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公开(公告)号：JP2001260364A
公开(公告)日：2001-09-25
申请号：JP2000077014
申请日：2000-03-17
Applicant: CASIO COMPUTER CO LTD
Inventor： KUMAGAI MINORU , KAMATA HIDEKI
Abstract: PROBLEM TO BE SOLVED: To provide an ink jet printer having a superior reliability without damage to a protecting film and its manufacturing method. SOLUTION: An opening part of a width D is formed in advance to a protecting film 35 of a part where an ink supply groove 45 is to be formed. Then a diaphragm 37 is formed. Thereafter a resist mask 38 for sand blasting to form the ink supply groove 45 is patterned. A pattern hole 38-1 of the resist mask 38 is set to have a width F to the inner side than an end face 35a of the opening part of the width D of the protecting film 35. The ink supply groove 45 is bored by sand blasting along the pattern hole 38-1. Conditions for the sand blasting are, e.g. an alumina abrasive grain of a particle size 20-23 μm, a jet quantity of 100 g/min, a jet pressure of 0.25 MPa and a jet distance of 100 mm. Because of a margin of a width G larger than the particle size of the abrasive grain from an end face of the resist mask 38 to the end face 35a of the protecting film 35, a hitting shock of the abrasive grain is absorbed by the resist mask 38, thereby preventing troubles such as separation of the protecting film 35 from a substrate, cracking of the protecting film, etc.
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公开(公告)号：JP2001191527A
公开(公告)日：2001-07-17
申请号：JP2000007684
申请日：2000-01-17
Applicant: CASIO COMPUTER CO LTD
Inventor： NAKAGOME KOICHI , KANEMITSU SATOSHI , ARAI KAZUYOSHI , KAMATA HIDEKI
IPC: B41J2/05
Abstract: PROBLEM TO BE SOLVED: To provide a printer head in which ink drops can be ejected uniformly and stably from all ejection nozzles by preventing a top plate from sinking. SOLUTION: A print head 35" is constituted by forming a plurality of drivers 22 of a drive circuit, individual wiring electrodes 23, heating parts 24, a common electrode 25, sub-common channels 36 dividing a common ink channel and ink supply holes 37 in a chip substrate 21, laying a barrier wall 38" and a top plate 31 thereon and then making ejection nozzles 32. The barrier wall 38" comprises seal barrier walls 38-1, 38-2 and a channel barrier wall 38-4 defining ink supply passages 41 corresponding to the sub-common channels 36, and a first long pressurizing chamber barrier wall 38-6 and a second short pressurizing chamber barrier wall 38-7 defining an ink pressurizing chamber 39 wherein the top plate 31 above the common ink channel is supported by the forward end of the first pressurizing chamber barrier wall 38-6 and the channel barrier wall 38-4.
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公开(公告)号：JPH06202148A
公开(公告)日：1994-07-22
申请号：JP34760292
申请日：1992-12-28
Applicant: CASIO COMPUTER CO LTD , OKI ELECTRIC IND CO LTD
Inventor： NOMOTO TSUTOMU , KAMATA HIDEKI , ONO ICHIRO
IPC: G02F1/136 , G02F1/1368 , H01L29/78 , H01L29/786 , H01L29/784
Abstract: PURPOSE:To provide the thin-film transistor(TFT) for a liquid crystal display device at a good yield without display defects by simple stages by preventing the overhang by ohmic barrier layers, thereby preventing line defects and spot defects and enhancing the reliability of connection to display electrodes and, a process for production of such TFT. CONSTITUTION:The drain electrode and source electrode of this TFT consist of a three-layered structure consisting of a first layer 29a of the source electrode and first layer 29b of the drain electrode which are the ohmic barrier layers with semiconductor layers 27a, 27b, a second layer 30b of the source electrode and second layer 30b of the drain electrode which consist of a low-resistance material and are main signal wiring layers, and a third layer 31a of the source electrode and third layer 31b of the drain electrode which are battery reaction preventive layers. Similarly the low-resistance data line consists of a three- layered structure consisting of a first layer data wiring 29c which is the ohmic barrier layer, a second layer data wiring 30c which consists of a low-resistance material and is the main wiring layer and a third layer data wiring 31c which is the battery reaction preventive layer.
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公开(公告)号：JPH0548101A
公开(公告)日：1993-02-26
申请号：JP23111091
申请日：1991-08-20
Applicant: CASIO COMPUTER CO LTD
Inventor： NAITO HIDEO , KAMATA HIDEKI
IPC: H01L27/12 , H01L21/336 , H01L29/78 , H01L29/786
Abstract: PURPOSE:To surely prevent the occurrence of short circuits between a gate electrode and source and drain electrodes by depositing a gate insulating film to a uniform thickness and securing the dielectric strength of the gate insulating film at a sufficiently high level near the side edges of the gate electrode. CONSTITUTION:After a base insulating film 2 is formed on a substrate 1 except a gate electrode forming area A, a metallic film 3 is formed on the substrate 1 and a gate electrode 3a is formed in the area A by etching the film 3. Then oxidized insulating layers 3b1 and 3b2 are formed by successively anodizing the side faces and upper surface of the electrode 3a. Thereafter, a gate insulating film 4 is formed on the surface of the electrode 3a after filling up the gaps between the side faces of the electrode 3a and base insulating film 2 and leveling the surface of the electrode 3a (surface of the layer 3b2) with that of the film 2.
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公开(公告)号：JPH02273719A
公开(公告)日：1990-11-08
申请号：JP9529189
申请日：1989-04-17
Applicant: CASIO COMPUTER CO LTD
Inventor： KAMATA HIDEKI
IPC: G02F1/13 , H01L21/027 , H01L21/30 , H01L21/336
Abstract: PURPOSE:To easily and efficiently form the index of a specific tile on the substrate without producing any shavings by exposing photoresist through a display part and then etching and peeling the photoresist, and thus forming the index. CONSTITUTION:A metallic film 2 is formed on the surface of the substrate (a) and coated with the photoresist 3, on which a transmission type liquid crystal display panel 4 is arranged. Then the title of an index to be provided on the surface is displayed on the display part 8 of a liquid crystal display panel 4, and the display part 8 is irradiated with light 9 for exposure from the opposite side of the photoresist, which is exposed through the display part 8. After this exposure, the photoresist is developed and the metallic film is etched to form the index of the title on the substrate. Consequently, no cutting shavings are produced and the display on the display part is only changed by controlling the liquid crystal display panel to easily and efficiently provide the index of the desired title on the substrate.
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Patent Agency Ranking
公开(公告)号：JPS62276835A
公开(公告)日：1987-12-01
申请号：JP11903986
申请日：1986-05-26
Applicant: CASIO COMPUTER CO LTD
Inventor： KAMATA HIDEKI , MIHARA ICHIRO
Abstract: PURPOSE:To form bumps easily and economically by a method wherein only the upper layer part of a conductor layer is etched to form the bumps at predetermined positions. CONSTITUTION:A metal thin plate 3 is bonded to a film substrate 1 with an adhesive layer 2 between. The metal thin plate 3 is composed of more than two types of i=metal layers which have different etching conditions and which are a Cu layer 3a, a Zn layer 3b and An A layer 3c in this order from the bottom. Then a positive type photoresist film 4 is formed and a mask 5 is provided on it for exposure. The film 4 is developed to remove the parts which do not correspond to wiring patterns 7. The upper side A layer 3c and Zn layer 3b are etched to remove unnecessary parts and the exposed parts of the Cu layer 3a are further removed by etching. In this state, a mask 6 is provided for exposure and the parts which do not correspond to bumps 8 are removed by development and the upper side A layer 3c and Zn layer 3c are etched to remove unnecessary parts. If the photoresist film 4 is removed, the bumps 8 can be formed at predetermined positions of the wiring patterns 7.
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公开(公告)号：JP2002109044A
公开(公告)日：2002-04-12
申请号：JP2000293561
申请日：2000-09-27
Applicant: CASIO COMPUTER CO LTD
Inventor： KAMATA HIDEKI
Abstract: PROBLEM TO BE SOLVED: To provide a manufacture service system of medical/health instruments or the like capable of instructing a medical instrument manufacturer to manufacture optimum medical instruments and health instruments corresponding to the symptom and physique of a user (patient). SOLUTION: This medical instrument (health instrument) manufacture service system 100 is constituted of service terminal equipment 1, the medical instrument (health instrument) manufacture service device 200 and the medical instrument (health instrument) manufacturer terminal 400 connected through a network 300. The service terminal 1 transmits the diagnostic image and diagnostic data of the patient through the network 300 to the medical instrument (health instrument) manufacture service device 200. The medical instrument (health instrument) manufacture service device 200 receives them, discriminates the diagnostic image and the diagnostic data and transmits instruction information for instructing the medical instrument manufacturer to manufacture the medical instrument corresponding to a discriminated result through the network 300 to the medical instrument (health instrument) manufacturer terminal 400.
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公开(公告)号：JP2002075964A
公开(公告)日：2002-03-15
申请号：JP2000256125
申请日：2000-08-25
Applicant: CASIO COMPUTER CO LTD
Inventor： KONO ICHIRO , KAMATA HIDEKI , KUMAGAI MINORU
IPC: B41J2/05 , B41J2/135 , H01L21/302 , H01L21/3065
Abstract: PROBLEM TO BE SOLVED: To provide an anisotropic etching method in which occurrence of an ejection nozzle having an incomplete shape or incomplete electrical connection at the electrode terminal part due to readhesion of the etching residue of metal mask is prevented. SOLUTION: An orifice plate 58 is formed on the uppermost layer of a heating part 52, a common electrode 53, a discrete interconnection electrode 54, an ink supply trench 55, an ink supply hole 56, a barrier wall 57, and the like, formed on a chip substrate 51 and a metal mask film 63 is formed thereon by sputtering thus forming a pattern 63-1. Furthermore, a nonmetallic thick resist film 64 having an etching select ratio of 1:1 with respect to the orifice plate 58 is formed thereon with the same thickness as the orifice plate 58 thus forming a pattern 64-1. Subsequently, helicon wave dry etching is performed according to the patterns 63-1 and 64-1 to make an ejection nozzle 62. The thick resist film 64 is etched substantially over the entire etching period and removed gradually and the metal mask film 63 is etched by only a small thickness d in the final stage.
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公开(公告)号：JP2002001958A
公开(公告)日：2002-01-08
申请号：JP2000187945
申请日：2000-06-22
Applicant: CASIO COMPUTER CO LTD
Inventor： KAMATA HIDEKI , KAWAMURA YOSHIHIRO
Abstract: PROBLEM TO BE SOLVED: To provide an ink jet printer head which can jet ink drips at good energy efficiency and its easy manufacturing method. SOLUTION: A bulkhead which consists of two-layer structure of a first bulkhead 34 and a second bulkhead 35 is formed so as to surround a heating part 31 from three directions, an outflow nozzle 3 is formed by laminating an orifice plate 37 on it, and an ink heating chamber 36 is formed with a shape of turned down cone and tapered toward the upside. Ink which is supplied to an ink pressurized chamber 36 through an ink supplying hole 28, an ink supplying groove 27, and an ink channel 38 and which is forced to go upside by expansion pressure of membrane bubbles generated by heating at the heating part 31 is led to a jet nozzle 39 smoothly without big channel resistance along the upside tapered inner wall of the ink pressurized chamber 36, and is jetted outside without dropping jet velocity.
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公开(公告)号：JP2001270119A
公开(公告)日：2001-10-02
申请号：JP2000084519
申请日：2000-03-24
Applicant: CASIO COMPUTER CO LTD
Inventor： SHIODA JUNJI , NAKAMURA OSAMU , KAMATA HIDEKI
Abstract: PROBLEM TO BE SOLVED: To provide a monolithic type ink jet printer head which can stably secure a good printing quality by preventing generation of bubbles because of electrolysis of ink. SOLUTION: In this ink jet printer head 35, a p-well 37 is formed to a surface layer part of an n-type silicon substrate 36 and then a logic circuit 38 and a transistor 39 for driving are formed in the p-well 37. The p-well 37 is connected to a grounded circuit. A p-n junction part 57 is formed along the periphery of the p-well 37. Between wall faces of an ink supply groove 45 and an ink supply-and-transfer hole 45 of the silicon substrate 36 and the grounded circuit inside the p-well 37 is separated by the p-n junction part 57. A voltage direction in which a current is sent from a common electrode 42 of a power supply potential VH towards the substrate grounded circuit becomes opposite to a direction of a diode effect provided in the p-n junction part 57 between the n-type silicon substrate 36 and the p-well 37. Accordingly a short-circuiting circuit via the ink and the silicon substrate 36 shown by solid line arrows 54 and 56 in Fig. is interrupted.
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