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    11.
    发明专利
    未知

    公开(公告)号：BRPI0714693A2

    公开(公告)日：2013-05-14

    申请号：BRPI0714693

    申请日：2007-07-31

    Applicant: BASF SE

    Inventor： LOCHTMAN RENE ,  KACZUN JUERGEN ,  SCHNEIDER NORBERT ,  PFISTER JUERGEN ,  WAGNER NORBERT ,  HENTSCHEL DIETER

    IPC: H05K3/24 ,  H05K3/46

    Abstract: The invention relates to a method for producing structured, electrically-conductive surfaces (3, 11) on an electrically nonconductive support (1), in which the structured and/or full-area electrically-conductive surfaces (3) of a first plane are applied onto the support (1) in a first step, an insulating layer (9) is applied in a second step at the positions where structured and/or full-area electrically-conductive surfaces (11) of a second plane cross the structured and/or full-area electrically-conductive surfaces (3) of the first plane and no electrical contact is intended to take place between the structured and/or full-area electrically-conductive surfaces of the first plane (3) and of the second plane (11), in a third step the structured and/or full-area electrically-conductive surfaces (11) of the second plane are applied according to the first step, and the second and third steps are optionally repeated.

    12.
    发明专利
    未知

    公开(公告)号：AT522910T

    公开(公告)日：2011-09-15

    申请号：AT09173628

    申请日：2006-08-31

    Applicant: BASF SE

    Inventor： SCHNEIDER NORBERT ,  LIPPERT GERALD ,  LOCHTMAN RENE ,  MAAS HEIKO ,  PFISTER JUERGEN ,  SOBOTKA BETTINA ,  WAGNER NORBERT

    IPC: H01B1/22 ,  C08K3/08 ,  C08K7/06 ,  C09K23/00

    Abstract: Dispersion for applying a metal layer on an electrically non-conductive substrate comprises an organic binder component (0.01-30 wt.%); a metal component (30-89.99 wt.%) containing a first metal with a first metal particle (0.01-99.99 wt.%) and a second metal with a second metal particle (99.99-0.01 wt.%); and a solvent component (10-69.99 wt.%); where the first metal and -particle and second metal and -particle are different from each other. Independent claims are included for: (1) a method for preparing the dispersion comprising mixing an organic binder component, a metal component containing a first metal with a first metal particle and a second metal with a second metal particle, a solvent component, dispersing agent, filler components and further components, and dispersing the obtained mixture; (2) preparation of metal layer on at least a part of an electrically non-conductive substrate comprising applying the dispersion on the substrate, drying the dispersion applied layer on the substrate and optionally de-energizing and/or galvanically separating the metal on the dried dispersion layer; and (3) a substrate surface comprising at least a partially electrical conductive metal layer.

    14.
    发明专利
    未知

    公开(公告)号：AT482310T

    公开(公告)日：2010-10-15

    申请号：AT06830676

    申请日：2006-12-18

    Applicant: BASF SE

    Inventor： RAFFAELE ADDAMO ANTONINO ,  NOERENBERG RALF ,  SOBOTKA BETTINA ,  DURIS TIBOR ,  LOCHTMAN RENE ,  WAGNER NORBERT ,  SCHNEIDER NORBERT ,  PFISTER JUERGEN

    IPC: D06M11/83 ,  C09D5/24 ,  D06M23/16 ,  H05B3/34

    Abstract: A method for the production of metallised textile sheet (I) involves (A) printing the textile with a formulation containing at least one metal powder (a) with a greater negative standard potential than hydrogen in the electrochemical displacement series, (B) subjecting the fabric to thermal treatment in one or more stages and (C) depositing another metal on the fabric. Independent claims are included for (1) metallised textile sheet (I) obtained by this method (2) heatable textiles, textiles which convert electricity into heat, textiles which can screen electric fields, textile-integrated electronics and RFID textiles made from (I) (3) printing formulations containing metal powder (a), binder(s) (b), emulsifier(s) (c) and optionally rheology modifier(s) (d) (4) a method for the production of such formulations by mixing the components .

    18.
    发明专利
    未知

    公开(公告)号：AT455157T

    公开(公告)日：2010-01-15

    申请号：AT06793112

    申请日：2006-08-31

    Applicant: BASF SE

    Inventor： SCHNEIDER NORBERT ,  LIPPERT GERALD ,  LOCHTMAN RENE ,  MAAS HEIKO ,  PFISTER JUERGEN ,  SOBOTKA BETTINA ,  WAGNER NORBERT

    IPC: C09D5/24 ,  C09K23/00

    Abstract: Dispersion for applying a metal layer on an electrically non-conductive substrate comprises an organic binder component (0.01-30 wt.%); a metal component (30-89.99 wt.%) containing a first metal with a first metal particle (0.01-99.99 wt.%) and a second metal with a second metal particle (99.99-0.01 wt.%); and a solvent component (10-69.99 wt.%); where the first metal and -particle and second metal and -particle are different from each other. Independent claims are included for: (1) a method for preparing the dispersion comprising mixing an organic binder component, a metal component containing a first metal with a first metal particle and a second metal with a second metal particle, a solvent component, dispersing agent, filler components and further components, and dispersing the obtained mixture; (2) preparation of metal layer on at least a part of an electrically non-conductive substrate comprising applying the dispersion on the substrate, drying the dispersion applied layer on the substrate and optionally de-energizing and/or galvanically separating the metal on the dried dispersion layer; and (3) a substrate surface comprising at least a partially electrical conductive metal layer.

    METHOD FOR PRODUCING POLYMER-COATED METAL FOILS AND USE THEREOF
    19.
    发明专利
    METHOD FOR PRODUCING POLYMER-COATED METAL FOILS AND USE THEREOF 未知

    公开(公告)号：CA2686000A1

    公开(公告)日：2008-11-27

    申请号：CA2686000

    申请日：2008-05-20

    Applicant: BASF SE

    Inventor： LOCHTMAN RENE ,  WAGNER NORBERT ,  HENTSCHEL DIETER ,  PFISTER JUERGEN ,  KACZUN JUERGEN

    IPC: H05K3/02 ,  B05D1/00 ,  B05D1/38 ,  B05D3/10 ,  B05D5/12 ,  B05D7/00 ,  B32B37/02

    Abstract: The invention relates to a method for producing polymer-coated metal foil s, comprising the following steps: (a) a base layer (7) is applied to a carr ier foil (3) by means of a dispersion (5) containing particles that can be e lectroless-plated or electroplated in a matrix material; (b) the matrix mate rial is at least partially dried and/or at least partially hardened; (c) a m etal layer (19) is formed on the base layer (7) by subjecting the base layer (7) containing the particles that can be electroless-plated or electroplate d to an electroless plating or electroplating process; (d) a polymer (23) is applied to the metal layer (19). The invention further relates to a use of the polymer-coated metal foil produced according to the invention for manufa cturing printed circuit boards.

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