公开(公告)号：JPH0434989A

公开(公告)日：1992-02-05

申请号：JP13965490

申请日：1990-05-31

Applicant: CASIO COMPUTER CO LTD

Inventor： MUTO JIRO ,  KUWABARA OSAMU ,  ABE AKIHIKO

IPC: B41J2/345 ,  H05K3/00 ,  H05K3/40 ,  H05K3/42

Abstract: PURPOSE:To contrive the miniaturization of electrodes, such as a selective electrode and the like, and to contrive a high-density wiring and a reduction in the size of a substrate by a method wherein conductive layers, whose uppermost parts consist of a gold layer, are respectively formed on both surfaces of the substrate and a through hole which penetrates the substrate is formed at places, where respectively correspond to the electrode on the upper surface of the substrate and the electrode on the lower surface of the substrate, by performing a reactive ion etching using the metal layers of the uppermost parts as masks. CONSTITUTION:A through hole 7, through which a selective electrode 2 is connected with a connection electrode 4, can be formed at a fine hole diameter. As a result, the widths of the electrodes 2 and 4 and the interval between the electrodes 2 and 4 can be formed fine, a high-density wiring and a high-density mounting become possible and in its turn a reduction in the size of the whole film substrate 1 becomes possible. Accordingly, in this thermal printing head, a thin film heating resistance layer 11 is provided on the side of the upper surface of the substrate 1 and an IC chip 15 can be mounted on the side of the lower surface of the substrate. Thereby, even if the size of the whole substrate 1 is reduced, the chip 15 does not obstruct a platen when a heat generating part is pushed against the platen or the like and a heat-sensitive printing is performed on a recording paper and the heat-sensitive printing can favorably be conducted.

公开(公告)号：JPH0433867A

公开(公告)日：1992-02-05

申请号：JP13857790

申请日：1990-05-30

Applicant: CASIO COMPUTER CO LTD

Inventor： KUWABARA OSAMU ,  MUTO JIRO ,  ABE AKIHIKO

IPC: B41J2/335

Abstract: PURPOSE:To achieve excellent productivity by a simple structure without using a CVD method for formation of a projection part and to enable a heating part to project sufficiently by a method wherein a fiber of which an upper part projects from an upper surface of an electrode is provid-between the opposed electrodes established to each other on a substrate, and the heating part of a thin film heating resistance layer projects from other part using this fiber. CONSTITUTION:A fiber 16 of approx. 50mum in thickness is bonded to a film substrate 10 by an adhesive 17. Then, the fiber 16 is provided by projecting its upper part above from upper surfaces of respective electrodes 11, 12. Thereafter, the adhesive is dried and then, a thin film heating resistance layer 18 is formed on the fiber 16. Thereby, the thin film heating resistance 18 rides across the fiber 16, and its both ends are connected to end parts 13, 14 of the electrodes 11, 12 to be formed. Consequently, the thin film heating resistance layer 18, especially its heating part projects by a uniform height above other part by the fiber 16. Lastly a protective layer 19 for protecting the thin film heating resistance layer 18 and the electrodes 11, 12 is established on whole surfaces. This protective layer 12 is constructed of two layers.

公开(公告)号：JPH03258558A

公开(公告)日：1991-11-18

申请号：JP5641890

申请日：1990-03-09

Applicant: CASIO COMPUTER CO LTD

Inventor： YARITA YOSHIO ,  MUTO JIRO

IPC: B41J2/335

Abstract: PURPOSE:To permit a clear printing at a uniform printing density by a method wherein a heat resisting layer is given such a wavy form that it is high and low alternately according to the corresponding layer thickness of a common electrode and a signal electrode, respectively. CONSTITUTION:Since heat resisting layers 13 located in the corresponding positions of common electrodes 12 are made high and since said layers 13 located in the corresponding positions of signal electrodes 11 are made lower, at the time of heat-sensitive printing with a heat-sensitive paper 21 placed on the heat resisting layer 13, the heat- sensitive paper 21 comes in contact with only a high part 19 of each of said layers 13 located in the corresponding positions of the common electrodes 12, being out of contact with the other parts thereof. Because of this, the places at which said layers 13 make contact with the heat-sensitive paper 21 are reduced in number and the adhesiveness of the paper 21 thereto is improved. Also, since a space between their contacting places become large, a space between dots can be made narrower to some extent.m Since, in this way, the heat-sensitive paper 21 can be closely attached to the heat resisting layers 13, even if the dot space is narrow, an uneven printing is avoided at the time of printing, the printing density is uniform and a clear printing can be effected.

公开(公告)号：JPH03124460A

公开(公告)日：1991-05-28

申请号：JP26324789

申请日：1989-10-09

Applicant: CASIO COMPUTER CO LTD

Inventor： KAWAMURA YOSHIHIRO ,  GENBAN YASUO ,  MUTO JIRO

IPC: B41J2/345

Abstract: PURPOSE:To reduce the cost, enhance the productivity, and obtain a fine pitch by a method wherein a drive element is directly bonded on a wiring lead provided on a heat-resistant insulating film, and a drive signal is selectively applied to the wiring lead by said drive element to heat a heating resistor layer. CONSTITUTION:Each set of a plurality of signal electrodes 14 is arranged so as to surround each of a plurality of IC chips 4 at the right end thereof. A connecting electrode 15 is provided on the right end of a heat resistant insulating film 1 for connecting each of the IC chips 4 to an external circuit. A heating resistor layer 3 made of a conductive ink, such as carbon black, is formed in each gap part 12 of a wiring lead 2 with a thickness larger than that of the wiring lead 2 by printing, roll coating, or the like. In addition, the heating resistor layer 3 is slightly overlapped on the signal electrodes 14 and a common electrode 13 so as to electrically connect the both electrodes. Therefore, an electric current passes through the heating resistor layer 3 when a drive signal is imparted from the IC chip 4 to the signal electrode 14, and the heating resistor layer 3 generates heat by Joule heat.

公开(公告)号：JPH03124456A

公开(公告)日：1991-05-28

申请号：JP26325089

申请日：1989-10-09

Applicant: CASIO COMPUTER CO LTD

Inventor： KAWAMURA YOSHIHIRO ,  GENBAN YASUO ,  MUTO JIRO

IPC: B41J2/335

Abstract: PURPOSE:To use a low-cost material, obtain a superior productivity, and to apply a heating part on recording paper or the like in a simple and positive manner by a method wherein a thermal head substrate is folded out at a position of a heating resistor layer with an insulating protective film disposed outside, and a support body is provided on the folded part to support the thermal head substrate. CONSTITUTION:When an actuation signal is imparted to a drive chip 4 from an external circuit through a connection electrode 16 of a wiring lead 2, a drive signal is outputted from the drive chip 4 to each signal electrode 15 of the wiring lead 2. In this manner, an electric current passes through a heating resistor layer 3, and the heating resistor layer 3 is selectively heated by a Joule heat. This heat is transmitted to a thermal ink sheet through an insulating protective film 5 and melts the ink in the thermal ink sheet corresponding to the heating resistor layer 3 which has been heated. In this manner, the ink in the thermal ink sheet is transferred to recording paper, whereby a thermal recording is conducted. At this time, since the part of the heating resistor layer 3 is positively pressed down against the recording paper through the thermal ink sheet, transfer of the melted ink can be ensured, and a sharp thermal recording can be performed.