LITHOGRAPHY DEVICE AND DEVICE MANUFACTURING METHOD

    公开(公告)号:JP2006186370A

    公开(公告)日:2006-07-13

    申请号:JP2005372597

    申请日:2005-12-26

    Abstract: PROBLEM TO BE SOLVED: To provide a system and a method that can compensate for temperature during manufacture of a substrate by reducing an alignment error due to thermal expansion on the basis of a plurality of standards by a lithography device for manufacturing a large-sized device. SOLUTION: A pattern 2 of array marks 20 widely distributed on a substrate 1, and arrays 21 and 22 of dots, are projected on the substrate 1 by a beam patterning and projection system 3 with a patterning radiation beam. An operation system 4 places in the substrate and projection system in relative motion, and a detection system 5 detects the array marks individually. The operation system 4 positions the substrate 1 relatively to the projection system 3, projects the patterning radiation beam on a target portion of the substrate 1, and adjusts pattern data based upon the detection result to perform temperature compensation. COPYRIGHT: (C)2006,JPO&NCIPI

    Substrate alignment for bonding
    2.
    发明专利
    Substrate alignment for bonding 有权
    用于接合的基板对准

    公开(公告)号:JP2007300099A

    公开(公告)日:2007-11-15

    申请号:JP2007111644

    申请日:2007-04-20

    CPC classification number: H01L21/681 H01L21/67092 Y10T29/49131

    Abstract: PROBLEM TO BE SOLVED: To provide an alignment apparatus for a substrate bonding system. SOLUTION: A primary optical arm 12a configured so that radiation from primary alignment marks 6a and 6b on a primary substrate 6 may be guided to a detector, and a secondary optical arm 12b configured so that radiation from secondary alignment marks 8a and 8b on a secondary substrate 8 may be guided to a detector 28a are arranged. The primary alignment mark has a known position against a functional pattern arranged on the opposite side of the primary substrate, while the secondary alignment mark has a known position against a functional pattern arranged on the opposite side of the secondary substrate. In addition, the substrate bonding system has primary and secondary substrate tables 4 that are configured so that the primary and secondary substrates may be held, and at least one of the substrate tables can move in response to a signal output from the detector. The primary and secondary substrates can be aligned against each other for bonding. COPYRIGHT: (C)2008,JPO&INPIT

    Abstract translation: 要解决的问题:提供一种用于基板接合系统的定位装置。 解决方案:主光学臂12a被配置为使得可以将主基板6上的主对准标记6a和6b的辐射引导到检测器,并且辅助光臂12b被配置为使得来自次对准标记8a和8b的辐射 可以将第二基板8引导到检测器28a。 主对准标记具有相对于布置在主基板的相对侧上的功能图案的已知位置,而第二对准标记具有针对布置在次级基板的相对侧上的功能图案的已知位置。 此外,衬底接合系统具有被配置为使得可以保持初级和次级衬底的初级和次级衬底台4,并且至少一个衬底台可以响应于从检测器输出的信号而移动。 主基板和次基板可以彼此对准以进行接合。 版权所有(C)2008,JPO&INPIT

    Lithographic apparatus and method
    4.
    发明专利
    Lithographic apparatus and method 有权
    LITHOGRAPHIC设备和方法

    公开(公告)号:JP2009147317A

    公开(公告)日:2009-07-02

    申请号:JP2008294810

    申请日:2008-11-18

    CPC classification number: G03F9/7049 G03F7/70633 G03F9/7065 G03F9/7088

    Abstract: PROBLEM TO BE SOLVED: To accurately measure the position of an alignment mark located at a lower surface of a substrate. SOLUTION: A lithography alignment apparatus includes a radiation source constructed to generate radiation of 1,000 nm or a plurality of wavelengths longer than 1,000 nm; a control system 11 constructed to select one or plural infrared ray wavelengths; and a plurality of non focusing detector 15 constructed such that after the radiation is reflected by an alignment mark, a diffraction grating is provided, at least part of the diffraction grating has different diffraction grating periods to detect the radiation. COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 要解决的问题:精确测量位于基板下表面的对准标记的位置。 解决方案:光刻对准装置包括被构造成产生1000nm或多于1000nm长的波长的辐射的辐射源; 构造成选择一个或多个红外线波长的控制系统11; 以及多个非聚焦检测器15,其被构造成使得在辐射被对准标记反射之后,提供衍射光栅,至少部分衍射光栅具有不同的衍射光栅周期以检测辐射。 版权所有(C)2009,JPO&INPIT

    Substrate table, method for measuring position of substrate, and lithography device
    5.
    发明专利
    Substrate table, method for measuring position of substrate, and lithography device 审中-公开
    衬底表,测量衬底位置的方法和光刻设备

    公开(公告)号:JP2007208240A

    公开(公告)日:2007-08-16

    申请号:JP2006346089

    申请日:2006-12-22

    CPC classification number: G03F7/70716 G03F9/7084 G03F9/7088

    Abstract: PROBLEM TO BE SOLVED: To provide a substrate table capable of achieving an improved alignment and a precision positioning. SOLUTION: An optical system including a first window and a second window disposed so as to allow a radiation to penetrate optical arms 10a, 10b is provided on the substrate table. At least two mirrors 12 are provided inside the optical arms 10a, 10b and are disposed so as to allow the radiation penetrating the windows to be reflected. At least two lenses 16, 18 are positioned so as to receive the radiation reflected from the mirrors 12, a first alignment mark WM1 is provided in the first window, and at least two mirrors 12 and at least two lenses 16, 18 are disposed so as to form an image 20a of the first alignment mark in the second window. The second alignment mark WM1 is provided in the second window or in the substrate table at a position adjacent to the second window. COPYRIGHT: (C)2007,JPO&INPIT

    Abstract translation: 要解决的问题:提供能够实现改进的对准和精确定位的基板台。 解决方案:包括第一窗口和第二窗口的光学系统设置在允许辐射穿透光学臂10a,10b的基板台上。 至少两个反射镜12设置在光学臂10a,10b的内部,并被设置成允许穿透窗户的辐射被反射。 至少两个透镜16,18定位成接收从反射镜12反射的辐射,第一对准标记WM1设置在第一窗口中,并且至少两个反射镜12和至少两个透镜16,18被布置成 以便在第二窗口中形成第一对准标记的图像20a。 第二对准标记WM1设置在与第二窗口相邻的位置的第二窗口或衬底台中。 版权所有(C)2007,JPO&INPIT

    Method for coarse wafer alignment in lithographic apparatus
    7.
    发明专利
    Method for coarse wafer alignment in lithographic apparatus 审中-公开
    方法在平面设备中进行粗波对齐

    公开(公告)号:JP2009231837A

    公开(公告)日:2009-10-08

    申请号:JP2009064811

    申请日:2009-03-17

    CPC classification number: G03F9/7069 G03F9/7076 G03F9/7088

    Abstract: PROBLEM TO BE SOLVED: To improve coarse alignment accuracy of a substrate.
    SOLUTION: In a method for alignment of a substrate, the substrate includes a mark in a scribe lane, and the scribe lane extends along a longitudinal direction as a first direction. The mark has a periodic structure in the first direction. The method includes: providing an illumination beam for scanning the mark in a direction perpendicular to a direction of the mark's periodic structure along a first scan path across the mark; and scanning the spot of the illumination beam along a second scan path across the mark, wherein the second scan path is parallel to the first scan path, and the second scan path is shifted relative to the first scan path over a first shift that corresponds to a fraction of the repeating distance of the periodic structure.
    COPYRIGHT: (C)2010,JPO&INPIT

    Abstract translation: 要解决的问题:提高基板的粗略对准精度。 解决方案:在衬底对准的方法中,衬底包括划线中的标记,并且划线通道沿着纵向方向作为第一方向延伸。 标记在第一方向上具有周期性结构。 该方法包括:提供照射光束,用于沿着与标记的周期结构的方向垂直的方向沿着标记的第一扫描路径扫描标记; 并且沿着所述标记沿着第二扫描路径扫描所述照明光束的光点,其中所述第二扫描路径平行于所述第一扫描路径,并且所述第二扫描路径相对于所述第一扫描路径在对应于所述第一扫描路径的第一移位 周期性结构重复距离的一部分。 版权所有(C)2010,JPO&INPIT

    Alignment mark and aligning method of substrate with alignment mark
    8.
    发明专利
    Alignment mark and aligning method of substrate with alignment mark 有权
    具有对准标记的基板的对准标记和对准方法

    公开(公告)号:JP2009188404A

    公开(公告)日:2009-08-20

    申请号:JP2009019370

    申请日:2009-01-30

    CPC classification number: G03B27/32 G03F9/7076

    Abstract: PROBLEM TO BE SOLVED: To provide an alignment mark including a periodic structure formed by mark lines. SOLUTION: The alignment mark is formed in a scribe line on a substrate and the scribe line extends in the scribe line direction. The alignment mark has a first region including a first periodic structure formed by a first mark line extending in the first direction having a first angle α(0° COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 要解决的问题:提供包括由标记线形成的周期性结构的对准标记。 解决方案:对准标记形成在基板上的划线中,划线沿划线方向延伸。 对准标记具有包括第一周期性结构的第一区域,所述第一周期性结构由相对于划线方向具有第一角度α(0°<α<90°)的沿第一方向延伸的第一标记线形成,第二区域包括 由相对于划线方向具有第二角度β(-90°≤β<0°)的第二方向延伸的第二标记线形成的第二周期性结构。 版权所有(C)2009,JPO&INPIT

    Alignment system and alignment marks for use therewith
    9.
    发明专利
    Alignment system and alignment marks for use therewith 有权
    对准系统及其对准标志

    公开(公告)号:JP2009177159A

    公开(公告)日:2009-08-06

    申请号:JP2008326729

    申请日:2008-12-24

    Abstract: PROBLEM TO BE SOLVED: To provide an alignment system employed in lithography equipment. SOLUTION: The lithographic equipment includes an alignment system for aligning a substrate or a reticle. The alignment system includes a radiation source configured to illuminate an alignment mark on the substrate or on the reticle, the alignment mark comprising a maximum length sequence or a multi periodic coarse alignment mark. An alignment signal produced from the alignment mark is detected by a detection system. A processor determines an alignment position of the substrate or the reticle based on the alignment signal. COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 要解决的问题:提供在光刻设备中使用的对准系统。 解决方案:光刻设备包括用于对准衬底或掩模版的对准系统。 对准系统包括被配置为照亮衬底或掩模版上的对准标记的辐射源,对准标记包括最大长度序列或多周期性粗略对准标记。 由对准标记产生的对准信号由检测系统检测。 处理器基于对准信号确定基板或掩模版的对准位置。 版权所有(C)2009,JPO&INPIT

Patent Agency Ranking