PARTICLE BEAM APPARATUS, DEFECT REPAIR METHOD, LITHOGRAPHIC EXPOSURE PROCESS AND LITHOGRAPHIC SYSTEM

    公开(公告)号:WO2020057894A1

    公开(公告)日:2020-03-26

    申请号:PCT/EP2019/072489

    申请日:2019-08-22

    Abstract: A particle beam apparatus is described, the apparatus comprising: - an object table configured to hold a semiconductor substrate; - a particle beam source configured to generate a particle beam; - a detector configured to detect a response of the substrate caused by interaction of the particle beam with the substrate and to output a detector signal representative of the response; - a processing unit configured to: receive or determine a location of one or more defect target areas on the substrate; control the particle beam source to inspect the one or more defect target areas; identify one or more defects within the one or more defect target areas, based on the detector signal obtained during the inspection of the one or more defect target areas; control the particle beam source to repair the one or more defects.

    APPARATUS AND METHODS FOR FILTERING MEASUREMENT RADIATION

    公开(公告)号:EP4250010A1

    公开(公告)日:2023-09-27

    申请号:EP22164333.1

    申请日:2022-03-25

    Abstract: An apparatus for measuring a parameter of a structure related to a semiconductor manufacturing process. The apparatus comprises a source assembly configured to provide measurement radiation having one or more first wavelengths for irradiating the structure on a substrate. The apparatus further comprises a filter arranged to receive scattered measurement radiation that has scattered from the structure, wherein the filter is configured to transmit the scattered measurement radiation at the one or more first wavelengths and filter out radiation at one or more second wavelengths. The filter comprises a film with a curvature in at least one direction. The apparatus further comprises a plurality of detectors, located downstream of the filter, configured to detect the filtered scattered radiation configured to measure the parameter of the structure.

    METHOD AND APPARATUS FOR DETERMINING A RADIATION BEAM INTENSITY PROFILE

    公开(公告)号:EP3629086A1

    公开(公告)日:2020-04-01

    申请号:EP18196626.8

    申请日:2018-09-25

    Abstract: Methods and apparatus for determining an intensity profile of a radiation beam. The method comprises providing a diffraction structure, causing relative movement of the diffraction structure relative to the radiation beam from a first position wherein the radiation beam does not irradiate the diffraction structure to a second position wherein the radiation beam irradiates the diffraction structure, measuring, with a radiation detector, diffracted radiation signals produced from diffraction of the radiation beam by the diffraction structure as the diffraction structure transitions from the first position to the second position or vice versa, and determining the intensity profile of the radiation beam based on the measured diffracted radiation signals.

    DETERMINING AN EDGE ROUGHNESS PARAMETER OF A PERIODIC STRUCTURE

    公开(公告)号:EP3435161A1

    公开(公告)日:2019-01-30

    申请号:EP17182817.1

    申请日:2017-07-24

    Abstract: In a method of determining an edge roughness parameter of a periodic structure, the periodic structure is illuminated (602) in an inspection apparatus. The illumination radiation beam may comprise radiation with a wavelength in the range 1 nm to 100 nm. A scattering signal (604) is obtained from a radiation beam scattered from the periodic structure. The scattering signal comprises a scattering intensity signal that is obtained by detecting an image of a far-field diffraction pattern in the inspection apparatus. An edge roughness parameter, such as Lined Edge Roughness and/or Line Width Roughness is determined (606) based on a distribution of the scattering intensity signal around a non-specular diffraction order. This may be done for example using a peak broadening model.

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