Abstract:
PROBLEM TO BE SOLVED: To provide a light-emitting device with a luminescent panel attaining mass-production with a high manufacturing efficiency, superior in element service life and light emission characteristics, and suppressing variations in emission luminance, and to provide a method of manufacturing the device, and to provide electronic equipment attaining favorable image display. SOLUTION: In a display panel 10A which is a display of the light-emitting device, a region (an EL element formation region) Rel forming an organic EL element OEL of each pixel PIX is defined by a partition wall 13, protruding from one surface side of a substrate 11 and having a plurality of openings 13a. Each independent liquid control part 15 is formed on the partition wall 13, formed in a region between the pixels PIX arranged in a column direction of the display panel 10A. The liquid control parts 15 are disposed, such that pitches between the liquid control parts 15 are set at equal intervals. The film quality and the film thickness of the organic EL layer of each pixel PIX are made uniform, by continuously applying a liquid along the pixels PIX arranged in the column direction of the display panel 10A. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To form an organic EL layer with stable film thickness. SOLUTION: An anode electrode 15, which consists of transparent electric conductor, such as ITO, or the like, is formed on a transparent substrate 14, such as glass, or the like, the partitions 12, which consist of insulated material, which makes partition the cells 13R which connects two or more pixels, which have the anode electrode 15, respectively, are formed, an organic EL layer 11R is formed by liquid drop splay of the solution of the organic EL material to the cells 13R, and a cathode electrode is formed on the organic EL layer 11R and the partition 12. COPYRIGHT: (C)2003,JPO
Abstract:
PROBLEM TO BE SOLVED: To provide a thermal ink jet head in which films can be formed at a high speed and a short circuit between discrete electrodes is prevented even when defects such as pinholes occurs in an insulating layer. SOLUTION: A radiation layer 26 is formed on a narrow face of about a half of a glass substrate 25, then the insulating layer 28 is spread on the whole face of the substrate. A heating resistor 29a is disposed above a right end of the radiation layer 26. A common electrode 31b formed to the whole face above the radiation layer 26 is connected to a left end of the heating resistor 29a. The discrete electrode 31a formed onto the insulating layer 28 of a part where the radiation layer 26 is not formed is connected to a right end of the heating resistor 29a. An ink supply groove 33, an ink supply hole 34 and a diaphragm 32 are formed, an orifice plate 35 is layered, and an orifice 36 is bored. The glass substrate 25 cut as a chip is die bonded by a die bonding agent 39 to a radiation plate 37. Then, the radiation layer 26 exposed to the left end and the radiation plate 37 are thermally coupled by a heat transfer paste 41. Since the radiation layer 26 is absent immediately below the discrete electrode 31a, no short circuit takes place even if the insulating layer has the pinhole.
Abstract:
PROBLEM TO BE SOLVED: To provide an anisotropic etching method in which occurrence of an ejection nozzle having an incomplete shape or incomplete electrical connection at the electrode terminal part due to readhesion of the etching residue of metal mask is prevented. SOLUTION: An orifice plate 58 is formed on the uppermost layer of a heating part 52, a common electrode 53, a discrete interconnection electrode 54, an ink supply trench 55, an ink supply hole 56, a barrier wall 57, and the like, formed on a chip substrate 51 and a metal mask film 63 is formed thereon by sputtering thus forming a pattern 63-1. Furthermore, a nonmetallic thick resist film 64 having an etching select ratio of 1:1 with respect to the orifice plate 58 is formed thereon with the same thickness as the orifice plate 58 thus forming a pattern 64-1. Subsequently, helicon wave dry etching is performed according to the patterns 63-1 and 64-1 to make an ejection nozzle 62. The thick resist film 64 is etched substantially over the entire etching period and removed gradually and the metal mask film 63 is etched by only a small thickness d in the final stage.
Abstract:
PROBLEM TO BE SOLVED: To provide an ink jet printing head which is prevented from a substrate break and is advantageous in improving a manufacturing yield. SOLUTION: An ink groove projection 28-1 is formed to a central part of an ink groove 28. An ink supply hole 29 is formed to a position whereat a communication port 30 to the ink supply hole 29 is formed in the ink groove projection 28-1. The communication port 30 is hence disposed so that a central position of the communication port 30, namely, a position of a center axis of the ink supply hole 29 is shifted by a predetermined distance to a center line in a breadth direction of the ink groove 28. A structure of the ink groove 28 in the vicinity of the ink supply hole 29 is improved in strength than a structure of the conventional ink groove where the center line in the breadth direction agrees with the axial center position of the ink supply hole. Accordingly, concentration of a mechanical stress when sand blasting is carried out or when a top plate is attached is eased, and the substrate break in a longitudinal direction of the ink groove 28 is prevented.
Abstract:
PROBLEM TO BE SOLVED: To provide a method for manufacturing ink jet printer heads whereby residues generated by etching a mask to work discharge nozzles are prevented from adhering to discharge nozzles and electrode terminals. SOLUTION: An orifice plate 15 with thermoplastic polyimide adhesive layers applied to both faces is first attached onto a diaphragm not illustrated on which the mask film 16 is formed. The resist mask 17 is formed to a limited neighborhood of a region where discharge nozzles are to be formed. The mask film 16 is then etched. Subsequently the resist mask 17 is removed to expose the mask film 16. A thick film resist 19 is coated and patterned to open only the discharge nozzle part and the electrode terminal part. Discharge nozzles 21 are bored to the orifice plate 15 by helicon wave etching. Overetching is carried out for several minutes at this time to a level so that the orifice plate 15 is etched only by a thickness d. The thick film resist 19 is completely removed.
Abstract:
PROBLEM TO BE SOLVED: To provide a multiarray type multicolor ink jet printing head having an ink supply route simple in structure and easy to produce. SOLUTION: A multiarray type multicolor ink jet printing head consists of a main substrate 65, the ink tank unit 66 arranged to one end of the substrate, four ink supply channels 68 (68-1, 68-2) communicating with the ink tanks 67Bk, 67Y, 67M, 67C of the tank unit and circulating as shown by arrows P, Q, R and the head chips 50 arranged zigzag thereon in two rows. The arranging order along the head chip arranging direction (the direction from above to below in the drawing) of the ink supply channels at every four color inks of black(Bk), yellow(Y), magenta(M) and cyan(C) supplied to two rows of the head chips 50 is made reverse mutually with respect to four ink supply channels 68-1 being forward channels and four ink supply passages 68-2 being backward channels to constitute the ink supply channels so that they are merely bent on a plane at the reciprocal folding-back point shown by the arrow Q without crossing each other.
Abstract:
PROBLEM TO BE SOLVED: To provide a small-sized thermal ink-jet head and the manufacture thereof, in which the yield of a material is good and which also has strength. SOLUTION: A single substrate 20 has a plurality of heating elements 24, wired electrodes 21, 23 for operating these elements 24 to cause them to generate heat, an operating circuit 25, partitions 27 for forming ink passages for supplying ink onto the individual heating element 24, a common ink supply groove 29 communicating with the ink passages to supply ink to the ink passages, an ink feed hole 28 communicating with the common ink supply groove 29, and being defined so as to penetrate through the substrate 20 down to its face opposite to the face on which the heating elements 24 are disposed, to feed ink to the common ink supply groove 29 from the external side, and orifices disposed correspondingly to the heating elements 29. The thickness Sh of the substrate, the width Mw of the common ink supply groove 29, and the depth Mh thereof are formed to have the relations of Mw
Abstract:
PROBLEM TO BE SOLVED: To provide a liquid crystal display device with a touch panel whose circuit constitution is simlified by forming switching electrodes corresponding to display areas of a liquid crystal display panel 1 in the touch panel, impressing a liquid crystal driving signal on the switching electrodes and impressing the liquid crystal driving signal on liquid crystal driving electrodes of a corresponding display area while turning on switching electrodes of a depressed part when the surface of the touch panel is depressed. SOLUTION: In this liquid crystal display device 10, a touch panel unit 200 provided with a switching function is provided and bistable type ferroelectric liquid crystal is sealed in a liquid crystal display unit 300 and a liquid crystal driving signal to be generated in a liquid crystal driving circuit 100 while turning a switching function on with the depressing operation being on the touch panel 200 is transmitted to the liquid crystal display unit 300 and a display state is maintained by the memory effect of the bistable type ferroelectric liquid crystal by impressing a resultant voltage waveform by the liquid crystal driving signal on the bistable type ferroelectric liquid crystal.
Abstract:
PURPOSE:To seal a liquid crystal injection port always with a specified amt. of a sealing material. CONSTITUTION:The sealing material 16 prepd. by incorporating fillers 18 having the diameter larger somewhat than the diameter of the spacers 13 into a thermoplastic resin 17 is arranged by a screen printing method or dispensing method, etc., on the rear surface of an upper film substrate 15 in the part corresponding to the central part of the liquid crystal injection port 14 formed at a sealing material 12 disposed on a lower film substrate 11. In such a case, the amt. of the sealing material 16 to be arranged is kept always constant. The sealing material 16 is held intact and both film substrates 11, 15 are stuck to each other via the sealing material 12 when both film substrates 11, 15 are superposed on each other and are heated under a low pressure applied thereon. Next, injection of liquid crystals 6 is executed. The fillers 18 are crushed or are bitten into both film substrates 11, 15 and the thermoplastic resin 17 is softened and fluidized to hermetically close the liquid crystal injection port 14 when a high pressure is applied at the part of the sealing material 16 and the sealing material is heated.