Multilayer Pressure-Sensitive Adhesive Assembly

    公开(公告)号:US20210147720A1

    公开(公告)日:2021-05-20

    申请号:US16969058

    申请日:2019-05-10

    Abstract: Provided is an assembly including a first polymeric layer of a first pressure sensitive adhesive (PSA) composition and a second polymeric foam layer of a second PSA composition. The first PSA composition contains at least 60 parts by weight of (meth)acrylate copolymer containing C1-C32 (meth)acrylic acid ester monomer units; 0.1-15 parts by weight of C2-C8 hydroxyalkyl (meth)acrylic acid ester monomer units, based on 100 parts by weight of the total monomers of the (meth)acrylate copolymer; and up to 40 parts by weight of a (meth)acrylate copolymer having a weight average molecular weight above 20,000 Daltons and including (meth)acrylic acid ester monomer units. The second PSA composition contains a first (meth)acrylate copolymer having 0.1-12 wt % of (meth)acrylic acid monomer units, based on the weight of the first (meth)acrylate copolymer; and a second (meth)acrylate copolymer having 15-40 wt % of (meth)acrylic acid monomer units, based on the weight of the second (meth)acrylate copolymer.

    PRESSURE-SENSITIVE ADHESIVE COMPOSITIONS

    公开(公告)号:US20210102099A1

    公开(公告)日:2021-04-08

    申请号:US16499967

    申请日:2018-04-10

    Abstract: The present disclosure relates to a pressure sensitive adhesive composition, comprising: a) a first (meth)acrylate copolymer comprising from 0.1 to 12 wt % of (meth)acrylic acid monomer units, based on the weight of the first (meth)acrylate copolymer; and b) a second (meth)acrylate copolymer comprising from 15 to 40 wt % of (meth)acrylic acid monomer units, based on the weight of the second (meth)acrylate copolymer. According to another aspect, the present disclosure is directed to a multilayer pressure sensitive adhesive assembly comprising a pressure sensitive adhesive composition as described above in the form of a first pressure sensitive adhesive polymeric layer, and which further comprises a second pressure sensitive adhesive layer adjacent to the first pressure sensitive adhesive polymeric layer. In another aspect, the present disclosure is directed to a method of manufacturing a pressure sensitive adhesive composition as described above and to uses thereof.

    Method of Manufacturing an Electronic Control Device

    公开(公告)号:US20210040351A1

    公开(公告)日:2021-02-11

    申请号:US16969118

    申请日:2019-05-13

    Abstract: Provided is a method of manufacturing an electronic control device. The method includes: providing a housing body with a first part and a second part; providing a multilayer assembly having a first pressure sensitive adhesive polymeric layer of a first pressure sensitive adhesive composition adjacent to a second pressure sensitive adhesive polymeric foam layer of a second pressure sensitive adhesive composition; wherein the second pressure sensitive adhesive composition includes: a polymer base material selected from the group consisting of polyacrylates, polyurethanes, polyolefins, polyamines, polyamides, polyesters, polyethers, polyisobutylene, polystyrenes, polyvinyls, polyvinylpyrrolidone, natural rubbers, synthetic rubbers, and any combinations, copolymers or mixtures thereof; adhering the first pressure sensitive adhesive polymeric layer to the first part; and adhering the second part to the second pressure sensitive adhesive polymeric foam layer.

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