公开(公告)号：ES2210530T3

公开(公告)日：2004-07-01

申请号：ES97924735

申请日：1997-05-02

Applicant: CASCADE MICROTECH INC

Inventor： GLEASON K REED ,  SMITH KENNETH A ,  BAYNE MIKE

IPC: G01R31/26 ,  G01R1/06 ,  G01R1/067 ,  G01R1/073 ,  G01R31/02 ,  G01R31/28 ,  H01L21/66

Abstract: A membrane probing assembly includes a support element having an incompressible forward support tiltably coupled to a rearward base and a membrane assembly, formed of polyimide layers, with its central region interconnected to the support by an elastomeric layer. Flexible traces form data/signal lines to contacts on the central region. Each contact comprises a rigid beam and a bump located in off-centered location on the beam, which bump includes a contacting portion. After initial touchdown of these contacting portions, further over-travel of the pads causes each beam to independently tilt locally so that different portions of each beam move different distances relative to the support thus driving each contact into lateral scrubbing movement across the pad thereby clearing away oxide buildup. The elastomeric member backed by the incompressible support ensures sufficient scrub pressure and reliable tilt recovery of each contact without mechanical straining of the beam. In an alternative embodiment, the contacts comprise conductive beams each supported on a loose U-shaped flap formed in the membrane assembly where each flap and beam is tiltably supported in inclined position by an elastomeric hub interposed between the flap and support.

公开(公告)号：DE112004002554T5

公开(公告)日：2006-11-23

申请号：DE112004002554

申请日：2004-12-21

Applicant: CASCADE MICROTECH INC

Inventor： STRID ERIC ,  GLEASON K REED

IPC: G01R31/28 ,  G01R1/067 ,  G01R31/02 ,  H01L21/66

Abstract: The probe has active circuits (410, 412) with resistive units, each of which is supported by a substrate. Elongate probing units (414, 416) are interconnected to the respective active circuits. The active circuits are interconnected to a substrate by a respective pair of flexible interconnects (432, 434). The active circuits are also interconnected to a respective set of signal paths (420, 422).

公开(公告)号：GB2425844A

公开(公告)日：2006-11-08

申请号：GB0611823

申请日：2004-12-21

Applicant: CASCADE MICROTECH INC

Inventor： STRID ERIC ,  GLEASON K REED

IPC: G01R1/067 ,  G01R31/02

Abstract: A probe suitable for probing a semiconductor wafer that includes an active circuit (16). The probe may include a flexible interconnection (14) between the active circuit (16) and a support structure (10). The probe may impose a relatively low capacitance on the device under test.

公开(公告)号：DE19614506B4

公开(公告)日：2006-01-12

申请号：DE19614506

申请日：1996-04-12

Applicant: CASCADE MICROTECH INC

Inventor： STRID ERIC W ,  SCHAPPACHER JERRY B ,  CARLTON DALE E ,  GLEASON K REED

IPC: G01R31/26 ,  G01R1/00 ,  G01R1/067 ,  G01R1/073 ,  G01R31/02 ,  G01R31/28 ,  G01R35/00 ,  H01L21/66

Abstract: An interconnect assembly for evaluating a probe measurement network includes a base, respective inner and outer probing areas in mutually coplanar relationship on the upper face of the base, a reference junction, and a high-frequency transmission structure connecting the probing areas and the reference junction so that high-frequency signals can be uniformly transferred therebetween. A preferred method for evaluating the signal channels of the network includes connecting a reference unit to the reference junction and successively positioning each device-probing end that corresponds to a signal channel of interest on the inner probing area.

公开(公告)号：EP1627235A4

公开(公告)日：2010-08-18

申请号：EP04785615

申请日：2004-04-26

Applicant: CASCADE MICROTECH INC

Inventor： GLEASON K REED ,  LESHER TIM ,  ANDREWS MIKE ,  MARTIN JOHN

IPC: G01R1/06 ,  G01R1/067 ,  G01R1/073

CPC classification number: G01R1/07342 ,  G01R1/06738 ,  G01R1/06772