公开(公告)号：DE60022223T2

公开(公告)日：2006-06-14

申请号：DE60022223

申请日：2000-12-01

Applicant: FRYS METALS INC DBA ALPHA METALS INC

Inventor： ARORA SANYOGITA ,  SCHNEIDER F ,  TELLEFSEN A

IPC: B23K1/00 ,  B23K35/363 ,  B23K3/00 ,  B23K35/36 ,  B23K101/42 ,  H05K3/28 ,  H05K3/34

Abstract: A soldering flux includes a resin in an aqueous composition. The flux can also include an activating agent and a surface-active agent that promotes surface wetting. The flux can be used to coat circuits and a printed circuit board. The resin can be non-acidic and/or in an emulsified form.

公开(公告)号：MXPA02010148A

公开(公告)日：2003-10-15

申请号：MXPA02010148

申请日：2001-04-13

Applicant: FRYS METALS INC DBA ALPHA METALS INC

Inventor： ARORA SANYOGITA

IPC: B23K1/00 ,  B23K3/00 ,  B23K35/36 ,  B23K35/363 ,  B23K35/00

公开(公告)号：AU5175601A

公开(公告)日：2001-11-26

申请号：AU5175601

申请日：2001-04-13

Applicant: FRYS METALS INC DBA ALPHA METALS INC

Inventor： ARORA SANYOGITA ,  MO BIN

IPC: B23K1/00 ,  B23K3/00 ,  B23K35/36 ,  B23K35/363 ,  B23K35/00

Abstract: A soldering flux includes a solvent, an activator in the solvent, and cationic and nonionic surfactants. The soldering flux can be applied to a substrate, such as a printed circuit board before solder is applied.

公开(公告)号：BRPI0017633B1

公开(公告)日：2016-10-04

申请号：BR0017633

申请日：2000-12-01

Applicant: FRY S METALS INC D B A ALPHA METALS INC

Inventor： SCHNEIDER ALVIN F ,  TELLEFSEN KAREN A ,  ARORA SANYOGITA

IPC: B23K1/00 ,  B23K35/363 ,  B23K3/00 ,  B23K35/36 ,  B23K101/42 ,  H05K3/28 ,  H05K3/34

公开(公告)号：CA2405957C

公开(公告)日：2009-01-06

申请号：CA2405957

申请日：2001-04-13

Applicant: FRYS METALS INC DBA ALPHA METALS INC

Inventor： ARORA SANYOGITA ,  MO BIN

IPC: B23K1/00 ,  B23K35/363 ,  B23K3/00 ,  B23K35/36 ,  C11D1/835

Abstract: A soldering flux includes a solvent, an activator in the solvent, and cation ic and nonionic surfactants. The soldering flux can be applied to a substrate, such as a printed circuit board before solder is applied.

公开(公告)号：BR0016118A

公开(公告)日：2002-11-26

申请号：BR0016118

申请日：2000-12-01

Applicant: FRYS METALS INC DBA ALPHA METALS INC

Inventor： ARORA SANYOGITA ,  SCHNEIDER ALVIN E ,  TELLEFSEN KAREN A

IPC: B23K1/00 ,  B23K3/00 ,  B23K35/36 ,  B23K35/363 ,  B23K101/42 ,  H05K3/28 ,  H05K3/34

Abstract: A soldering flux includes a resin in an aqueous composition. The flux can also include an activating agent and a surface-active agent that promotes surface wetting. The flux can be used to coat circuits and a printed circuit board. The resin can be non-acidic and/or in an emulsified form.

公开(公告)号：EP3068576A4

公开(公告)日：2017-07-19

申请号：EP13897342

申请日：2013-11-12

Applicant: ALPHA METALS

Inventor： PUJARI NARAHARI ,  ARORA SANYOGITA ,  SARKAR SIULI ,  LIFTON ANNA ,  RAUT RAHUL ,  SINGH BAWA

IPC: B23K31/02 ,  B23K35/36

CPC classification number: H05K3/3489 ,  B23K35/3612 ,  B23K35/3613 ,  B23K35/362 ,  H05K3/282 ,  H05K3/3478 ,  H05K2201/0133 ,  H05K2203/0514