Abstract:
PURPOSE: Laser processing condition monitoring apparatus and method using plasma are provided to effectively monitor and analyze the processed condition of objects using the plasma generated from the processed objects. CONSTITUTION: A laser processing condition monitoring method comprises the following steps: irradiating an object(102) with a pulse laser(107) for processing; and detecting light(200) transmitted from the plasma(106) generated from the object for monitoring the processed condition of the object. The peak power of the pulse laser is controlled to process the object with a nonlinear optic phenomenon.
Abstract:
PURPOSE: A cutting method through control of light intensity depending on the time of femtosecond pulse laser is provided to maximize the effect of a processing mechanism, which bases on multi photon ionization and avalanche ionization. CONSTITUTION: A cutting method through control of light intensity depending on the time of femtosecond pulse laser comprises next steps. At least two femtosecond laser pulses are generated separately to have a time interval using pulse delay(120). Each pulse excites electrons on a target(200) based on multi photon Ionization. The electrons excited from the multi photon ionization through avalanche ionization are used as seeds to increase the ionization of a material. Each of at least two femtosecond laser pulses is output, wherein one or more of their pulse width, pulse energy threshold, and inter-pulse interval are different.
Abstract:
PURPOSE: A processed-surface cutting method using a PZT(piezoelectric) element applying femtosecond pulse laser is provided to enhance the cutting speed since the temtosecond pulse laser is used for a bendable or expandable PZT element, and the modified area of a target is separated along a cutting line quickly. CONSTITUTION: A processed-surface cutting method using a PZT(piezoelectric) element applying femtosecond pulse laser is as follows. A transparent material, a wafer, and a target(101) like a substrate are attached to an expanding tape(103), and the expanding tape is attached onto a bendable PZT element(102). The femtosecond pulse laser is irradiated to the cut part of the target for several tens of femtosecond, and modified areas are formed in the cut part of the target. Voltage is supplied to the bendable PZT element, and the middle part of the PZT element is protruded to generate bending stress.
Abstract:
The present invention relates to a transparent material processing method and a dicing apparatus for processing a transparent material. The transparent material processing method comprises: a step for forming a focusing point by generating and focusing a ultrafast pulse laser, where a peak wavelength corresponds to a pass band of a transparent material, having a pulse width of 10 fs-10 ps from a laser source; a step for delivering energy to an inside of the transparent material by the focusing pulse laser beam by locating a focusing point of the pulse laser beam in order to locate the focusing point in an inside of both surfaces of the transparent material; and a step for generating and propagating a crack to include that the crack on the transparent material is separated from a movement line of the focusing point at regular intervals and propagated by relatively moving the focusing point or the transparent material along a cutting line of a desired shape.
Abstract:
본 발명은 펨토초 레이저에 의해 나노 보이드 어레이 형성을 통한 절단방법에 관한 것으로, 극초단 펨토초 레이저를 개구수(NA)가 0.7 내지 0.95를 가지는 집광렌즈로 집광시켜 투명재료 또는 기판에 조사함으로써, 비선형 커렌즈(Kerr Lens) 현상에 의한 자체 집속(Self Focusing)과 다중광자이온화(Multi-Photon Ionization) 현상에 의한 플라즈마 디포커싱(Plasma Defocusing) 되도록 하여 기판에 나노 보이드 어레이(Nano-Void Array)를 형성한 후 절단하는 것을 특징으로 한다. 이와 같이 구성되는 본 발명은 나노 보이드 어레이를 형성하여 투명재료의 절단 및 가공 효율을 향상시킬 수 있고, 기존에 불가능한 얇은 투명재료의 효율적인 절단 및 가공을 가능한 이점이 있다.
Abstract:
PURPOSE: A fiber laser systems with the repetition rate of 0.1-30 mhz and specimen manufacturing using the same are provided to implement a stable manual mode lock by simultaneously applying an NPE(Nonlinear Polarization Rotation) phenomenon and a saturable absorber. CONSTITUTION: Pump light generated from a laser diode(301) enters a resonator through a wavelength splitter(300). The pump light is absorbed in a ytterbium additional optical fiber(303). The light letting the resonator resonating passes through a wave plate(304) and a light shielding unit(305). One polarizing component is amplified in the ytterbium additional optical fiber. The amplified polarizing component is outputted through an opto-coupler(302). The outputted light reduces a repetition rate through a pulse extractor(306).
Abstract:
PURPOSE: A cutting device and method using ultra-short pulse laser and water freezing are provided to prevent the residue on a work piece by forming a void on the underside of the work piece using ultra-short pulse laser and reduce cut scraps by using stress generated from the freezing of water in the void. CONSTITUTION: A cutting device using ultra-short pulse laser and water freezing comprises a laser source, a base plate(104), a vapor supply unit(108), and a cooling gas supply unit(109). The laser source condenses a laser(100) through a condensing lens(110) to a work piece(102) and outputs ultra-short pulse laser to form a void(103) in the work piece. The base plate comprises a vapor supply part(106) and a cooling gas supply part(107) on both sides thereof. The cooling gas supply unit supplies cooling gas to the cooling gas supply part. A crack is generated in the work piece by the laser of the laser source. Vapor and cooling gas are successively supplied and the work piece is cut by expansion resulting from the freezing of vapor.
Abstract:
PURPOSE: A cutting device through the combination of characteristics of a reformed surface according to depth is provided to maintain high surface precision and maximize machining accuracy by freely regulating the size of a reformed area through pulse width control. CONSTITUTION: A cutting device through the combination of characteristics of a reformed surface according to depth comprises a laser source(100), a plurality of mirrors(200-203), a first condensing lens(400), a dispersion control unit(300), and a second condensing lens(401). The laser source outputs pulse laser. The plurality of mirrors split a laser beam output from the laser source or determine the directivity of the laser beam. The first condensing lens condenses one of the laser beams split through the mirrors to irradiate a work piece(500). The dispersion control unit controls the dispersion of another one of the laser beams. The second condensing lens condenses the laser beam dispersed by the dispersion control unit to irradiate the work piece.
Abstract:
A white-light scanning interferometer for large-sized three-dimensional profile measurement using macro lenses and a method for measuring a three-dimensional profile are provided to change the most suitable visual region for the size of an object to be measured by using the zoom function of a macro lens. A light source(100) radiates white light. A light splitter(110) divides the white light into measuring light and reference light in order to irradiate the white light on a measuring surface and a reference surface. A macro lens(140) receives an interference pattern by using the reference light reflected from the measuring surface and the reference surface. An image acquisition unit(150) acquires the received interference pattern of the macro lens. The shape of the measuring surface is measured by using the interference pattern of the image acquisition unit.