元(108)和冷却气体供应单元(109)。 激光源将激光器(100)通过聚光透镜(110)冷凝到工件(102),并输出超短脉冲激光器以在工件中形成空隙(103)。 基板在其两侧包括蒸气供应部分(106)和冷却气体供应部分(107)。 冷却气体供给单元向冷却气体供给部供给冷却气体。 通过激光源的激光在工件中产生裂纹。 依次供给蒸气和冷却气体,并且通过蒸气冷冻而产生的膨胀来切割工件。

    깊이에 따른 개질면의 특성 조합을 통한 절단 장치
    19.
    发明公开
    깊이에 따른 개질면의 특성 조합을 통한 절단 장치 有权
    经修改的切割装置的深度通过特点组合

    公开(公告)号:KR1020120058274A

    公开(公告)日:2012-06-07

    申请号:KR1020100119978

    申请日:2010-11-29

    CPC classification number: Y02P40/57

    Abstract: PURPOSE: A cutting device through the combination of characteristics of a reformed surface according to depth is provided to maintain high surface precision and maximize machining accuracy by freely regulating the size of a reformed area through pulse width control. CONSTITUTION: A cutting device through the combination of characteristics of a reformed surface according to depth comprises a laser source(100), a plurality of mirrors(200-203), a first condensing lens(400), a dispersion control unit(300), and a second condensing lens(401). The laser source outputs pulse laser. The plurality of mirrors split a laser beam output from the laser source or determine the directivity of the laser beam. The first condensing lens condenses one of the laser beams split through the mirrors to irradiate a work piece(500). The dispersion control unit controls the dispersion of another one of the laser beams. The second condensing lens condenses the laser beam dispersed by the dispersion control unit to irradiate the work piece.

    Abstract translation: 目的:提供通过根据深度的重整表面特性的组合的切割装置,以通过通过脉冲宽度控制自由调节重整区域的尺寸来保持高表面精度和最大化加工精度。 构成:通过根据深度的重整表面的特性的组合的切割装置包括激光源(100),多个反射镜(200-203),第一聚光透镜(400),色散控制单元(300) ,和第二聚光透镜(401)。 激光源输出脉冲激光。 多个反射镜分离从激光源输出的激光束或确定激光束的方向性。 第一聚光透镜将通过反射镜分离的激光束之一冷凝以照射工件(500)。 色散控制单元控制另一个激光束的色散。 第二聚光透镜将由分散控制单元分散的激光束聚焦以照射工件。

    매크로렌즈를 이용한 대면적 삼차원 형상측정을 위한 백색광주사간섭계 및 형상측정방법
    20.
    发明公开
    매크로렌즈를 이용한 대면적 삼차원 형상측정을 위한 백색광주사간섭계 및 형상측정방법 失效
    用于使用大面镜的大视场三维轮廓测量的白光干涉仪的装置和方法

    公开(公告)号:KR1020080051969A

    公开(公告)日:2008-06-11

    申请号:KR1020060123856

    申请日:2006-12-07

    Abstract: A white-light scanning interferometer for large-sized three-dimensional profile measurement using macro lenses and a method for measuring a three-dimensional profile are provided to change the most suitable visual region for the size of an object to be measured by using the zoom function of a macro lens. A light source(100) radiates white light. A light splitter(110) divides the white light into measuring light and reference light in order to irradiate the white light on a measuring surface and a reference surface. A macro lens(140) receives an interference pattern by using the reference light reflected from the measuring surface and the reference surface. An image acquisition unit(150) acquires the received interference pattern of the macro lens. The shape of the measuring surface is measured by using the interference pattern of the image acquisition unit.

    Abstract translation: 提供用于使用微距镜头进行大尺寸三维轮廓测量的白光扫描干涉仪和用于测量三维轮廓的方法,以通过使用变焦来改变要测量的物体的尺寸的最合适的视觉区域 微距镜头的功能。 光源(100)照射白光。 光分路器(110)将白光分为测量光和参考光,以将白光照射在测量表面和参考表面上。 微距镜头(140)通过使用从测量表面和参考表面反射的参考光来接收干涉图案。 图像获取单元(150)获取所接收到的微距镜头的干涉图案。 通过使用图像获取单元的干涉图案来测量测量表面的形状。

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