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公开(公告)号:US12044980B2
公开(公告)日:2024-07-23
申请号:US17296316
申请日:2019-10-30
Applicant: ASML NETHERLANDS B.V.
Inventor: Abraham Slachter , Wim Tjibbo Tel , Daan Maurits Slotboom , Vadim Yourievich Timoshkov , Koen Wilhelmus Cornelis Adrianus Van Der Straten , Boris Menchtchikov , Simon Philip Spencer Hastings , Cyrus Emil Tabery , Maxime Philippe Frederic Genin , Youping Zhang , Yi Zou , Chenxi Lin , Yana Cheng
IPC: G05B19/418 , G03F7/00
CPC classification number: G03F7/70625 , G03F7/70616 , G05B19/4188 , G03F7/70525
Abstract: A method for analyzing a process, the method including obtaining a multi-dimensional probability density function representing an expected distribution of values for a plurality of process parameters; obtaining a performance function relating values of the process parameters to a performance metric of the process; and using the performance function to map the probability density function to a performance probability function having the process parameters as arguments.
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公开(公告)号:US20220277116A1
公开(公告)日:2022-09-01
申请号:US17744091
申请日:2022-05-13
Applicant: ASML NETHERLANDS B.V.
Inventor: Jing SU , Yi Zou , Chenxi Lin , Stefan Hunsche , Marinus Jochemsen , Yen-Wen Lu , Lin Lee Cheong
Abstract: Methods of identifying a hot spot from a design layout or of predicting whether a pattern in a design layout is defective, using a machine learning model. An example method disclosed herein includes obtaining sets of one or more characteristics of performance of hot spots, respectively, under a plurality of process conditions, respectively, in a device manufacturing process; determining, for each of the process conditions, for each of the hot spots, based on the one or more characteristics under that process condition, whether that hot spot is defective; obtaining a characteristic of each of the process conditions; obtaining a characteristic of each of the hot spots; and training a machine learning model using a training set including the characteristic of one of the process conditions, the characteristic of one of the hot spots, and whether that hot spot is defective under that process condition.
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公开(公告)号:US11183434B2
公开(公告)日:2021-11-23
申请号:US16466665
申请日:2017-12-13
Applicant: ASML NETHERLANDS B.V.
Inventor: Yu Cao , Yi Zou , Chenxi Lin
IPC: H01L21/66 , G03F7/20 , G05B19/418 , G06T7/00
Abstract: A method where deviations of a characteristic of an image simulated by two different process models or deviations of the characteristic simulated by a process model and measured by a metrology tool, are used for various purposes such as to reduce the calibration time, improve the accuracy of the model, and improve the overall manufacturing process.
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