METHODS FOR GENERATING CHARACTERISTIC PATTERN AND TRAINING MACHINE LEARNING MODEL

    公开(公告)号:US20220335333A1

    公开(公告)日:2022-10-20

    申请号:US17641159

    申请日:2020-08-21

    Abstract: Methods of generating a characteristic pattern for a patterning process and training a machine learning model. A method of training a machine learning model configured to generate a characteristic pattern for a mask pattern includes obtaining (i) a reference characteristic pattern that meets a satisfactory threshold related to manufacturing of the mask pattern, and (ii) a continuous transmission mask (CTM) for use in generating the mask pattern; and training, based on the reference characteristic pattern and the CTM, the machine learning model such that a first metric between the characteristic pattern and the CTM, and a second metric between the characteristic pattern and the reference characteristic pattern is reduced.

    OVERLAY METROLOGY BASED ON TEMPLATE MATCHING WITH ADAPTIVE WEIGHTING

    公开(公告)号:US20250044710A1

    公开(公告)日:2025-02-06

    申请号:US18714547

    申请日:2022-12-13

    Abstract: A method of image template matching for multiple process layers of, for example, semiconductor substrate with an adaptive weight map is described. An image template is provided with a weight map, which is adaptively updated based during template matching based on the position of the image template on the image. A method of template matching a grouped pattern or artifacts in a composed template is described, wherein the pattern comprises deemphasized areas weighted less than the image templates. A method of generating an image template based on a synthetic image is described. The synthetic image can be generated based on process and image modeling. A method of selecting a grouped pattern or artifacts and generating a composed template is described. A method of per layer image template matching is described.

    MODELING METHOD FOR COMPUTATIONAL FINGERPRINTS

    公开(公告)号:US20220291590A1

    公开(公告)日:2022-09-15

    申请号:US17634309

    申请日:2020-07-09

    Abstract: A method for determining a model to predict overlay data associated with a current substrate being patterned. The method involves obtaining (i) a first data set associated with one or more prior layers and/or current layer of the current substrate, (ii) a second data set including overlay metrology data associated with one or more prior substrates, and (iii) de-corrected measured overlay data associated with the current layer of the current substrate; and determining, based on (i) the first data set, (ii) the second data set, and (iii) the de-corrected measured overlay data, values of a set of model parameters associated with the model such that the model predicts overlay data for the current substrate, wherein the values are determined such that a cost function is minimized, the cost function comprising a difference between the predicted data and the de-corrected measured overlay data.

    METHOD FOR TRAINING MACHINE LEARNING MODEL TO DETERMINE OPTICAL PROXIMITY CORRECTION FOR MASK

    公开(公告)号:US20220137503A1

    公开(公告)日:2022-05-05

    申请号:US17429770

    申请日:2020-01-24

    Abstract: Training methods and a mask correction method. One of the methods is for training a machine learning model configured to predict a post optical proximity correction (OPC) image for a mask. The method involves obtaining (i) a pre-OPC image associated with a design layout to be printed on a substrate, (ii) an image of one or more assist features for the mask associated with the design layout, and (iii) a reference post-OPC image of the design layout; and training the machine learning model using the pre-OPC image and the image of the one or more assist features as input such that a difference between the reference image and a predicted post-OPC image of the machine learning model is reduced.

    METHOD FOR DETERMINING CURVILINEAR PATTERNS FOR PATTERNING DEVICE

    公开(公告)号:US20210048753A1

    公开(公告)日:2021-02-18

    申请号:US16976492

    申请日:2019-02-28

    Abstract: A method to determine a curvilinear pattern of a patterning device that includes obtaining (i) an initial image of the patterning device corresponding to a target pattern to be printed on a substrate subjected to a patterning process, and (ii) a process model configured to predict a pattern on the substrate from the initial image, generating, by a hardware computer system, an enhanced image from the initial image, generating, by the hardware computer system, a level set image using the enhanced image, and iteratively determining, by the hardware computer system, a curvilinear pattern for the patterning device based on the level set image, the process model, and a cost function, where the cost function (e.g., EPE) determines a difference between a predicted pattern and the target pattern, where the difference is iteratively reduced.

    IDENTIFICATION OF HOT SPOTS OR DEFECTS BY MACHINE LEARNING

    公开(公告)号:US20190147127A1

    公开(公告)日:2019-05-16

    申请号:US16300380

    申请日:2017-04-20

    Abstract: Methods of identifying a hot spot from a design layout or of predicting whether a pattern in a design layout is defective, using a machine learning model. An example method disclosed herein includes obtaining sets of one or more characteristics of performance of hot spots, respectively, under a plurality of process conditions, respectively, in a device manufacturing process; determining, for each of the process conditions, for each of the hot spots, based on the one or more characteristics under that process condition, whether that hot spot is defective; obtaining a characteristic of each of the process conditions; obtaining a characteristic of each of the hot spots; and training a machine learning model using a training set including the characteristic of one of the process conditions, the characteristic of one of the hot spots, and whether that hot spot is defective under that process condition.

    IDENTIFICATION OF HOT SPOTS OR DEFECTS BY MACHINE LEARNING

    公开(公告)号:US20220277116A1

    公开(公告)日:2022-09-01

    申请号:US17744091

    申请日:2022-05-13

    Abstract: Methods of identifying a hot spot from a design layout or of predicting whether a pattern in a design layout is defective, using a machine learning model. An example method disclosed herein includes obtaining sets of one or more characteristics of performance of hot spots, respectively, under a plurality of process conditions, respectively, in a device manufacturing process; determining, for each of the process conditions, for each of the hot spots, based on the one or more characteristics under that process condition, whether that hot spot is defective; obtaining a characteristic of each of the process conditions; obtaining a characteristic of each of the hot spots; and training a machine learning model using a training set including the characteristic of one of the process conditions, the characteristic of one of the hot spots, and whether that hot spot is defective under that process condition.

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