ELECTRONIC DEVICE HOUSING, ELECTRONIC DEVICE, AND COMBINED BODY

    公开(公告)号:EP3860319A1

    公开(公告)日:2021-08-04

    申请号:EP19866630.7

    申请日:2019-05-16

    Abstract: An electronic device housing, an electronic device and a compound body are provided. The electronic device housing comprises a frame; a sealing layer, disposed on at least a part of an outer surface of the frame, and including a plurality of sub-sealing layers laminated in sequence; and a back case, attached to the frame by the sealing layer, wherein two adjacent sub-sealing layers have different compositions.

    HOUSING AND METHOD FOR FABRICATION THEREOF AND APPLICATION THEREOF

    公开(公告)号:EP3481164A1

    公开(公告)日:2019-05-08

    申请号:EP17819127.6

    申请日:2017-06-19

    Abstract: The present disclosure relates to the field of electronic communications, and discloses a housing, a preparation method therefor, and use thereof. The housing includes a metal hard anodic oxide layer (5) and a resin film layer (3) adhering to a first surface of the metal hard anodic oxide layer (5). The metal hard anodic oxide layer (5) and the resin film layer (3) form an integrated structure. The preparation method includes: performing hard anode oxidization treatment on a metal substrate (1), and then successively performing injection molding and etching.

    COMPOSITE MATERIAL AND PREPARING METHOD OF THE SAME
    17.
    发明公开
    COMPOSITE MATERIAL AND PREPARING METHOD OF THE SAME 审中-公开
    复合材料及其制造方法

    公开(公告)号:EP2373834A1

    公开(公告)日:2011-10-12

    申请号:EP10729095.9

    申请日:2010-01-04

    CPC classification number: C25D11/243 Y10T428/249953

    Abstract: The present invention discloses a composite material comprising: a substrate with an anodic oxide film layer having micropores; and at least one kind of dye filled in the micropores, wherein amount of the same kind of dye is gradient distribution on at least part of the substrate. The composite material has an even, metal gloss, uneasily scratched and wore out surface with gradually changed color. Moreover, the present invention also provided a method of preparing the same.

    ELECTRONIC DEVICE HOUSING, PREPARATION METHOD THEREFOR AND ELECTRONIC DEVICE

    公开(公告)号:EP3905862A1

    公开(公告)日:2021-11-03

    申请号:EP19902746.7

    申请日:2019-04-29

    Abstract: An electronic device housing, a manufacturing method thereof, and an electronic device are provided. The housing includes a bottom plate, and a middle frame connected to the bottom plate. The middle frame is made of glass, and the bottom plate is made of sapphire; or the bottom plate is made of glass, and the middle frame is made of sapphire. An interface-free continuous connection is provided between the bottom plate and the middle frame.

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