Methodology for chamber performance matching for semiconductor equipment

    公开(公告)号:US10192763B2

    公开(公告)日:2019-01-29

    申请号:US14875673

    申请日:2015-10-05

    Abstract: Embodiments of the present disclosure provide methodology to match and calibrate processing chamber performance in a processing chamber. In one embodiment, a method for calibrating a processing chamber for semiconductor manufacturing process includes performing a first predetermined process in a processing chamber, collecting a first set of signals transmitted from a first group of sensors disposed in the processing chamber to a controller while performing the predetermined process, analyzing the collected first set of signals, comparing the collected first set of signals with database stored in the controller to check sensor responses from the first group of sensors, calibrating sensors based on the collected first set of signals when a mismatch sensor response is found, subsequently performing a first series of processes in the processing chamber, and collecting a second set of signals transmitted from the sensors to the controller while performing the series of processes.

    Corrosion control for chamber components

    公开(公告)号:US10190701B2

    公开(公告)日:2019-01-29

    申请号:US15110714

    申请日:2016-04-06

    Abstract: Implementations described herein protect a chamber components from corrosive cleaning gases used at high temperatures. In one embodiment, a chamber component includes at least a bellows that includes a top mounting flange coupled to a bottom mounting flange by a tubular accordion structure. A coating is disposed on an exterior surface of at least the tubular accordion structure. The coating includes of at least one of polytetrafluoroethylene, parylene C, parylene D, diamond-like carbon (DLC), yttria stabilized zirconia, nickel, alumina, or aluminum silicon magnesium yttrium oxygen compound. In one embodiment, the chamber component is a valve having an internal bellows.

    Methods Of Selective Layer Deposition
    14.
    发明申请
    Methods Of Selective Layer Deposition 有权
    选择层沉积方法

    公开(公告)号:US20150162214A1

    公开(公告)日:2015-06-11

    申请号:US14560525

    申请日:2014-12-04

    Abstract: Provided are methods for selective deposition. Certain methods describe providing a first substrate surface; providing a second substrate surface; depositing a first layer of film over the first and second substrate surfaces, wherein the deposition has an incubation delay over the second substrate surface such that the first layer of film over the first substrate surface is thicker than the first layer of film deposited over the second substrate surface; and etching the first layer of film over the first and second substrate surfaces, wherein the first layer of film over the second substrate surface is at least substantially removed, but the first layer of film over the first substrate is only partially removed.

    Abstract translation: 提供了选择性沉积的方法。 某些方法描述了提供第一衬底表面; 提供第二衬底表面; 在所述第一和第二衬底表面上沉积第一层膜,其中所述沉积在所述第二衬底表面上具有孵育延迟,使得所述第一衬底表面上的所述第一层膜比沉积在所述第二衬底表面上的所述第一层膜厚 基材表面; 并且在所述第一和第二衬底表面上蚀刻所述第一层膜,其中所述第二衬底表面上的所述第一层膜至少被基本上去除,但所述第一衬底上的所述第一层膜仅被部分地去除。

    Advanced coating method and materials to prevent HDP-CVD chamber arcing

    公开(公告)号:US10208380B2

    公开(公告)日:2019-02-19

    申请号:US15334431

    申请日:2016-10-26

    Abstract: Embodiments described herein relate to apparatus and coating methods to reduce chamber arcing, for example, in HDP-CVD, PECVD, PE-ALD and Etch chambers. The apparatus include a ring shaped gas distributor used for in-situ deposition of coating materials, and a process chamber including the same. The ring shaped gas distributor includes a ring shaped body having at least one gas entrance port disposed on a first side thereof and a plurality of gas distribution ports disposed on a first surface of the ring shaped body. The plurality of gas distribution ports are arranged in a plurality of evenly distributed rows. The plurality of gas distribution ports in a first row of the plurality of evenly distributed rows is adapted to direct gas at an exit angle different from an exit angle of the plurality of gas distribution ports in a second row of the plurality of evenly distributed rows.

    Methods of forming solar cells and solar cell modules
    19.
    发明授权
    Methods of forming solar cells and solar cell modules 有权
    形成太阳能电池和太阳能电池组件的方法

    公开(公告)号:US09040409B2

    公开(公告)日:2015-05-26

    申请号:US14213316

    申请日:2014-03-14

    Abstract: Embodiments of the present invention are directed to processes for making solar cells by simultaneously co-firing metal layers disposed both on a first and a second surface of a bifacial solar cell substrate. Embodiments of the invention may also provide a method forming a solar cell structure that utilize a reduced amount of a silver paste on a front surface of the solar cell substrate and a patterned aluminum metallization paste on a rear surface of the solar cell substrate to form a rear surface contact structure. Embodiments can be used to form passivated emitter and rear cells (PERC), passivated emitter rear locally diffused solar cells (PERL), passivated emitter, rear totally-diffused (PERT), “iPERC,” Crystalline Reduced-cost Aluminum Fire-Through (CRAFT), pCRAFT, nCRAFT or other high efficiency cell concepts.

    Abstract translation: 本发明的实施例涉及通过同时共烧双极太阳能电池基板的第一和第二表面上的金属层来制造太阳能电池的方法。 本发明的实施例还可以提供一种形成太阳能电池结构的方法,该太阳能电池结构在太阳能电池基板的前表面上使用少量的银膏,并且​​在太阳能电池基板的背面上形成图案化的铝金属化浆料,以形成 后表面接触结构。 实施例可用于形成钝化发射器和后电池(PERC),钝化发射器后部局部扩散太阳能电池(PERL),钝化发射极,后部全扩散(PERT),“iPERC”,结晶降低成本的铝穿透 CRAFT),pCRAFT,nCRAFT或其他高效率单元概念。

    Advanced temperature monitoring system with expandable modular layout design

    公开(公告)号:US12013291B2

    公开(公告)日:2024-06-18

    申请号:US17070803

    申请日:2020-10-14

    CPC classification number: G01K3/005 G01K3/10 G03F7/427 G06F2119/08

    Abstract: Embodiments herein provide methods of monitoring temperatures of fluid delivery conduits for delivering fluids to, and other components external to, a processing volume of a processing chamber used in electronic device fabrication manufacturing, and monitoring systems related thereto. In one embodiment, a method includes receiving, at the temperature monitoring system (TMS) controller, information from a first plurality of temperature sensors and a second plurality of temperature sensors, comparing, using the TMS controller, the temperature information to one or more pre-determined control limits, and communicating, using the TMS controller, an out-of-control event to a user. Generally, the temperature monitoring system features the first and second pluralities of temperature sensors, the TMS controller, a first connection module, and a second connection module.

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