Abstract:
A method for soldering a chip on a metallic-ceramic composite board is provided, the metallic-ceramic composite board comprising a ceramic substrate, a first metal plate, and a second metal plate, plate faces at two sides of the ceramic substrate being configured to be a circuit face and a non-circuit face respectively, the first metal plate being connected to the circuit face, and the second metal plate being connected to the non-circuit face, wherein the method comprises: etching the second metal plate, such that the metallic-ceramic composite board forms a bent plate shape protruding towards the side at which the non-circuit face is located; and soldering the chip on the first metal plate, so as to obtain a substantially flat-straight metallic-ceramic composite board on which the chip is soldered. In addition, a metallic-ceramic composite board for soldering a chip thereon is provided.
Abstract:
A ceramic and a method for preparing a ceramic are provided. The ceramic includes an alumina and an oxygen-containing compound of strontium having a perovskite structure.
Abstract:
The present disclosure provides a shell,a method of preparing the same and the use of the shell. The shell includes: a base (1) made of ceramic; and a bending part (2) disposed connected with an edge of the base (1) and made of an amorphous alloy.
Abstract:
A defroster and vehicle are provided. The defroster includes: a housing (5) defining an air outlet (4), a heating device disposed in the housing (5), an air blower (1) defining a blowing outlet (11) and disposed in the housing (5), and an air duct (2) defining a duct inlet (22) and a duct outlet (23), the air duct (2) being disposed between the blowing outlet (11) and the heating device so that air blown out from the blower outlet (11) enters the air duct (2) via the duct inlet (22) and goes out of the air duct (2) via the duct outlet (23), then passes through the heating device to exchange heat with the heating device, and is discharged out of the housing (5) via the air outlet (4), wherein the area of the duct inlet (22) is different from that of the duct outlet (23).
Abstract:
A sealing assembly, a method of preparing the sealing assembly and a battery are provided. The sealing assembly comprises a metal ring (1) having a mounting hole therein; a ceramic ring (2) having a connecting hole therein and disposed in the mounting hole; and a core column (3) disposed in the connecting hole, wherein at least one of an inner circumferential wall surface of the metal ring, an outer circumferential wall surface of the ceramic ring, an inner circumferential wall surface of the ceramic ring and an outer circumferential wall surface of the core column is configured as an inclined surface, and an inclination angle of the inclined surface relative to a vertical plane is about 1 degree to about 45 degrees.
Abstract:
A sound insulation composition and a sound insulation sheet for a vehicle are provided. The sound insulation composition includes 50 to 300 parts by weight of EVA, 10 to 300 parts by weight of mica powers, 10 to 300 parts by weight of dolomite, 10 to 50 parts by weight of thermoplastic resin, 10 to 100 parts by weight of a toughening agent, 3 to 60 parts by weight of a compatilizer, 30 to 300 parts by weight of a fire retardant, 10 to 80 parts by weight of a plasticizer, and 100 to 500 parts by weight of barium sulfate. The sound insulation sheet for the vehicle is made of the sound insulation composition mentioned above.
Abstract:
A base plate for a heat sink as well as a heat sink and an IGBT module having the same are provided. The base plate includes: a base plate body, including a body part; and a first surface layer and a second surface layer disposed respectively on two opposing surfaces of the body part; and N pins disposed on the first surface layer and spaced apart from one another, each pin having a first end fixed on the first surface layer and a second end configured as a free end, in which the first surface layer and the N pins are configured to contact a coolant, an area of a first portion of the first surface layer contacting the coolant is denoted as S1, and an area of a second portion of the first surface layer contacting each pin is denoted as S2, in which 180≤S1/S2≤800, and 300≤N
Abstract:
A ceramic substrate, a manufacturing method thereof, and a power module comprising the ceramic substrate. The ceramic substrate comprises a core layer and a plurality of surface layers, optionally it further comprises a plurality of transition layers. The core layer is made of zirconia toughened alumina; the surface layers symmetrically located on the upper and lower surfaces of the core layer are made of Al 2 O 3 ; and the transition layers symmetrically located between the surface layer and the core layer are made of zirconia toughened alumina. The core layer has a chemical composition of 0wt% 2 ≤40wt% and 60wt%≤Al 2 O 3
Abstract translation:陶瓷基板及其制造方法以及包括陶瓷基板的功率模块。 陶瓷衬底包括芯层和多个表面层,任选地,其还包括多个过渡层。 芯层由氧化锆增韧的氧化铝制成; 对称地位于芯层的上表面和下表面上的表面层由Al 2 O 3制成; 对称地位于表层和芯层之间的过渡层由氧化锆增韧的氧化铝制成。 核心层的化学组成为0重量%
Abstract:
A positive temperature coefficient heating assembly includes a heating core (10) including a first metal electrode plate (2a), a second metal electrode plate (2b) and a plurality of PTC ceramic chips (1); an insulating layer coated on the heating core (10); and a metal tube (8); the PTC ceramic chip (1) includes a positive electrode layer, a negative electrode layer, and a ceramic sintered layer; a plurality of first limit grooves (21a) are formed in the first metal electrode plate (2a), a plurality of second limit grooves (2b) are formed in the second metal electrode plate (21b), a first end of each of the PTC ceramic chips (1) is embedded in one of the first limit grooves (21a), and a second end of each of the PTC ceramic chips (1) is embedded in one of the second limit grooves (21b).
Abstract:
A method for forming a pattern on a surface of an insulating substrate and a ceramic article comprises: forming a film that comprises any one of ZnO, SnO 2 , TiO 2 and a combination thereof on at least one surface of the insulating substrate; irradiating at least a part of the film by an energy beam to form the pattern in the film.