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    12.
    发明专利
    未知

    公开(公告)号：BRPI0615863A2

    公开(公告)日：2012-12-18

    申请号：BRPI0615863

    申请日：2006-08-31

    Applicant: BASF SE

    Inventor： SCHNEIDER NORBERT ,  LIPPERT GERALD ,  LOCHTMAN RENE ,  MAAS HEIKO ,  PFISTER JUERGEN ,  SOBOTKA BETTINA ,  WAGNER NORBERT

    IPC: H01B1/22 ,  C08K3/08 ,  C08K7/06 ,  C09K23/00

    Abstract: Dispersion for applying a metal layer on an electrically non-conductive substrate comprises an organic binder component (0.01-30 wt.%); a metal component (30-89.99 wt.%) containing a first metal with a first metal particle (0.01-99.99 wt.%) and a second metal with a second metal particle (99.99-0.01 wt.%); and a solvent component (10-69.99 wt.%); where the first metal and -particle and second metal and -particle are different from each other. Independent claims are included for: (1) a method for preparing the dispersion comprising mixing an organic binder component, a metal component containing a first metal with a first metal particle and a second metal with a second metal particle, a solvent component, dispersing agent, filler components and further components, and dispersing the obtained mixture; (2) preparation of metal layer on at least a part of an electrically non-conductive substrate comprising applying the dispersion on the substrate, drying the dispersion applied layer on the substrate and optionally de-energizing and/or galvanically separating the metal on the dried dispersion layer; and (3) a substrate surface comprising at least a partially electrical conductive metal layer.

    13.
    发明专利
    未知

    公开(公告)号：DE502007002680D1

    公开(公告)日：2010-03-11

    申请号：DE502007002680

    申请日：2007-04-05

    Applicant: BASF SE

    Inventor： LOCHTMAN RENE ,  KACZUN JUERGEN ,  SCHNEIDER NORBERT ,  PFISTER JUERGEN ,  POHL GERT ,  WAGNER NORBERT

    IPC: C25D7/06 ,  C25D7/00 ,  C25D17/00

    Abstract: The invention relates to a device for the electrolytic coating of at least one electrically conductive substrate or a structured or full-surface electrically conductive surface on a nonconductive substrate, which comprises at least one bath, one anode and one cathode, the bath containing an electrolyte solution containing at least one metal salt, from which metal ions are deposited on electrically conductive surfaces of the substrate to form a metal layer while the cathode is brought in contact with the substrate's surface to be coated and the substrate is transported through the bath, wherein the cathode comprises at least two disks (2, 4, 10) mounted on a respective shaft (1, 5, 14) so that they can rotate, the disks (2, 4, 10) engaging in one another. The invention furthermore relates to a method for the electrolytic coating of at least one substrate, which is carried out in a device according to the invention. Lastly, the invention also relates to a use of the device according to the invention for the electrolytic coating of electrically conductive structures on an electrically nonconductive support.

    15.
    发明专利
    未知

    公开(公告)号：BRPI0714693A2

    公开(公告)日：2013-05-14

    申请号：BRPI0714693

    申请日：2007-07-31

    Applicant: BASF SE

    Inventor： LOCHTMAN RENE ,  KACZUN JUERGEN ,  SCHNEIDER NORBERT ,  PFISTER JUERGEN ,  WAGNER NORBERT ,  HENTSCHEL DIETER

    IPC: H05K3/24 ,  H05K3/46

    Abstract: The invention relates to a method for producing structured, electrically-conductive surfaces (3, 11) on an electrically nonconductive support (1), in which the structured and/or full-area electrically-conductive surfaces (3) of a first plane are applied onto the support (1) in a first step, an insulating layer (9) is applied in a second step at the positions where structured and/or full-area electrically-conductive surfaces (11) of a second plane cross the structured and/or full-area electrically-conductive surfaces (3) of the first plane and no electrical contact is intended to take place between the structured and/or full-area electrically-conductive surfaces of the first plane (3) and of the second plane (11), in a third step the structured and/or full-area electrically-conductive surfaces (11) of the second plane are applied according to the first step, and the second and third steps are optionally repeated.

    16.
    发明专利
    未知

    公开(公告)号：AT522910T

    公开(公告)日：2011-09-15

    申请号：AT09173628

    申请日：2006-08-31

    Applicant: BASF SE

    Inventor： SCHNEIDER NORBERT ,  LIPPERT GERALD ,  LOCHTMAN RENE ,  MAAS HEIKO ,  PFISTER JUERGEN ,  SOBOTKA BETTINA ,  WAGNER NORBERT

    IPC: H01B1/22 ,  C08K3/08 ,  C08K7/06 ,  C09K23/00

    Abstract: Dispersion for applying a metal layer on an electrically non-conductive substrate comprises an organic binder component (0.01-30 wt.%); a metal component (30-89.99 wt.%) containing a first metal with a first metal particle (0.01-99.99 wt.%) and a second metal with a second metal particle (99.99-0.01 wt.%); and a solvent component (10-69.99 wt.%); where the first metal and -particle and second metal and -particle are different from each other. Independent claims are included for: (1) a method for preparing the dispersion comprising mixing an organic binder component, a metal component containing a first metal with a first metal particle and a second metal with a second metal particle, a solvent component, dispersing agent, filler components and further components, and dispersing the obtained mixture; (2) preparation of metal layer on at least a part of an electrically non-conductive substrate comprising applying the dispersion on the substrate, drying the dispersion applied layer on the substrate and optionally de-energizing and/or galvanically separating the metal on the dried dispersion layer; and (3) a substrate surface comprising at least a partially electrical conductive metal layer.

    18.
    发明专利
    未知

    公开(公告)号：AT482310T

    公开(公告)日：2010-10-15

    申请号：AT06830676

    申请日：2006-12-18

    Applicant: BASF SE

    Inventor： RAFFAELE ADDAMO ANTONINO ,  NOERENBERG RALF ,  SOBOTKA BETTINA ,  DURIS TIBOR ,  LOCHTMAN RENE ,  WAGNER NORBERT ,  SCHNEIDER NORBERT ,  PFISTER JUERGEN

    IPC: D06M11/83 ,  C09D5/24 ,  D06M23/16 ,  H05B3/34

    Abstract: A method for the production of metallised textile sheet (I) involves (A) printing the textile with a formulation containing at least one metal powder (a) with a greater negative standard potential than hydrogen in the electrochemical displacement series, (B) subjecting the fabric to thermal treatment in one or more stages and (C) depositing another metal on the fabric. Independent claims are included for (1) metallised textile sheet (I) obtained by this method (2) heatable textiles, textiles which convert electricity into heat, textiles which can screen electric fields, textile-integrated electronics and RFID textiles made from (I) (3) printing formulations containing metal powder (a), binder(s) (b), emulsifier(s) (c) and optionally rheology modifier(s) (d) (4) a method for the production of such formulations by mixing the components .

    19.
    发明专利
    未知

    公开(公告)号：AT455157T

    公开(公告)日：2010-01-15

    申请号：AT06793112

    申请日：2006-08-31

    Applicant: BASF SE

    Inventor： SCHNEIDER NORBERT ,  LIPPERT GERALD ,  LOCHTMAN RENE ,  MAAS HEIKO ,  PFISTER JUERGEN ,  SOBOTKA BETTINA ,  WAGNER NORBERT

    IPC: C09D5/24 ,  C09K23/00

    Abstract: Dispersion for applying a metal layer on an electrically non-conductive substrate comprises an organic binder component (0.01-30 wt.%); a metal component (30-89.99 wt.%) containing a first metal with a first metal particle (0.01-99.99 wt.%) and a second metal with a second metal particle (99.99-0.01 wt.%); and a solvent component (10-69.99 wt.%); where the first metal and -particle and second metal and -particle are different from each other. Independent claims are included for: (1) a method for preparing the dispersion comprising mixing an organic binder component, a metal component containing a first metal with a first metal particle and a second metal with a second metal particle, a solvent component, dispersing agent, filler components and further components, and dispersing the obtained mixture; (2) preparation of metal layer on at least a part of an electrically non-conductive substrate comprising applying the dispersion on the substrate, drying the dispersion applied layer on the substrate and optionally de-energizing and/or galvanically separating the metal on the dried dispersion layer; and (3) a substrate surface comprising at least a partially electrical conductive metal layer.

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