公开(公告)号：SG120952A1

公开(公告)日：2006-04-26

申请号：SG200305680

申请日：2003-09-11

Applicant: ASML NETHERLANDS BV

Inventor： BEST KEITH FRANK ,  JOSEPH CONSOLINI ,  FRIZ ALEXANDER ,  BUEL VAN HENRICUS WILHELMUS MA

IPC: G01B11/26 ,  G03F9/00 ,  G01B11/00 ,  H01L21/027 ,  G03F7/20

Abstract: While the alignment beam is focused on a mark on the substrate table, the substrate table is moved substantially perpendicularly to the alignment beam. If the image of the mark moves relative to a reference mark, then the substrate and the alignment beam are not perpendicular. The mark on the substrate table is aligned to a plurality of reference marks. At least two substrate marks are then aligned with a single reference mark. Errors due to the inclination of the alignment beam are eliminated from the expansion and rotation values calculated for the substrate.

公开(公告)号：SG142129A1

公开(公告)日：2008-05-28

申请号：SG2003065968

申请日：2003-11-06

Applicant: ASML NETHERLANDS BV

Inventor： BEST KEITH FRANK ,  CONSOLINI JOSEPH J ,  FRIZ ALEXANDER

IPC: G03F9/00 ,  G03C5/00 ,  G03F7/00 ,  G03F7/20 ,  H01L21/027 ,  H01L23/544

Abstract: Device Manufacturing Method and Device Manufactured Thereby A device manufacturing method comprising the steps of providing a first substrate having first and second surfaces; patterning said first surface of said substrate with at least one reversed alignment marker; providing a protective layer over said alignment marker(s); bonding said first surface of said first substrate to a second substrate; locally etching said first substrate as far as said protective layer to form a trench around the or each reversed alignment marker; and forming at least one patterned layer on said second surface using a lithographic projection apparatus having a front-to- backside alignment system whilst aligning said substrate to the alignment markers revealed in the or each trench.

公开(公告)号：DE602004011458D1

公开(公告)日：2008-03-13

申请号：DE602004011458

申请日：2004-12-15

Applicant: ASML NETHERLANDS BV

Inventor： CONSOLINI JOSEPH J ,  BEST KEITH FRANK ,  FRIZ ALEXANDER

IPC: G01B11/00 ,  G03F9/00 ,  G03F7/20 ,  H01L21/027

Abstract: In a method of measurement according to one embodiment of the invention, a relative position of a temporary alignment mark on one side of a substrate and an alignment mark on the other side of the substrate is determined, and the temporary alignment mark is removed. Before removal of the temporary alignment mark, a relative position of that mark and another mark on the same side of the substrate may be determined. The temporary alignment mark may be formed in, e.g., an oxide layer.

公开(公告)号：SG123589A1

公开(公告)日：2006-07-26

申请号：SG200307556

申请日：2003-12-18

Applicant: ASML NETHERLANDS BV

Inventor： BEST KEITH FRANK ,  CONSOLINI JOSEPH J ,  FRIZ ALEXANDER

IPC: G01B11/00 ,  G03F9/00 ,  H01L21/027

Abstract: A method according to one embodiment of the invention may be used in determining relative positions of developed patterns on a substrate (exposed e.g. using the step mode). Such a method uses reference marks which are located within or even superimposed on device patterns. Also disclosed is a mask of a lithographic projection apparatus including reference marks that may be used in such a method.

公开(公告)号：SG113012A1

公开(公告)日：2005-07-28

申请号：SG200407676

申请日：2004-12-23

Applicant: ASML NETHERLANDS BV

Inventor： CONSOLINI JOSEPH J ,  BEST KEITH FRANK ,  FRIZ ALEXANDER

IPC: G01B11/00 ,  G03F7/20 ,  G03F9/00 ,  H01L21/027

Abstract: In a method of measurement according to one embodiment of the invention, a relative position of a temporary alignment mark on one side of a substrate and an alignment mark on the other side of the substrate is determined, and the temporary alignment mark is removed. Before removal of the temporary alignment mark, a relative position of that mark and another mark on the same side of the substrate may be determined. The temporary alignment mark may be formed in, e.g., an oxide layer.