公开(公告)号：JP2006186369A

公开(公告)日：2006-07-13

申请号：JP2005372013

申请日：2005-12-26

Applicant: ASML NETHERLANDS BV

Inventor： BEST KEITH FRANK ,  CONSOLINI JOSEPH J ,  FRIZ ALEXANDER ,  CHISHOLM RODNEY

IPC: H01L21/027 ,  G03F7/20 ,  H01L21/02 ,  H01L21/68

Abstract: PROBLEM TO BE SOLVED: To provide a wafer which is a semiconductor wafer of which surfaces on both sides can be polished to any degree. SOLUTION: One side of a semiconductor wafer is polished to comparatively higher degree that is suitable for making a fine pattern by a lithography process, and the other side thereof is polished to comparatively low degree, that is appropriate to provide alignment marks WM3 and WM4 effective for arranging wafers in the lithography process. COPYRIGHT: (C)2006,JPO&NCIPI

公开(公告)号：JP2004165670A

公开(公告)日：2004-06-10

申请号：JP2003382650

申请日：2003-11-12

Applicant: Asml Netherlands Bv ,  エイエスエムエル ネザランドズ ベスローテン フエンノートシャップ

Inventor： BEST KEITH FRANK ,  CONSOLINI JOSEPH J ,  FRIZ ALEXANDER

IPC: G03F9/00 ,  G03C5/00 ,  G03F7/00 ,  G03F7/20 ,  H01L21/027

CPC classification number: G03F9/7003

Abstract: PROBLEM TO BE SOLVED: To provide a device manufacturing method which can print on one side of a substrate with improved precision after aligning the substrate by referring to the markers provided on the other side of the substrate without using additional hardware.
SOLUTION: This device manufacturing method comprises a process of preparing a first substrate W having a first surface 10a and a second surface 10b, a process of forming a pattern composed of at least one inversion alignment marking (1-8) on the first surface of the first substrate, a process of providing a protective layer 11 on the alignment marking, a process of joining the first surface of the first substrate to a second substrate CW, a process of locally etching the first substrate to the protective layer to form a trench 17 around the inversion alignment marking, and a process of using a lithographic projection apparatus having a front/rear alignment unit to align the substrates by referring to the alignment marking which is enclosed by the trench and to form at least one patterned layer 15 on the second surface.
COPYRIGHT: (C)2004,JPO

公开(公告)号：JP2006186367A

公开(公告)日：2006-07-13

申请号：JP2005371940

申请日：2005-12-26

Applicant: ASML NETHERLANDS BV

Inventor： BEST KEITH FRANK ,  CONSOLINI JOSEPH J

IPC: H01L21/027 ,  G03F7/20

Abstract: PROBLEM TO BE SOLVED: To provide a technique capable of positioning a 2nd substrate joined to the top surface of a 1st substrate which has a thickness of >100 μm and is preferably pattern-formed and implementing the positioning at reduced cost within a limited time. SOLUTION: A forming method is provided for a junction substrate including a stage of providing the 1st substrate which has a 1st substrate shape and also has at least alignment mark disposed on a 1st surface side. A 2nd substrate is provided having the 2nd substrate shape. The 2nd substrate is directed in a designated direction to the 1st substrate. The 2nd substrate is joined to the 1st surface side of the 1st substrate, so that the 2nd substrate which is joined does not cover at least one 1st alignment mark, thus providing the junction substrate. COPYRIGHT: (C)2006,JPO&NCIPI

公开(公告)号：JP2005191570A

公开(公告)日：2005-07-14

申请号：JP2004371085

申请日：2004-12-22

Applicant: Asml Netherlands Bv ,  エイエスエムエル ネザランドズ ベスローテン フエンノートシャップ

Inventor： CONSOLINI JOSEPH J ,  BEST KEITH FRANK ,  FRIZ ALEXANDER

IPC: G01B11/00 ,  G03F7/20 ,  G03F9/00 ,  H01L21/027

CPC classification number: G03F9/7003 ,  G03F9/7076 ,  G03F9/7084

Abstract: PROBLEM TO BE SOLVED: To provide a measuring method, a method of providing an alignment mark and to provide a device manufacturing method.
SOLUTION: According to the measuring method by one embodiment, the relative mark between the provisional alignment mark of one surface in a substrate and the alignment mark of the other surface thereof is determined, and the provisional alignment mark is removed. Prior to the removal of the provisional alignment mark, the relative position between the provisional alignment mark and the other mark on the same surface of the substrate can be determined. The provisional alignment mark, for example, can be formed on an oxide layer on the substrate.
COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：提供测量方法，提供对准标记的方法并提供器件制造方法。 解决方案：根据一个实施例的测量方法，确定衬底中一个表面的临时对准标记与其另一个表面的对准标记之间的相对标记，并且去除临时对准标记。 在移除临时对准标记之前，可以确定临时对准标记与衬底的相同表面上的另一个标记之间的相对位置。 临时对准标记例如可以形成在基板上的氧化物层上。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：JP2007013192A

公开(公告)日：2007-01-18

申请号：JP2006203910

申请日：2006-06-28

Applicant: Asml Netherlands Bv ,  エーエスエムエル ネザーランズ ビー.ブイ.

Inventor： BEST KEITH FRANK ,  CONSOLINI JOSEPH J ,  FRIZ ALEXANDER ,  CASPER BIJNEN FRANCISCUS GODEF ,  TOLSMA HOITE PIETER THEODOOR ,  BERGE PETER T

IPC: H01L21/027 ,  G03F7/40 ,  G03F9/00

CPC classification number: G03F9/7019 ,  A41D2400/00 ,  G03F7/70633 ,  G03F9/7003 ,  G03F9/7011 ,  G03F9/7084 ,  G03F9/7088

Abstract: PROBLEM TO BE SOLVED: To provide a method for analyzing the behavior of front side marks on a substrate, during a process of manufacturing a device, without the need for etching global alignment marks.
SOLUTION: A plurality of front-side marks are manufactured on the front side of a substrate by a method for manufacturing a device, and these marks are used to locally align the substrate during exposure. After a certain number of processing steps, the positions of the front side marks are measured and compared with respect to their original positions. Next, the change, that is, their behavior, can be analyzed in the measured positions of the front side marks. The original positions and actual positions thereof are defined, with respect to a nominal grid which is defined by using global alignment marks which are positioned at the back side of the substrate. Because the global alignment marks are positioned on the back side, they will not be affected by any processing step.
COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：提供一种用于分析基板上的正面标记的行为的方法，在制造装置的过程中，不需要蚀刻全局对准标记。 解决方案：通过制造装置的方法在基板的正面上制造多个前侧标记，并且这些标记用于在曝光期间局部对准基板。 在一定数量的处理步骤之后，测量前侧标记的位置并相对于其原始位置进行比较。 接下来，可以在前侧标记的测量位置分析变化，即它们的行为。 关于通过使用位于基板的背面的全局对准标记限定的标称网格来定义其原始位置和实际位置。 因为全局对齐标记位于背面，所以它们不受任何处理步骤的影响。 版权所有（C）2007，JPO＆INPIT

公开(公告)号：JP2006054460A

公开(公告)日：2006-02-23

申请号：JP2005230602

申请日：2005-08-09

Applicant: Asml Netherlands Bv ,  エイエスエムエル ネザランドズ ベスローテン フエンノートシャップ

Inventor： BEST KEITH FRANK ,  CONSOLINI JOSEPH J ,  FRIZ ALEXANDER

IPC: H01L21/027 ,  G03F7/20 ,  G03F9/00 ,  H01L21/68

CPC classification number: H02K9/20 ,  H02K55/04 ,  Y02E40/625

Abstract: PROBLEM TO BE SOLVED: To provide a positioning-mark providing method, a substrate-positioning method, a device manufacturing method, a computer program, and a device. SOLUTION: In one embodiment, a first and second set positioning marks are etched on the first surface of a substrate. The first set-positioning mark is located at one or plurality of positions so that these marks appear in the object window of the front/back positioning optical system of a first lithography apparatus, and one or plurality of positions of positioning mark of a second set are selected, based on the location of a positioning device of another lithography apparatus. When the substrate is reversed and the positioning is carried out, using the positioning mark of the first set and the front/back positioning optical system, the positioning marks of third and fourth of sets are etched at the positions directly opposite to the positioning marks of the first and second sets, respectively. COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：提供定位标记提供方法，基板定位方法，装置制造方法，计算机程序和装置。 解决方案：在一个实施例中，在衬底的第一表面上蚀刻第一和第二组定位标记。 第一定位标记位于一个或多个位置，使得这些标记出现在第一光刻设备的前/后定位光学系统的物体窗口中，并且第二组的定位标记的一个或多个位置 基于另一光刻设备的定位装置的位置来选择。 当基板反转并进行定位时，使用第一组和前/后定位光学系统的定位标记，在与定位标记的定位标记直接相对的位置处蚀刻第三组和第四组的定位标记 第一和第二组。 版权所有（C）2006，JPO＆NCIPI

公开(公告)号：JP2004200701A

公开(公告)日：2004-07-15

申请号：JP2003420705

申请日：2003-12-18

Applicant: Asml Netherlands Bv ,  エイエスエムエル ネザランドズ ベスローテン フエンノートシャップ

Inventor： BEST KEITH FRANK ,  CONSOLINI JOSEPH J ,  FRIZ ALEXANDER

IPC: G01B11/00 ,  G03F9/00 ,  H01L21/027

CPC classification number: G03F9/7084 ,  G03F9/7076

Abstract: PROBLEM TO BE SOLVED: To provide an improved method to measure the relative location of a plurality of patterns produced on a substrate.
SOLUTION: This method is to measure the relative position of the patterns produced on the substrate by a step mode, using a reference mark overlaid on the device pattern. In this specification, a mark of the lithography apparatus including the reference mark to use in the method is also disclosed.
COPYRIGHT: (C)2004,JPO&NCIPI

公开(公告)号：JP2009163237A

公开(公告)日：2009-07-23

申请号：JP2008318284

申请日：2008-12-15

Applicant: Asml Netherlands Bv ,  エーエスエムエル ネザーランズ ビー.ブイ.

Inventor： FONG ALEX F ,  VAN BUEL HENRICUS WILHELMUS MA ,  CONSOLINI JOSEPH J ,  VAN DE MOOSDIJK MICHAEL JOSEPH ,  ROBLES MICHAEL CHARLES

IPC: G03F9/00 ,  H01L21/027 ,  H01L21/68

CPC classification number: G03F9/7011 ,  B01J21/04 ,  G03F9/7019 ,  G03F9/7084 ,  G03F9/7088

Abstract: PROBLEM TO BE SOLVED: To project a pattern onto an upper surface of a substrate, the pattern to be aligned to an alignment mark on a lower surface of the substrate, when patterned layers are provided on both faces of a substrate. SOLUTION: A calibration method for a lithographic device aligning top and back surfaces is disclosed, the method comprising: attaching a substrate having a plurality of alignment marks to a carrier with the alignment marks opposing to the carrier; reducing the thickness of the substrate; measuring the position of an alignment mark image formed by an optical system in a substrate table of the apparatus by using an alignment system of the apparatus; projecting a pattern onto the substrate at a position of the pattern determined by the measured position of the alignment mark; measuring the position of an alignment mark provided in the opposite face of the substrate to the projected pattern, the measurement of the position of the alignment mark on the opposite side of the substrate being carried out by an alignment system that induces radiation through the substrate; and comparing the measured positions to determine an overlay error. COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：当在基板的两个表面上设置图案层时，将图案投影到基板的上表面上，该图案将与基板的下表面上的对准标记对准。 公开了一种用于对准顶表面和后表面的光刻设备的校准方法，所述方法包括：将具有多个对准标记的衬底附接到具有与所述载体相对的所述对准标记的载体上; 减小基板的厚度; 通过使用所述装置的对准系统来测量由所述装置的衬底台中的光学系统形成的对准标记图像的位置; 在由对准标记的测量位置确定的图案的位置处将图案投影到基板上; 测量在基板的相对面上设置的对准标记的位置与投射图案的对准标记的位置的测量，通过引导通过基板的辐射的对准系统来执行; 并比较测量位置以确定重叠误差。 版权所有（C）2009，JPO＆INPIT

公开(公告)号：JP2007305989A

公开(公告)日：2007-11-22

申请号：JP2007120775

申请日：2007-05-01

Applicant: Asml Netherlands Bv ,  エーエスエムエル ネザーランズ ビー.ブイ.

Inventor： VAN DER BRINK ENNO ,  VAN BUEL HENRICUS WILHELMUS MA ,  CONSOLINI JOSEPH J ,  KEIJSERS GERARDUS JOHANNES JOS ,  SIMON KLAUS ,  DE SMIT JOHANNES THEODOOR ,  TRAVERS RICHARD JOSEPH ,  TEUWEN MAURICE ANTON JAQUES ,  MEESTER ARNOUT JOHANNES ,  HAFNER FREDERICK WILLIAM ,  GREENLEE VINYU ,  BALIENS HUBERTUS ANTONIUS MARI

IPC: H01L21/683 ,  G03F7/20 ,  H01L21/027

CPC classification number: G03F7/70691

Abstract: PROBLEM TO BE SOLVED: To provide a pattern onto a non-traditional substrate by a novel method with use of a novel substrate carrier and a substrate carrier. SOLUTION: According to one of the aspects of the present invention there is provided a substrate carrier arranged to hold a substrate in a given position using a vacuum, the vacuum being established in a sealed space created between the substrate carrier and the substrate. According to a second aspect, there is provided a method of removably securing a substrate to a substrate carrier, including: positioning a substrate on the substrate carrier so that a sealed space can be defined between the substrate and the substrate carrier; and establishing a vacuum in the space between the substrate and the substrate carrier. COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：通过使用新型衬底载体和衬底载体的新方法将图案提供到非传统衬底上。 解决方案：根据本发明的一个方面，提供了一种衬底载体，其布置成使用真空将衬底保持在给定位置，真空建立在衬底载体和衬底之间形成的密封空间中 。 根据第二方面，提供了一种将衬底可移除地固定到衬底载体的方法，包括：将衬底定位在衬底载体上，使得可以在衬底和衬底载体之间限定密封空间; 以及在衬底和衬底载体之间的空间中建立真空。 版权所有（C）2008，JPO＆INPIT

公开(公告)号：JP2006186377A

公开(公告)日：2006-07-13

申请号：JP2005375546

申请日：2005-12-27

Applicant: ASML NETHERLANDS BV

Inventor： BEST KEITH FRANK ,  PHILLIPPS GEOFFREY NORMAN ,  BIJNEN FRANCISCUS GODEFRIDUS C ,  VAN DEN BRINK ENNO ,  VAN BUEL HENRICUS WILHELMUS MA ,  CONSOLINI JOSEPH J ,  TEN BERGE PETER

IPC: H01L25/18 ,  H01L25/065 ,  H01L25/07

Abstract: PROBLEM TO BE SOLVED: To provide a method and a system for three-dimensional alignment for wafer scale integration. SOLUTION: A board bonding system is provided with first and second board tables to hold first and second boards, and a controller. The first board is equipped with a first device having a first contact pad, and the second board is equipped with a second device having a second contact pad. The wafer bonding system is designed to conduct bonding of the first and second devices so that a circuit can be formed by the first and second devices. First and second board tables ST and STb are respectively provided with a position sensor to measure optical signals generating on alignment markers WM1, WM1', WM2, and WM2', and WM1b, WM1b', WM2b and WM2b' of the first and second boards. Furthermore, they are provided with first and second actuators ACT and ACTb to change the position and the orientation of the respective board tables. COPYRIGHT: (C)2006,JPO&NCIPI