公开(公告)号：NO20080023L

公开(公告)日：2008-03-05

申请号：NO20080023

申请日：2008-01-02

Applicant: BASF AG

Inventor： OETTER GUNTER ,  LOCHTMAN RENE ,  LAUN MARTIN ,  PFISTER JUERGEN ,  LIPPERT GERALD ,  MAAS HEIKO

IPC: H01F1/44 ,  F16F9/53

Abstract: A magnetorheological formulation which comprises at least one base oil, at least one magnetizable particle, a at least one dispersant and a at least one thixotropic agent is described.

公开(公告)号：NO20080023A

公开(公告)日：2008-03-05

申请号：NO20080023

申请日：2008-01-02

Applicant: BASF AG

Inventor： OETTER GUNTER ,  LOCHTMAN RENE ,  LAUN MARTIN ,  PFISTER JUERGEN ,  LIPPERT GERALD ,  MAAS HEIKO

IPC: H01F1/44 ,  F16F9/53

CPC classification number: H01F1/447

公开(公告)号：DE602005002130D1

公开(公告)日：2007-10-04

申请号：DE602005002130

申请日：2005-01-13

Applicant: BASF AG ,  UNIV MICHIGAN

Inventor： MUELLER ULRICH ,  LIPPERT GERALD ,  SCHUBERT OLGA ,  HESSE MICHAEL ,  HESS REINHARD ,  STOESSER MICHAEL ,  YAGHI OMAR M

IPC: C07F3/00 ,  B01J20/22

Abstract: A process for preparing an organometallic framework material comprising reacting at least one metal salt with at least one at least bidentate compound capable of coordination to the metal ion of said metal salt, in the presence of an aqueous solvent system and at least one base wherein at least one bidentate compound comprises at least carboxy group and at least one further group which is not a carboxy group and which is capable of forming a hydrogen bridge linkage.

公开(公告)号：AT370956T

公开(公告)日：2007-09-15

申请号：AT05700884

申请日：2005-01-13

Applicant: BASF AG

Inventor： MUELLER ULRICH ,  LIPPERT GERALD ,  SCHUBERT OLGA ,  HESSE MICHAEL ,  HESS REINHARD ,  STOESSER MICHAEL ,  YAGHI OMAR

IPC: C07F3/00 ,  B01J20/22

Abstract: A process for preparing an organometallic framework material comprising reacting at least one metal salt with at least one at least bidentate compound capable of coordination to the metal ion of said metal salt, in the presence of an aqueous solvent system and at least one base wherein at least one bidentate compound comprises at least carboxy group and at least one further group which is not a carboxy group and which is capable of forming a hydrogen bridge linkage.

公开(公告)号：DE102004017915A1

公开(公告)日：2005-11-03

申请号：DE102004017915

申请日：2004-04-13

Applicant: BASF AG ,  RUBITEC GESELLSCHAFT FUER INNOVATION & TECHNOLOGIE RUHR UNIV BOCHUM MBH

Inventor： MUELLER ULRICH ,  LIPPERT GERALD ,  BROWN JAMES REUBEN ,  GIES HERMANN ,  MARLER BERND ,  WANG YINGXIA

IPC: B01D53/02 ,  B01J29/04 ,  C01B33/20 ,  C01B37/00 ,  C01B39/02 ,  C01B39/04 ,  C04B35/16 ,  C01B37/02 ,  B01D53/04 ,  B01J20/18 ,  C07C7/12 ,  C07C9/00 ,  C07C11/00 ,  C07C211/62

公开(公告)号：DE602005002130T2

公开(公告)日：2007-12-13

申请号：DE602005002130

申请日：2005-01-13

Applicant: BASF AG ,  UNIV MICHIGAN

Inventor： MUELLER ULRICH ,  LIPPERT GERALD ,  SCHUBERT OLGA ,  HESSE MICHAEL ,  HESS REINHARD ,  STOESSER MICHAEL ,  YAGHI OMAR M

IPC: C07F3/00 ,  B01J20/22

Abstract: A process for preparing an organometallic framework material comprising reacting at least one metal salt with at least one at least bidentate compound capable of coordination to the metal ion of said metal salt, in the presence of an aqueous solvent system and at least one base wherein at least one bidentate compound comprises at least carboxy group and at least one further group which is not a carboxy group and which is capable of forming a hydrogen bridge linkage.

公开(公告)号：DE102005059324A1

公开(公告)日：2007-06-21

申请号：DE102005059324

申请日：2005-12-09

Applicant: BASF AG

Inventor： SCHNEIDER NORBERT ,  LIPPERT GERALD ,  LOCHTMAN RENE ,  MAAS HEIKO ,  PFISTER JUERGEN ,  SOBOTKA BETTINA ,  WAGNER NORBERT ,  NIESNER NORBERT ,  SCHEIBITZ MATTHIAS ,  DAHLKE MICHAEL ,  WARZELHAN VOLKER

IPC: C08J5/18 ,  B29C47/06 ,  B29C69/00 ,  B32B15/08 ,  C08J5/04 ,  C08J5/12 ,  C08J7/04 ,  C08K3/08 ,  C09D5/24 ,  H05K9/00

Abstract: The film or plate, which can be metalized, is a plastics mixture of four components. The tensile stretch of the thermoplastic polymer component is greater than the mixture including the metal powder, dispersant and filling components by a factor of 1.1-100.0. The tensile strength of the thermoplastic polymer component is stronger than the mixture by a factor of 0.5-4.0. The film or board is metalised by deposition in one or more layers. The plastics mixture (based on 100 weight%) comprises: (a) 5-50 weight% of a thermoplastics polymer; (b) 50-95 weight% of a metal powder with an average particle diameter of 0.01-100 microns and has a negative potential in acidic solution present a silver; (c) 0-10 weight% of a dispersant; and (d) 0-40 weight% of a fibre or particulate filler or mixture. INDEPENDENTLY CLAIMED are: (1) thermoplastic moulding formed from the film or plate; (2) granulate formed from the thermoplastics moulding; (3) bonded layered film or plate formed comprising the film or plate as covering layer and a substrate layer formed from one or more thermoplastic polymers; (4) Moulding comprising the film or plate or a bonded layered film or plate and a back sprayed, foamed, charged or compressed plastics carrier layer; (5) metallised moulding of the (bonded layered) film or plate and (component (b) containing layer, preferably of copper, chromium, nickel, silver and/or gold; (6) production of the film or plate and bonded layered film or plate by melt mixing and extrusion of the plastics mixture; (7) production of the metallised mouldings involving galvanisation or direct metallisation through vacuum deposition, irradiation/spraying or sputtering.

公开(公告)号：DE102005043242A1

公开(公告)日：2007-03-15

申请号：DE102005043242

申请日：2005-09-09

Applicant: BASF AG

Inventor： SCHNEIDER NORBERT ,  LIPPERT GERALD ,  LOCHTMAN RENE ,  MAAS HEIKO ,  PFISTER JUERGEN ,  SOBOTKA BETTINA ,  WAGNER NORBERT

IPC: C08J7/04 ,  C09D5/38 ,  C09D5/23 ,  C09D5/32 ,  C09K23/00

Abstract: Dispersion for applying a metal layer on an electrically non-conductive substrate comprises an organic binder component (0.01-30 wt.%); a metal component (30-89.99 wt.%) containing a first metal with a first metal particle (0.01-99.99 wt.%) and a second metal with a second metal particle (99.99-0.01 wt.%); and a solvent component (10-69.99 wt.%); where the first metal and -particle and second metal and -particle are different from each other. Independent claims are included for: (1) a method for preparing the dispersion comprising mixing an organic binder component, a metal component containing a first metal with a first metal particle and a second metal with a second metal particle, a solvent component, dispersing agent, filler components and further components, and dispersing the obtained mixture; (2) preparation of metal layer on at least a part of an electrically non-conductive substrate comprising applying the dispersion on the substrate, drying the dispersion applied layer on the substrate and optionally de-energizing and/or galvanically separating the metal on the dried dispersion layer; and (3) a substrate surface comprising at least a partially electrical conductive metal layer.

公开(公告)号：BRPI0506420A

公开(公告)日：2006-12-26

申请号：BRPI0506420

申请日：2005-01-13

Applicant: UNIV MICHIGAN ,  BASF AG

Inventor： MUELLER ULRICH ,  LIPPERT GERALD ,  SCHUBERT OLGA ,  HESSE MICHAEL ,  HESS REINHARD ,  SSER MICHAEL ST ,  YAGHI OMAR M

IPC: B01J20/22 ,  C07F3/00

Abstract: A process for preparing an organometallic framework material comprising reacting at least one metal salt with at least one at least bidentate compound capable of coordination to the metal ion of said metal salt, in the presence of an aqueous solvent system and at least one base wherein at least one bidentate compound comprises at least carboxy group and at least one further group which is not a carboxy group and which is capable of forming a hydrogen bridge linkage.

公开(公告)号：DE102005019982A1

公开(公告)日：2006-11-02

申请号：DE102005019982

申请日：2005-04-27

Applicant: BASF AG

Inventor： NIESNER NORBERT ,  SOBOTKA BETTINA ,  PFISTER JUERGEN ,  SCHEIBITZ MATTHIAS ,  WAGNER NORBERT ,  LOCHTMAN RENE ,  SCHNEIDER NORBERT ,  WARZELHAN VOLKER ,  LIPPERT GERALD

IPC: C08J5/18 ,  C08K5/56 ,  C08L23/00 ,  C08L23/10 ,  C08L25/04 ,  C08L27/06 ,  C08L51/00 ,  C08L53/00 ,  C08L53/02 ,  C08L55/02 ,  C08L69/00 ,  C08L75/04

Abstract: Extruded film or plates comprises a metal- or mineral- haptic and optics obtained from a plastic mixture comprising (wt.%) thermoplastic polymer (5-50); particulate or fibrous inorganic filler (50-95); dispersant (0-10); and additives (0-40), where the tear elongation and the tensile strength of the polymer is 1.1-100 and 0.5-4 times, respectively, larger than the tear elongation of the mixture. Independent claims are included for: (1) a thermoplastic molding material for preparing (A); (2) granulates for the thermoplastic molding material; (3) a foil layer or plate comprising (A), surface layer and at least one substrate layer obtained from thermoplastic polymers; (4) a molded part comprising (A), foil layer, plate, rear spray, rear foam or rear pressed carrier layer of plastic; (5) a method for preparing (A); (6) a method for the preparation of foil layer or plate comprising melting the layer foils or plates with one another by a coextrusion process; (7) a method for the preparation of the molded part comprising inserting rear tool, rear spray, rear mold or rear press of thermoplastic mold; or rear layer or rear press of duroplastic molding material in (A) and layer foil or plate by hot molding process; and (8) a decorative or functional parts comprising (A), foil layers or plates, and molded parts.