DUAL STAGE STRUCTURAL BONDING ADHESIVE
    15.
    发明申请

    公开(公告)号:US20180371298A1

    公开(公告)日:2018-12-27

    申请号:US16062295

    申请日:2016-12-28

    Abstract: Provided are methods and associated compositions directed to a structural bonding adhesive. The structural bonding adhesive is made by mixing a curable composition comprising a mixture of a first curable resin and a second curable resin to provide an uncured adhesive. The uncured adhesive is irradiated by a first actinic light source to polymerize the first curable resin without polymerizing the second curable resin to provide a partially cured adhesive. The partially cured adhesive is a pressure-sensitive adhesive that displays cold flow creep recovery under ambient conditions and is capable of being fully cured by irradiating the partially cured adhesive using a second actinic light source that is different from the first actinic light source to polymerize the second curable resin.

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