中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

43 records (took 0.02 seconds)

    12.
    发明专利
    未知

    公开(公告)号：AT391752T

    公开(公告)日：2008-04-15

    申请号：AT05798216

    申请日：2005-10-14

    Applicant: BASF SE

    Inventor： EIBECK PETER ,  BRUCHMANN BERND ,  EIPPER ANDREAS ,  STUMBE JEAN-FRANCOIS ,  NEUHAUS RALF ,  FISCHER MICHAEL ,  ENGELMANN JOCHEN ,  DESBOIS PHILIPPE

    IPC: C08L69/00 ,  C08L67/00 ,  C08L77/00

    Abstract: Thermoplastic molding compositions, comprising A) from 10 to 99% by weight of at least one thermoplastic polyamide, B) from 0.01 to 50% by weight of B1) at least one highly branched or hyperbranched polycarbonate with an OH number of from 1 to 600 mg KOH/g of polycarbonate (to DIN 53240, Part 2), or B2) at least one highly branched or hyperbranched polyester of AxBy type, where x is at least 1.1 and y is at least 2.1, or a mixture of these, C) from 0 to 60% by weight of other additives, where the total of the percentages by weight of components A) to C) is 100%.

    13.
    发明专利
    未知

    公开(公告)号：AT496090T

    公开(公告)日：2011-02-15

    申请号：AT07802518

    申请日：2007-08-07

    Applicant: BASF SE

    Inventor： EIBECK PETER ,  ENGELMANN JOCHEN ,  NEUHAUS RALF ,  BERNNAT ANKA

    IPC: C08K7/14 ,  C08K13/04

    Abstract: Thermoplastic molding compositions, comprising: (A) from 20 to 85% by weight of at least one polyamide whose number of amino end groups is ≧50 mmol/kg, (B) from 14.9 to 60% by weight of glass fibers. (C) from 0.01 to 2% by weight of at least one heat stabilizer, (D) from 0 to 1.5% by weight of at least one mold-release agent, and (E) from 0 to 30% by weight of other additives, where the total of the percentages by weight of (A)-(E) is 100.

    16.
    发明专利
    未知

    公开(公告)号：DE502005003682D1

    公开(公告)日：2008-05-21

    申请号：DE502005003682

    申请日：2005-10-14

    Applicant: BASF SE

    Inventor： EIBECK PETER ,  BRUCHMANN BERND ,  EIPPER ANDREAS ,  STUMBE JEAN-FRANCOIS ,  NEUHAUS RALF ,  FISCHER MICHAEL ,  ENGELMANN JOCHEN ,  DESBOIS PHILIPPE

    IPC: C08L69/00 ,  C08L67/00 ,  C08L77/00

    Abstract: Thermoplastic molding compositions, comprising A) from 10 to 99% by weight of at least one thermoplastic polyamide, B) from 0.01 to 50% by weight of B1) at least one highly branched or hyperbranched polycarbonate with an OH number of from 1 to 600 mg KOH/g of polycarbonate (to DIN 53240, Part 2), or B2) at least one highly branched or hyperbranched polyester of AxBy type, where x is at least 1.1 and y is at least 2.1, or a mixture of these, C) from 0 to 60% by weight of other additives, where the total of the percentages by weight of components A) to C) is 100%.

    Partially aromatic copolyamides with a high crystallinity
    17.
    发明专利
    Partially aromatic copolyamides with a high crystallinity 未知

    公开(公告)号：AU2007222453A1

    公开(公告)日：2007-09-13

    申请号：AU2007222453

    申请日：2007-02-28

    Applicant: BASF SE

    Inventor： BLINNE GERD ,  NEUHAUS RALF ,  DESBOIS PHILIPPE ,  STAWITZKI HAGEN ,  WEIS HANS-JOACHIM

    IPC: C08G69/26

    Abstract: Semiaromatic semicrystalline thermoplastic polyamide molding compositions, comprising A) from 40 to 100% by weight of a copolyamide composed of a1) from 30 to 44 mol % of units which derive from terephthalic acid a2) from 6 to 20 mol % of units which derive from isophthalic acid a3) from 42 to 49.5 mol % of units which derive from hexamethylenediamine a4) from 0.5 to 8 mol % of units which derive from aromatic diamines having from 6 to 30 carbon atoms, where the molar percentages of components a1) to a4) together give 100%, and B) from 0 to 50% by weight of a fibrous or particulate filler C) from 0 to 30% by weight of an elastomeric polymer D) from 0 to 30% by weight of other additives and processing aids, where the percentages by weight of components A) to D) together give 100%.

    Flameproof molding compounds
    18.
    发明专利
    Flameproof molding compounds 未知

    公开(公告)号：AU2006301308A1

    公开(公告)日：2007-04-19

    申请号：AU2006301308

    申请日：2006-10-05

    Applicant: BASF SE

    Inventor： USKE KLAUS ,  NEUHAUS RALF

    IPC: C08L77/00 ,  C08K3/00 ,  C08K3/02 ,  C08K5/3492 ,  C08K5/52 ,  C08K13/02

    Abstract: Thermoplastic molding compositions, comprising A) from 10 to 99.4% by weight of at least one thermoplastic polyamide B) from 0.5 to 20% by weight of a melamine compound C) from 0.1 to 60% by weight of red phosphorus D) from 0 to 60% by weight of other additives, where the total of the percentages by weight of A) to D) is 100%.

    19.
    发明专利
    未知

    公开(公告)号：BRPI0812711A2

    公开(公告)日：2014-12-23

    申请号：BRPI0812711

    申请日：2008-06-12

    Applicant: BASF SE

    Inventor： DESBOIS PHILIPPE ,  STYAWITZKI HAGEN ,  NEUHAUS RALF ,  WEIS HANS-JOACHIM ,  WEICHMANN JUERGEN ,  RODILES RAQUEL FERNANDEZ ,  VOGEL GUNTER

    IPC: C08G69/26 ,  C08G69/28 ,  C08L77/06

    Abstract: The process for preparing a polyamide based on dicarboxylic acids and diamines has the following stages: 1) providing an aqueous monomer mixture of dicarboxylic acids and diamines, the molar ratio of dicarboxylic acids to diamines being adjusted such that a molar deficiency of dicarboxylic acids or diamines of from 1 to 10 mol % is present at the outlet of stage 3), based on the other component in each case, 2) transferring the aqueous mixture from stage 1) to a continuous evaporator reactor in which diamines and dicarboxylic acids are reacted at a temperature in the range from 100 to 370° C. and a pressure in the range from 1 to 50 bar, 3) transferring the mixture from stage 2) to a separator which is operated at a temperature in the range from 100 to 370° C. with removal of gaseous components, 4) transferring the mixture from stage 3) together with diamine or dicarboxylic acid in an amount suitable to balance out the molar deficiency into an extruder which is operated at a temperature in the range from 150 to 400° C. for a residence time in the range from 10 seconds to 30 minutes to remove gaseous components through devolatilizing orifices.

Patent Agency Ranking