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公开(公告)号：MX2016002429A
公开(公告)日：2016-06-24
申请号：MX2016002429
申请日：2014-08-29
Applicant: ALPHA METALS
Inventor： SINGH BAWA , PANDHER RANJIT , RAUT RAHUL , SANYOGITA ARORA , BHATKAL RAVINDRA , MO BIN
IPC: B23K35/26 , B23K35/02 , B23K35/36 , B23K35/362
Abstract: Un fundente que comprende una o más aminas.
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公开(公告)号：CA2842762A1
公开(公告)日：2013-02-07
申请号：CA2842762
申请日：2012-08-02
Applicant: ALPHA METALS
Inventor： DE AVILA RIBAS MORGANA , LODGE DOMINIC , PANDHER RANJIT , SINGH BAWA , BHATKAL RAVINDRA M , RAUT RAHUL , SARKAR SIULI , CHATTOPADHYAY KAMANIO , NANDI PROLOY
Abstract: A solder composition comprising a blend of a first powder component and a second powder component, wherein the first powder component is a first solder alloy and the second powder component is a second solder alloy or a metal.
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公开(公告)号：IN939CHN2014A
公开(公告)日：2015-04-10
申请号：IN939CHN2014
申请日：2014-02-05
Applicant: ALPHA METALS
Inventor： DE AVILA RIBAS MORGANA , LODGE DOMINIC , PANDHER RANJIT , SINGH BAWA , BHATKAL RAVINDRA M , RAUT RAHUL , SARKAR SIULI , CHATTOPADHYAY KAMANIO , NANDI PROLOY
Abstract: A solder composition comprising a blend of a first powder component and a second powder component wherein the first powder component is a first solder alloy and the second powder component is a second solder alloy or a metal.
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公开(公告)号：MX2014001204A
公开(公告)日：2014-08-22
申请号：MX2014001204
申请日：2012-08-02
Applicant: ALPHA METALS
Inventor： RIBAS MORGANA DE AVILA , LODGE DOMINIC , PANDHER RANJIT , SINGH BAWA , BHATKAL RAVINDRA M , RAUT RAHUL , CHATTOPADHYAY KAMANIO , NANDI PROLOY , SARKAR SIULI
Abstract: Una composición de soldadura que comprende una mezcla de un primer componente en polvo y un segundo componente en polvo, en donde el primer componente en polvo es una primera aleación de soldadura y el segundo componente en polvo es una segunda aleación de soldadura o un metal.
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公开(公告)号：MX392423B
公开(公告)日：2025-03-24
申请号：MX2016008650
申请日：2016-06-29
Applicant: ALPHA METALS
Inventor： DE AVILA RIBAS MORGANA , RAUT RAHUL , VENKATAGIRIYAPPA RAMAKRISHNA HOSUR , YONG SHU TAI , SARKAR SIULI , CUCU TRAIAN CORNEL
IPC: B23K35/362
Abstract: Formulaciones de fundente termoestables libres de colofonia para mejorar la fiabilidad mecánica de las juntas de soldadura. De acuerdo con uno o más aspectos, una pasta de soldadura como se muestra y describe en el presente documento imparte propiedades de la junta de soldadura mejoradas o potenciadas relativas a al menos uno de drop shock, ciclo térmico, choque térmico, resistencia a la cizalladura, rendimiento de resistencia a la flexión, y/u otros atributos de rendimiento térmico-mecánico.
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Patent Agency Ranking
公开(公告)号：DE112014003568T5
公开(公告)日：2016-04-14
申请号：DE112014003568
申请日：2014-07-31
Applicant: ALPHA METALS
Inventor： MORGANA DE AVILA RIBAS , SARKAR SIULI , VENKATAGIRIYAPPA RAMAKRISHNA HOSUR , MUKHERJEE SUTAPA , SIDDAPPA HARISH HANCHINA , SINGH BAWA , RAUT RAHUL
IPC: H01L21/48
Abstract: Doppelseitige Verstärkungs-(DSR)Materialien und Verfahren zur Halbleiterherstellung. Die DSR-Materialien weisen die Eigenschaften herkömmlicher Unterfüllmaterialien mit verbesserter Stabilität bei Raumtemperatur auf.
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公开(公告)号：SG11201600866TA
公开(公告)日：2016-03-30
申请号：SG11201600866T
申请日：2014-08-29
Applicant: ALPHA METALS
Inventor： PANDHER RANJIT , SINGH BAWA , RAUT RAHUL , SANYOGITA ARORA , BHATKAL RAVINDRA , MO BIN
IPC: B23K35/26 , B23K35/02 , B23K35/36 , B23K35/362
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公开(公告)号：SG11201502567TA
公开(公告)日：2015-05-28
申请号：SG11201502567T
申请日：2013-10-29
Applicant: ALPHA METALS
Inventor： GHOSAL SHAMIK , PANDHER RANJIT , KHASELEV OSCAR , BHATKAL RAVI , RAUT RAHUL , SINGH BAWA , RIBAS MORGANA , SARKAR SIULI , MUKHERJEE SUTAPA , KUMAR SATHISH , CHANDRAN REMYA , VISHWANATH PAVAN , PACHAMUTHU ASHOK , BOUREGHDA MONNIR , DESAI NITIN , LIFTON ANNA , CHAKI NIRMALYA KUMAR
Abstract: A sintering powder comprising:a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent.
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公开(公告)号：EP3068576A4
公开(公告)日：2017-07-19
申请号：EP13897342
申请日：2013-11-12
Applicant: ALPHA METALS
Inventor： PUJARI NARAHARI , ARORA SANYOGITA , SARKAR SIULI , LIFTON ANNA , RAUT RAHUL , SINGH BAWA
CPC classification number: H05K3/3489 , B23K35/3612 , B23K35/3613 , B23K35/362 , H05K3/282 , H05K3/3478 , H05K2201/0133 , H05K2203/0514
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10.发明公开
公开(公告)号：EP3089844A4
公开(公告)日：2017-10-04
申请号：EP14877119
申请日：2014-12-31
Applicant: ALPHA METALS
Inventor： RIBAS MORGANA DE AVILA , RAUT RAHUL , CUCU TRAIAN CORNEL , YONG SHU TAI , SARKAR SIULI , VENKATAGIRIYAPPA RAMAKRISHNA HOSUR
CPC classification number: B23K35/362 , B23K35/025 , B23K35/262 , B23K35/3612 , B23K35/3613 , B23K35/3615 , B23K35/3618 , H05K1/09 , H05K1/111 , H05K9/0024 , H05K2201/032
Abstract: Rosin-free thermosetting flux formulations for enhancing the mechanical reliability of solder joints. In accordance with one or more aspects, a solder paste as shown and described herein imparts improved or enhanced solder joint properties relating to at least one of drop shock, thermal cycling, thermal shock, shear strength, flexural strength performance, and/or other thermal-mechanical performance attributes.
Abstract translation: 用于提高焊点机械可靠性的松香型热固性助焊剂配方。 根据一个或一个以上方面，如本文中所展示及描述的焊膏赋予与跌落冲击，热循环，热冲击，剪切强度，弯曲强度性能和/或其它热学中的至少一者有关的改善或增强的焊接接头性质 - 机械性能属性。
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