公开(公告)号：EP1440465A4

公开(公告)日：2010-08-25

申请号：EP02802484

申请日：2002-10-29

Applicant: BREWER SCIENCE INC

Inventor： SHIH WU-SHENG ,  LAMB JAMES E III ,  DAFFRON MARK

IPC: H05K3/22 ,  B81C1/00 ,  C08G59/68 ,  C08L63/00 ,  H01L21/027 ,  H01L21/3105 ,  H01L21/312 ,  H01L21/4763

CPC classification number: B81C1/0046 ,  B81C1/00611 ,  B81C2201/0119 ,  C08G59/68 ,  C08L63/00 ,  H01L21/02118 ,  H01L21/02282 ,  H01L21/02348 ,  H01L21/31051 ,  H01L21/312

Abstract: The present invention is directed towards planarization materials that produce little or no volatile byproducts during the hardening process when used in contact planarization processes. The materials can be hardened by photo-irradiation or by heat during the planarization process, and they include one or more types of monomers, oligomers, or mixtures thereof, an optional cross-linker, and an optional organic reactive solvents. The solvent, if used, is chemically reacted with the monomers or oligomers and thus becomes part of the polymer matrix during the curing process. These materials can be used for damascene, dual damascene, bi-layer, and multi-layer applications, microelectromechanical system (MEMS), packaging, optical devices, photonics, optoelectronics, microelectronics, and sensor devices fabrication.

公开(公告)号：EP1485949A4

公开(公告)日：2007-04-25

申请号：EP03713770

申请日：2003-02-25

Applicant: BREWER SCIENCE INC

Inventor： SHIH WU-SHENG ,  LAMB JAMES E III ,  DAFFRON MARK G ,  SNOOK JULIET ANN MINZEY

IPC: G03F7/00 ,  G03F7/11 ,  B81C1/00 ,  G03F7/09 ,  G03F7/095 ,  H01L21/027 ,  H01L21/308 ,  H01L21/3105 ,  H01L21/311 ,  H01L21/3205

CPC classification number: G03F7/0002 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/094 ,  G03F7/095 ,  H01L21/3081 ,  H01L21/3086 ,  H01L21/31053 ,  H01L21/31144 ,  Y10T428/24802 ,  Y10T428/24851

Abstract: The present invention is directed towards contact planarization methods that can be used to planarize substrate (32) surfaces having a wide range of topographic feature (34) densities for lithography applications. These processes use thermally curable, photo-curable, or thermoplastic materials to provide globally planarized surfaces (38) over topographic substrate surfaces for lithography applications. Additional coating(s) with global planarity and uniform thickness can be obtained on the planarized surfaces. These inventive methods can be utilized with single-layer, bilayer, or multi-layer processing involving bottom anti-reflective coatings, photoresists, hardmasks, and other organic and inorganic polymers in an appropriate coating sequence as required by the particular application. More specifically, this invention produces globally planar surfaces for use in dual damascene and bilayer processes with greatly improved photolithography process latitude. The invention further provides globally planar surfaces to transfer patterns using imprint lithography, nano-imprint lithography, hot-embossing lithography and stamping pattern transfer techniques.

公开(公告)号：EP1441868A4

公开(公告)日：2006-08-30

申请号：EP02784090

申请日：2002-10-10

Applicant: BREWER SCIENCE INC

Inventor： SHIH WU-SHENG ,  LAMB JAMES E III ,  DAFFRON MARK

IPC: G03F7/00 ,  B22C1/00 ,  B29C33/62 ,  G03F7/20

CPC classification number: G03F7/0002 ,  B29C33/3857 ,  B29C33/62

Abstract: Nonstick molds (16) and method of forming and using such molds are provided. The molds are formed of a nonstick material such as those selected from the group consisting of fluoropolymers, fluorinated siloxane polymers, silicones, and mixtures thereof. The nonstick mold is imprinted with a negative image of a master mold, where the master mold is designed to have a topography pattern corresponding to that desired surface on the surface of a microelectronic substrate. The nonstick mold (16) is then used to transfer the pattern or image (18) to a flowable film (20) on the substrate (22) surface. This film is subsequently cured or hardened, resulting in the desired pattern (26) ready for further processing.

Abstract translation: 提供不粘模具（16）以及形成和使用这种模具的方法。 模具由不粘材料形成，例如选自含氟聚合物，氟化硅氧烷聚合物，硅氧烷及其混合物的那些材料。 不粘模具印有主模具的负像，其中主模具被设计成具有对应于微电子衬底表面上的所需表面的形貌图案。 然后使用不粘模具（16）将图案或图像（18）转印到基底（22）表面上的可流动薄膜（20）上。 随后该膜被固化或硬化，导致所需的图案（26）准备进一步加工。