Abstract:
PROBLEM TO BE SOLVED: To provide a system and a method that can compensate for temperature during manufacture of a substrate by reducing an alignment error due to thermal expansion on the basis of a plurality of standards by a lithography device for manufacturing a large-sized device. SOLUTION: A pattern 2 of array marks 20 widely distributed on a substrate 1, and arrays 21 and 22 of dots, are projected on the substrate 1 by a beam patterning and projection system 3 with a patterning radiation beam. An operation system 4 places in the substrate and projection system in relative motion, and a detection system 5 detects the array marks individually. The operation system 4 positions the substrate 1 relatively to the projection system 3, projects the patterning radiation beam on a target portion of the substrate 1, and adjusts pattern data based upon the detection result to perform temperature compensation. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide an alignment apparatus for a substrate bonding system. SOLUTION: A primary optical arm 12a configured so that radiation from primary alignment marks 6a and 6b on a primary substrate 6 may be guided to a detector, and a secondary optical arm 12b configured so that radiation from secondary alignment marks 8a and 8b on a secondary substrate 8 may be guided to a detector 28a are arranged. The primary alignment mark has a known position against a functional pattern arranged on the opposite side of the primary substrate, while the secondary alignment mark has a known position against a functional pattern arranged on the opposite side of the secondary substrate. In addition, the substrate bonding system has primary and secondary substrate tables 4 that are configured so that the primary and secondary substrates may be held, and at least one of the substrate tables can move in response to a signal output from the detector. The primary and secondary substrates can be aligned against each other for bonding. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide an improved method of connecting a micro device including, for example, an integrated circuit having connection bumps and its manufacturing method. SOLUTION: The connection bumps are provided on the two opposite sides of the micro device. A laminated product of micro devices is also provided in which grooves extending to a micro structure of a first side are formed on a second side, the grooves are filled with a metal to form the connection bumps, and a first micro device and a second micro device are stacked via the connection bumps. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To accurately measure the position of an alignment mark located at a lower surface of a substrate. SOLUTION: A lithography alignment apparatus includes a radiation source constructed to generate radiation of 1,000 nm or a plurality of wavelengths longer than 1,000 nm; a control system 11 constructed to select one or plural infrared ray wavelengths; and a plurality of non focusing detector 15 constructed such that after the radiation is reflected by an alignment mark, a diffraction grating is provided, at least part of the diffraction grating has different diffraction grating periods to detect the radiation. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a substrate table capable of achieving an improved alignment and a precision positioning. SOLUTION: An optical system including a first window and a second window disposed so as to allow a radiation to penetrate optical arms 10a, 10b is provided on the substrate table. At least two mirrors 12 are provided inside the optical arms 10a, 10b and are disposed so as to allow the radiation penetrating the windows to be reflected. At least two lenses 16, 18 are positioned so as to receive the radiation reflected from the mirrors 12, a first alignment mark WM1 is provided in the first window, and at least two mirrors 12 and at least two lenses 16, 18 are disposed so as to form an image 20a of the first alignment mark in the second window. The second alignment mark WM1 is provided in the second window or in the substrate table at a position adjacent to the second window. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a method and a system for three-dimensional alignment for wafer scale integration. SOLUTION: A board bonding system is provided with first and second board tables to hold first and second boards, and a controller. The first board is equipped with a first device having a first contact pad, and the second board is equipped with a second device having a second contact pad. The wafer bonding system is designed to conduct bonding of the first and second devices so that a circuit can be formed by the first and second devices. First and second board tables ST and STb are respectively provided with a position sensor to measure optical signals generating on alignment markers WM1, WM1', WM2, and WM2', and WM1b, WM1b', WM2b and WM2b' of the first and second boards. Furthermore, they are provided with first and second actuators ACT and ACTb to change the position and the orientation of the respective board tables. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To improve coarse alignment accuracy of a substrate. SOLUTION: In a method for alignment of a substrate, the substrate includes a mark in a scribe lane, and the scribe lane extends along a longitudinal direction as a first direction. The mark has a periodic structure in the first direction. The method includes: providing an illumination beam for scanning the mark in a direction perpendicular to a direction of the mark's periodic structure along a first scan path across the mark; and scanning the spot of the illumination beam along a second scan path across the mark, wherein the second scan path is parallel to the first scan path, and the second scan path is shifted relative to the first scan path over a first shift that corresponds to a fraction of the repeating distance of the periodic structure. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide an alignment mark including a periodic structure formed by mark lines. SOLUTION: The alignment mark is formed in a scribe line on a substrate and the scribe line extends in the scribe line direction. The alignment mark has a first region including a first periodic structure formed by a first mark line extending in the first direction having a first angle α(0° COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide an alignment system employed in lithography equipment. SOLUTION: The lithographic equipment includes an alignment system for aligning a substrate or a reticle. The alignment system includes a radiation source configured to illuminate an alignment mark on the substrate or on the reticle, the alignment mark comprising a maximum length sequence or a multi periodic coarse alignment mark. An alignment signal produced from the alignment mark is detected by a detection system. A processor determines an alignment position of the substrate or the reticle based on the alignment signal. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a substrate table configured so as to support a substrate comprising at least one substrate mark. SOLUTION: The at least one substrate mark has a position that can be measured using an alignment system. The substrate table comprises an optical system having a magnification factor that is not 1 in order to provide the image of the at least one substrate mark to be measured by the alignment system. COPYRIGHT: (C)2006,JPO&NCIPI