公开(公告)号：SG122929A1

公开(公告)日：2006-06-29

申请号：SG200507500

申请日：2005-11-25

Applicant: ASML NETHERLANDS BV

Inventor： BUEL VAN HENRICUS WILHELMUS MA ,  BIJNEN FRANCISCUS GODEFRIDUS C ,  BURGHOORN JACOBUS ,  TOLSMA HOITE PIETER THEODOOR ,  BERGE TEN PETER

公开(公告)号：SG131073A1

公开(公告)日：2007-04-26

申请号：SG2006065080

申请日：2006-09-20

Applicant: ASML NETHERLANDS BV

Inventor： BIJNEN FRANCISCUS GODEFRIDUS C ,  WEENINK WILLEM DIETER

Abstract: Provided are microdevices, e.g. integrated circuits, with contact bumps and processes for making the same. The processes comprise the alignment of the patterned layers on the upper surface of the substrate to alignment marks on the backside of the substrate. The alignment marks on the backside of the substrate are aligned to contact recesses in the backside of the substrate. The microdevices may have contact bumps on two or more sides of the microdevices. Also provided are stacks of microdevices.