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公开(公告)号:US20180155575A1
公开(公告)日:2018-06-07
申请号:US15576407
申请日:2016-06-01
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor: Cyrus A. Anderson , Thomas Q. Chastek , Xiao Gao , Kathleen S. Shafer , Sheng Ye
IPC: C09J5/00 , B32B17/10 , B32B7/12 , B32B37/12 , C09J163/00 , C09J131/04 , C09J167/00
CPC classification number: C09J5/00 , B32B7/12 , B32B17/10 , B32B17/10293 , B32B37/12 , B32B2037/1253 , B32B2605/006 , C08L71/00 , C09J131/04 , C09J163/00 , C09J167/00 , C09J2205/31 , C09J2400/143 , C09J2431/00 , C09J2463/00 , C09J2467/00
Abstract: Methods of bonding hardware to glass and other substrates are provided that do not require use of primers, mixing, fixturing, or autoclaving. These methods include the steps of disposing an adhesive layer on a bonding surface of either the hardware or the vehicular glass, the adhesive layer comprising a curable composition that is dimensionally stable at ambient conditions; either before or after disposing the adhesive layer on the bonding surface, irradiating the adhesive layer with ultraviolet radiation to initiate curing of the curable composition; placing the hardware so as to be bonded to the vehicular glass by the adhesive layer; and allowing the adhesive layer to cure.
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公开(公告)号:US11370944B2
公开(公告)日:2022-06-28
申请号:US16871543
申请日:2020-05-11
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor: Kathleen S. Shafer , Thomas Q. Chastek , Cyrus A. Anderson
IPC: C08F2/46 , C08F2/50 , C08G61/04 , C09J133/14 , C08L33/14 , C08L63/00 , C09J7/40 , C08F2/48 , C08L71/00 , C09J163/00 , C09J131/04 , C09J137/00
Abstract: An adhesive composition is described comprising a tetrahydrofurfuryl (meth)acrylate copolymer; an epoxy resin; a polyether polyol; and a hydroxy-functional film-forming polymer. The adhesive may be used in structural and semi-structural bonding applications.
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公开(公告)号:US11034866B2
公开(公告)日:2021-06-15
申请号:US16347472
申请日:2017-11-21
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor: Cyrus A. Anderson , Kathleen S. Shafer , Thomas Q. Chastek , Jonathan E. Janoski , Michael C. Martin , Anthony F. Schultz , Carla S. Thomas , Peter O. Rekow
IPC: C09J7/38 , C09J7/26 , B32B5/18 , B32B7/12 , C09J5/00 , C09J133/06 , C08J9/36 , C09J133/08 , C09J139/04 , C09J133/14 , C09J163/00
Abstract: An adhesive article is described comprising a foamed adhesive layer and a non-foamed adhesive layer. The adhesive of each adhesive layer comprises a tetrahydrofurfuryl (meth)acrylate copolymer; an epoxy resin; a polyether polyol; and optionally a hydroxy-functional film-forming polymer. The adhesive may be used in structural and semi-structural bonding applications and is designed to fail cohesively.
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公开(公告)号:US20190276711A1
公开(公告)日:2019-09-12
申请号:US16347472
申请日:2017-11-21
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor: Cyrus A. Anderson , Kathleen S. Shafer , Thomas Q. Chastek , Jonathan E. Janoski , Michael C. Martin , Anthony F. Schultz , Carla S. Thomas , Peter O. Rekow
Abstract: An adhesive article is described comprising a foamed adhesive layer and a non-foamed adhesive layer. The adhesive of each adhesive layer comprises a tetrahydrofurfuryl (meth)acrylate copolymer; an epoxy resin; a polyether polyol; and optionally a hydroxy-functional film-forming polymer. The adhesive may be used in structural and semi-structural bonding applications and is designed to fail cohesively.
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公开(公告)号:US20180371298A1
公开(公告)日:2018-12-27
申请号:US16062295
申请日:2016-12-28
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor: Matthew J. Schmid , Cyrus A. Anderson , Kathleen S. Shafer , Xiao Gao , James M. Nelson
IPC: C09J163/00 , C09J7/38
Abstract: Provided are methods and associated compositions directed to a structural bonding adhesive. The structural bonding adhesive is made by mixing a curable composition comprising a mixture of a first curable resin and a second curable resin to provide an uncured adhesive. The uncured adhesive is irradiated by a first actinic light source to polymerize the first curable resin without polymerizing the second curable resin to provide a partially cured adhesive. The partially cured adhesive is a pressure-sensitive adhesive that displays cold flow creep recovery under ambient conditions and is capable of being fully cured by irradiating the partially cured adhesive using a second actinic light source that is different from the first actinic light source to polymerize the second curable resin.
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公开(公告)号:US09941441B2
公开(公告)日:2018-04-10
申请号:US15512942
申请日:2015-09-23
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor: Cyrus A. Anderson , Christopher J. Duda , Scott R. Meyer
CPC classification number: H01L31/18 , C09J5/06 , C09J2201/61 , C09J2203/322 , C09J2433/00 , C09J2463/00 , H01L31/04
Abstract: The present disclosure relates to structural bonding compositions and attachment brackets, and their use in photovoltaic solar modules. Another aspect of the present disclosure relates to methods of affixing an attachment bracket to a solar module during the lamination step used to manufacture the module.
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公开(公告)号:US11945944B2
公开(公告)日:2024-04-02
申请号:US16467147
申请日:2017-12-04
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor: Kathleen S. Shafer , Rebecca A. Putans , Ernest L. Thurber , Cyrus A. Anderson , Corinne E. Lipscomb , Thomas J. Nelson , Gregory P. Sorenson , Chainika Jangu
IPC: C08L33/14 , B24D3/28 , B24D11/00 , B24D11/02 , C08F220/18 , C08F220/28 , C08F220/32 , C08K3/013 , C08K3/08 , C08K3/14 , C08K3/26 , C08K3/38 , C08K5/00 , C08K5/132 , C08K5/36 , C08L31/04 , C08L63/04 , C08L71/02
CPC classification number: C08L33/14 , B24D3/28 , B24D11/001 , B24D11/02 , C08F220/18 , C08F220/28 , C08K3/013 , C08K3/14 , C08K3/26 , C08K3/38 , C08K5/0025 , C08K5/132 , C08K5/36 , C08L31/04 , C08L63/04 , C08L71/02 , C08F220/1804 , C08F220/1807 , C08F220/281 , C08F220/285 , C08F220/325 , C08K2003/0812 , C08K2003/265 , C08K2003/385 , C08L2312/06
Abstract: The disclosure relates to a curable composition comprising: a polymerizable epoxy-acrylate resin composition having a complex viscosity at 25° C. and 1 Hz frequency of at least about 4500 Pa-s and a probe tack peak force of at least about 300 kPa; and abrasive particles partially or fully embedded in the polymerizable epoxy-acrylate resin composition. The disclosure also relates to cured compositions formed from such curable compositions, wherein the abrasive particles are partially or fully embedded in the cured composition. In addition, the disclosure relates to abrasive articles made from such cured compositions as well as methods for making abrasive articles.
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公开(公告)号:US20200270492A1
公开(公告)日:2020-08-27
申请号:US16871543
申请日:2020-05-11
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor: Kathleen S. Shafer , Thomas Q. Chastek , Cyrus A. Anderson
IPC: C09J133/14 , C08F220/36 , C08L33/14 , C08L63/00 , C09J7/40 , C08F2/48 , C08L71/00 , C09J163/00
Abstract: An adhesive composition is described comprising a tetrahydrofurfuryl (meth)acrylate copolymer; an epoxy resin; a polyether polyol; and a hydroxy-functional film-forming polymer. The adhesive may be used in structural and semi-structural bonding applications.
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公开(公告)号:US10676655B2
公开(公告)日:2020-06-09
申请号:US15574877
申请日:2016-05-13
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor: Kathleen S. Shafer , Thomas Q. Chastek , Cyrus A. Anderson
IPC: C09J133/14 , C08F220/36 , C08L33/14 , C08L63/00 , C09J7/40 , C08F2/48 , C08L71/00 , C09J163/00 , C09J131/04 , C09J137/00
Abstract: An adhesive composition is described comprising a tetrahydrofurfuryl (meth)acrylate copolymer; an epoxy resin; a polyether polyol; and a hydroxy-functional film-forming polymer. The adhesive may be used in structural and semi-structural bonding applications.
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公开(公告)号:US20180127625A1
公开(公告)日:2018-05-10
申请号:US15574877
申请日:2016-05-13
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor: Kathleen S. Shafer , Thomas Q. Chastek , Cyrus A. Anderson
IPC: C09J133/14 , C09J163/00 , C09J7/40 , C08L33/14 , C08L63/00 , C08L71/00 , C08F2/48 , C08F220/36
Abstract: An adhesive composition is described comprising a tetrahydrofurfuryl (meth)acrylate copolymer; an epoxy resin; a polyether polyol; and a hydroxy-functional film-forming polymer. The adhesive may be used in structural and semi-structural bonding applications.
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