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    DIFFERENTIAL SIGNAL PROBING SYSTEM
    1.
    发明申请
    DIFFERENTIAL SIGNAL PROBING SYSTEM 审中-公开
    差分信号探测系统

    公开(公告)号：WO2007145727A3

    公开(公告)日：2009-04-16

    申请号：PCT/US2007010800

    申请日：2007-05-03

    Applicant: CASCADE MICROTECH INC ,  STRID ERIC ,  CAMPBELL RICHARD

    Inventor： STRID ERIC ,  CAMPBELL RICHARD

    IPC: G01R31/02

    CPC classification number: G01R1/06772

    Abstract: A probe measurement system comprises a probe with a linear array of probe tips enabling a single probe to be used when probing a test structure with a differential signal.

    Abstract translation: 探头测量系统包括具有探针尖端的线性阵列的探针，使得能够在用差分信号探测测试结构时使用单个探针。

    ON-WAFER TEST STRUCTURES
    3.
    发明申请
    ON-WAFER TEST STRUCTURES 审中-公开
    在线测试结构

    公开(公告)号：WO2007145729A3

    公开(公告)日：2008-05-02

    申请号：PCT/US2007010802

    申请日：2007-05-03

    Applicant: CASCADE MICROTECH INC ,  STRID ERIC ,  CAMPBELL RICHARD

    Inventor： STRID ERIC ,  CAMPBELL RICHARD

    IPC: G01R31/02

    CPC classification number: G01R31/2884

    Abstract: A test structure for characterizing integrated circuits on a wafer includes a differential cell outputting a differential mode signal in response to a differential mode input signal. The probe pads of the test structure are arrayed linearly enabling placement of the test structure in a saw street between dies.

    Abstract translation: 用于表征晶片上的集成电路的测试结构包括响应于差分模式输入信号而输出差分模式信号的差分单元。 测试结构的探针焊盘线性排列，可以将测试结构放置在管芯之间的锯道中。

    RESILIENT ELECTRICAL INTERPOSERS, SYSTEMS THAT INCLUDE THE INTERPOSERS, AND METHODS FOR USING AND FORMING THE SAME
    4.
    发明申请
    RESILIENT ELECTRICAL INTERPOSERS, SYSTEMS THAT INCLUDE THE INTERPOSERS, AND METHODS FOR USING AND FORMING THE SAME 审中-公开
    活动电气插件，包括插入器的系统及其使用和形成方法

    公开(公告)号：WO2012061568A3

    公开(公告)日：2014-04-10

    申请号：PCT/US2011059091

    申请日：2011-11-03

    Applicant: CASCADE MICROTECH INC ,  SMITH KENNETH R ,  JOLLEY MIKE ,  STRID ERIC ,  HANAWAY PETER ,  GLEASON K REED ,  DUCKWORTH KOBY L

    Inventor： SMITH KENNETH R ,  JOLLEY MIKE ,  STRID ERIC ,  HANAWAY PETER ,  GLEASON K REED ,  DUCKWORTH KOBY L

    IPC: G01R31/00

    CPC classification number: G01R1/0735 ,  G01R1/06727 ,  G01R1/06733 ,  G01R1/07342 ,  H01L21/4825 ,  H01L21/4828 ,  H01L21/4842 ,  H01L21/4853 ,  H01L21/4857 ,  Y10T29/49155

    Abstract: Resilient electrical interposers that may be utilized to form a plurality of electrical connections between a first device and a second device, as well as systems that may utilize the resilient electrical interposers and methods of use and/or fabrication thereof. The resilient electrical interposers may include a resilient dielectric body with a plurality of electrical conduits contained therein. The plurality of electrical conduits may be configured to provide a plurality of electrical connections between a first surface of the electrical interposer and/or the resilient dielectric body and a second, opposed, surface of the electrical interposer and/or the resilient dielectric body. The systems and methods disclosed herein may provide for improved vertical compliance, improved contact force control, and/or improved dimensional stability of the resilient electrical interposers.

    Abstract translation: 可用于在第一装置和第二装置之间形成多个电连接的弹性电插入件，以及可利用弹性电插入件及其使用和/或制造方法的系统。 弹性电插入件可以包括弹性介电体，其中包含多个电导管。 多个电导管可以被配置为在电插入器的第一表面和/或弹性电介质体之间提供多个电连接以及电插入器和/或弹性介电体的第二相对的表面。 本文公开的系统和方法可以提供弹性电插入器的改进的垂直顺应性，改进的接触力控制和/或改进的尺寸稳定性。

    ACTIVE WAFER PROBE
    5.
    发明申请
    ACTIVE WAFER PROBE 审中-公开
    主动波形探测器

    公开(公告)号：WO2005065258A3

    公开(公告)日：2006-01-05

    申请号：PCT/US2004043231

    申请日：2004-12-21

    Applicant: CASCADE MICROTECH INC ,  STRID ERIC ,  GLEASON K REED

    Inventor： STRID ERIC ,  GLEASON K REED

    IPC: G01R1/067 ,  G01R31/02

    CPC classification number: G01R1/06711 ,  G01R1/06772

    Abstract: A probe suitable for probing a semiconductor wafer that includes an active circuit (16). The probe may include a flexible interconnection (14) between the active circuit (16) and a support structure (10). The probe may impose a relatively low capacitance on the device under test.

    Abstract translation: 一种适用于探测包括有源电路（16）的半导体晶片的探针。 探针可以包括在有源电路（16）和支撑结构（10）之间的柔性互连（14）。 探头可能会在被测器件上施加相对较低的电容。

    Active wafer probe
    7.
    发明专利
    Active wafer probe 未知

    公开(公告)号：GB2425844B

    公开(公告)日：2007-07-11

    申请号：GB0611823

    申请日：2004-12-21

    Applicant: CASCADE MICROTECH INC

    Inventor： STRID ERIC ,  GLEASON K REED

    IPC: G01R1/067 ,  G01R31/02

    Abstract: The probe has active circuits (410, 412) with resistive units, each of which is supported by a substrate. Elongate probing units (414, 416) are interconnected to the respective active circuits. The active circuits are interconnected to a substrate by a respective pair of flexible interconnects (432, 434). The active circuits are also interconnected to a respective set of signal paths (420, 422).

    8.
    发明专利
    未知

    公开(公告)号：DE112004002554T5

    公开(公告)日：2006-11-23

    申请号：DE112004002554

    申请日：2004-12-21

    Applicant: CASCADE MICROTECH INC

    Inventor： STRID ERIC ,  GLEASON K REED

    IPC: G01R31/28 ,  G01R1/067 ,  G01R31/02 ,  H01L21/66

    Abstract: The probe has active circuits (410, 412) with resistive units, each of which is supported by a substrate. Elongate probing units (414, 416) are interconnected to the respective active circuits. The active circuits are interconnected to a substrate by a respective pair of flexible interconnects (432, 434). The active circuits are also interconnected to a respective set of signal paths (420, 422).

    Active wafer probe
    9.
    发明专利
    Active wafer probe 未知

    公开(公告)号：GB2425844A

    公开(公告)日：2006-11-08

    申请号：GB0611823

    申请日：2004-12-21

    Applicant: CASCADE MICROTECH INC

    Inventor： STRID ERIC ,  GLEASON K REED

    IPC: G01R1/067 ,  G01R31/02

    Abstract: A probe suitable for probing a semiconductor wafer that includes an active circuit (16). The probe may include a flexible interconnection (14) between the active circuit (16) and a support structure (10). The probe may impose a relatively low capacitance on the device under test.

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