METHOD FOR SOLDERING CHIP ON METALLIC-CERAMIC COMPOSITE BOARD AND METALLIC-CERAMIC COMPOSITE BOARD FOR SOLDERING CHIP THEREON
    11.
    发明申请
    METHOD FOR SOLDERING CHIP ON METALLIC-CERAMIC COMPOSITE BOARD AND METALLIC-CERAMIC COMPOSITE BOARD FOR SOLDERING CHIP THEREON 审中-公开
    在金属陶瓷复合板和金属陶瓷复合板上焊接芯片的方法,用于焊接芯片

    公开(公告)号:WO2017032334A1

    公开(公告)日:2017-03-02

    申请号:PCT/CN2016/096746

    申请日:2016-08-25

    Abstract: A method for soldering a chip on a metallic-ceramic composite board is provided, the metallic-ceramic composite board comprising a ceramic substrate, a first metal plate, and a second metal plate, plate faces at two sides of the ceramic substrate being configured to be a circuit face and a non-circuit face respectively, the first metal plate being connected to the circuit face, and the second metal plate being connected to the non-circuit face, wherein the method comprises: etching the second metal plate, such that the metallic-ceramic composite board forms a bent plate shape protruding towards the side at which the non-circuit face is located; and soldering the chip on the first metal plate, so as to obtain a substantially flat-straight metallic-ceramic composite board on which the chip is soldered. In addition, a metallic-ceramic composite board for soldering a chip thereon is provided.

    Abstract translation: 提供了一种在金属陶瓷复合板上焊接芯片的方法,所述金属陶瓷复合板包括陶瓷基板,第一金属板和第二金属板,所述陶瓷基板的两侧的板面构成为 分别是电路面和非电路面,第一金属板连接到电路面,第二金属板连接到非电路面,其中所述方法包括:蚀刻所述第二金属板,使得 金属陶瓷复合板形成朝向非电路面所在的一侧突出的弯曲板状; 并将芯片焊接在第一金属板上,以获得芯片焊接在其上的基本上平直的金属陶瓷复合板。 另外,提供了用于在其上焊接芯片的金属陶瓷复合板。

    DEFROSTER AND VEHICLE HAVING THE SAME
    14.
    发明申请
    DEFROSTER AND VEHICLE HAVING THE SAME 审中-公开
    除油器和具有相同功能的车辆

    公开(公告)号:WO2014177026A1

    公开(公告)日:2014-11-06

    申请号:PCT/CN2014/076297

    申请日:2014-04-25

    Abstract: A defroster and vehicle are provided. The defroster includes: a housing (5) defining an air outlet (4), a heating device disposed in the housing (5), an air blower (1) defining a blowing outlet (11) and disposed in the housing (5), and an air duct (2) defining a duct inlet (22) and a duct outlet (23), the air duct (2) being disposed between the blowing outlet (11) and the heating device so that air blown out from the blower outlet (11) enters the air duct (2) via the duct inlet (22) and goes out of the air duct (2) via the duct outlet (23), then passes through the heating device to exchange heat with the heating device, and is discharged out of the housing (5) via the air outlet (4), wherein the area of the duct inlet (22) is different from that of the duct outlet (23).

    Abstract translation: 提供除霜器和车辆。 除霜器包括:限定空气出口(4)的壳体(5),设置在壳体(5)中的加热装置),限定吹风口(11)并设置在壳体(5)中的鼓风机(1) 以及限定管道入口(22)和管道出口(23)的风道(2),所述空气管道(2)设置在所述吹出口(11)和所述加热装置之间,使得从所述鼓风机出口吹出的空气 (11)通过管道入口(22)进入风道(2),并通过管道出口(23)离开风道(2),然后通过加热装置与加热装置进行热交换, 经由空气出口(4)从壳体(5)排出,其中管道入口(22)的面积与管道出口(23)的面积不同。

    BASE PLATE FOR HEAT SINK AS WELL AS HEAT SINK AND IGBT MODULE HAVING THE SAME
    17.
    发明申请
    BASE PLATE FOR HEAT SINK AS WELL AS HEAT SINK AND IGBT MODULE HAVING THE SAME 审中-公开
    散热片基板和散热片以及IGBT模块相同

    公开(公告)号:WO2017071652A1

    公开(公告)日:2017-05-04

    申请号:PCT/CN2016/103806

    申请日:2016-10-28

    CPC classification number: H05K7/20 H01L23/473

    Abstract: A base plate for a heat sink as well as a heat sink and an IGBT module having the same are provided. The base plate includes: a base plate body, including a body part; and a first surface layer and a second surface layer disposed respectively on two opposing surfaces of the body part; and N pins disposed on the first surface layer and spaced apart from one another, each pin having a first end fixed on the first surface layer and a second end configured as a free end, in which the first surface layer and the N pins are configured to contact a coolant, an area of a first portion of the first surface layer contacting the coolant is denoted as S1, and an area of a second portion of the first surface layer contacting each pin is denoted as S2, in which 180≤S1/S2≤800, and 300≤N

    Abstract translation: 提供了一种用于散热器的基板以及具有该基板的散热器和IGBT模块。 基板包括:基板主体,其包括主体部分; 以及分别设置在所述主体部分的两个相对表面上的第一表面层和第二表面层; 以及N个销,所述N个销设置在所述第一表面层上并且彼此间隔开,每个销具有固定在所述第一表面层上的第一端和构造为自由端的第二端,其中配置所述第一表面层和所述N个销 接触冷却剂时,第一表面层的与冷却剂接触的第一部分的面积表示为S1,并且接触每个销的第一表面层的第二部分的面积表示为S2,其中180≤S1/ S2≤800,并且300≤N<650。

    POSITIVE TEMPERATURE COEFFICIENT HEATING ASSEMBLY AND DEFROSTER FOR A VEHICLE
    19.
    发明申请
    POSITIVE TEMPERATURE COEFFICIENT HEATING ASSEMBLY AND DEFROSTER FOR A VEHICLE 审中-公开
    积极温度系数加热组件和车辆除霜器

    公开(公告)号:WO2015058692A1

    公开(公告)日:2015-04-30

    申请号:PCT/CN2014/089164

    申请日:2014-10-22

    Abstract: A positive temperature coefficient heating assembly includes a heating core (10) including a first metal electrode plate (2a), a second metal electrode plate (2b) and a plurality of PTC ceramic chips (1); an insulating layer coated on the heating core (10); and a metal tube (8); the PTC ceramic chip (1) includes a positive electrode layer, a negative electrode layer, and a ceramic sintered layer; a plurality of first limit grooves (21a) are formed in the first metal electrode plate (2a), a plurality of second limit grooves (2b) are formed in the second metal electrode plate (21b), a first end of each of the PTC ceramic chips (1) is embedded in one of the first limit grooves (21a), and a second end of each of the PTC ceramic chips (1) is embedded in one of the second limit grooves (21b).

    Abstract translation: 正温度系数加热组件包括包括第一金属电极板(2a),第二金属电极板(2b)和多个PTC陶瓷芯片(1)的加热芯(10); 涂覆在加热芯(10)上的绝缘层; 和金属管(8); PTC陶瓷芯片(1)包括正极层,负极层和陶瓷烧结层; 在第一金属电极板(2a)中形成有多个第一限制槽(21a),在第二金属电极板(21b)中形成有多个第二限制槽(2b),每个PTC的第一端 陶瓷芯片(1)嵌入在第一极限槽(21a)中的一个中,并且每个PTC陶瓷芯片(1)的第二端嵌入在第二限制槽(21b)中的一个中。

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