公开(公告)号：AU5460898A

公开(公告)日：1998-06-22

申请号：AU5460898

申请日：1997-11-21

Applicant: CABOT CORP

Inventor： STREINZ CHRISTOPHER C ,  NEVILLE MATTHEW ,  GRUMBINE STEVEN K ,  MUELLER BRIAN L

IPC: C09G1/02 ,  C23F3/00

公开(公告)号：ID16901A

公开(公告)日：1997-11-20

申请号：ID971587

申请日：1997-05-12

Applicant: CABOT CORP

Inventor： SCHERBER DEBRA L ,  KAUFMAN VLASTA BRUSIC ,  KISTLER RODNEY C ,  MUELLER BRIAN L ,  STREINZ CHRISTOPHER C

IPC: B24C1/08 ,  B24C11/00 ,  C09G1/02 ,  C23F3/00 ,  H01L21/321 ,  C09K13/00

Abstract: A polishing slurry for chemically mechanically polishing metal layers and films during the various stages of multilevel interconnect fabrication associated with integrated circuit manufacturing. The slurry includes an aqueous medium, an abrasive, an oxidizing agent, and an organic acid. The polishing slurry has been found to significantly lower or inhibit the silicon dioxide polishing rate, thus yielding enhanced selectivity. In addition, the polishing slurry is useful in providing effective polishing to metal layers at desired polishing rates while minimizing surface imperfections and defects. Also disclosed is a method for producing coplanar metal/insulator films on a substrate utilizing the slurry of the present invention and chemical mechanical polishing technique relating thereto.

公开(公告)号：AU5464298A

公开(公告)日：1998-06-22

申请号：AU5464298

申请日：1997-11-21

Applicant: CABOT CORP

Inventor： GRUMBINE STEVEN K ,  STREINZ CHRISTOPHER C ,  MUELLER BRIAN L

IPC: B24B37/00 ,  C09G1/02 ,  C09K3/14 ,  C09K13/04 ,  C09K13/06 ,  C23F3/00 ,  H01L21/304 ,  H01L21/321 ,  B24B1/00 ,  H01L21/00

Abstract: A chemical mechanical polishing precursor composition comprising at least one catalyst having multiple oxidation states, and at least one stabilizer, the composition being useful when admixed with an oxidizing agent prior to use to remove metal layers from a substrate. Also disclosed is a chemical mechanical polishing composition comprising an oxidizing agent and at least one catalyst having multiple oxidation sites, the composition being useful when combined with an abrasive or an abrasive pad to remove metal layers from a substrate.

公开(公告)号：AU3138597A

公开(公告)日：1998-01-05

申请号：AU3138597

申请日：1997-05-22

Applicant: CABOT CORP

Inventor： STREINZ CHRISTOPHER C ,  MUELLER BRIAN L ,  LUCARELLI MICHAEL A ,  WALTERS MAX H

IPC: C09G1/02 ,  C09K3/14 ,  C09K13/04 ,  H01L21/304 ,  H01L21/321 ,  H01L21/3213 ,  H01L21/306 ,  C23F3/00 ,  C09K13/00

Abstract: A chemical mechanical polishing slurry having a pH in the range 1.5 to 3.0 comprising an oxidizing agent such as ferric nitrate, a fluoride containing additive such as hydrofluoric acid in an amount ranging from 0.01 to 0.3 weight percent and an abrasive consisting of fine metal particles, such as fumed alumina and a method for using the fluoride containing additive chemical mechanical polishing slurry to remove tungsten and titanium from substrates.