13.
    发明专利
    未知

    公开(公告)号:AT527685T

    公开(公告)日:2011-10-15

    申请号:AT04741702

    申请日:2004-06-02

    Abstract: The invention relates to processes for producing low-k dielectric films on semiconductors or electrical circuits, which comprises using incompletely condensed polyhedral oligomeric silsesquioxanes of the formula [(R a X b SiO 1.5 ) m (R c Y d SiO) n ] with: a, b=0-1; c, d=1; m+n>=3; a+b=1; n, m>=1, R=hydrogen atom or alkyl, cycloalkyl, alkenyl, cycloalkenyl, alkynyl, cycloalkynyl, aryl or heteroaryl group, in each case substituted or unsubstituted, X=an oxy, hydroxyl, alkoxy, carboxyl, silyl, silyloxy, halogen, epoxy, ester, fluoroalkyl, isocyanate, acrylate, methacrylate, nitrile, amino or phosphine group or substituents of type R containing at least one such group of type X, Y=hydroxyl, alkoxy or a substituent of type O-SiZ 1 Z 2 Z 3 , where Z 1 , Z 2 and Z 3 are fluoroalkyl, alkoxy, silyloxy, epoxy, ester, acrylate, methacrylate or a nitrile group or substituents of type R and are identical or different, not only the substituents of type R being identical or different but also the substituents of type X and Y in each case being identical or different, and comprising at least one hydroxyl group as substituent of type Y, for producing the film, and to low-k dielectric films produced by this process.

    16.
    发明专利
    未知

    公开(公告)号:DE10331794A1

    公开(公告)日:2005-02-03

    申请号:DE10331794

    申请日:2003-07-11

    Applicant: DEGUSSA

    Abstract: Radiation-curable coating powder composition based on radiation-curable binders and conventional additives also contains compounds with polyhedral, oligomeric silicon-oxygen cluster units. Radiation-curable coating powder compositions (CPC) comprising (I) a binder containing radiation-crosslinkable compound(s), (II) compound(s) of the following formula with polyhedral, oligomeric silicon-oxygen cluster units (POSO units), in which [Image] a, b, c : 0-1; d : 1-2; e, f, g : 0-3; h : 1-4; (m+n+o+p) : 4 or more; (a+b) : 1; (c+d) : 2; (e+f) : 3; (g+h) : 4; R : H, alkyl, cycloalkyl, alkenyl, cycloalkenyl, alkynyl, cycloalkynyl, aryl, heteroaryl or polymer units (all optionally substituted), or other functionalised POSO units linked via a polymer unit or a bridging unit; X : oxy, hydroxy, alkoxy, carboxy, silyl, alkylsilyl, alkoxysilyl, siloxy, alkylsiloxy, alkoxysiloxy, silylalkyl, alkoxysilylalkyl, alkylsilylalkyl, halogen, epoxy, ester, fluoroalkyl, optionally blocked isocyanate, (meth)acrylate, nitrile, amino, phosphino, or groups R substituted with the above groups X and (III) additives and auxiliary materials. Independent claims are also included for (1) a method for the production of CPC by compounding the above components at up to 140[deg]C in a heatable kneader, especially an extruder (2) a method for the production of coatings by using CPC as above (3) coatings made from CPC as above.

    17.
    发明专利
    未知

    公开(公告)号:DE10330022A1

    公开(公告)日:2005-01-20

    申请号:DE10330022

    申请日:2003-07-03

    Applicant: DEGUSSA

    Abstract: The invention relates to processes for producing low-k dielectric films on semiconductors or electrical circuits, which comprises using incompletely condensed polyhedral oligomeric silsesquioxanes of the formula [(R a X b SiO 1.5 ) m (R c Y d SiO) n ] with: a, b=0-1; c, d=1; m+n>=3; a+b=1; n, m>=1, R=hydrogen atom or alkyl, cycloalkyl, alkenyl, cycloalkenyl, alkynyl, cycloalkynyl, aryl or heteroaryl group, in each case substituted or unsubstituted, X=an oxy, hydroxyl, alkoxy, carboxyl, silyl, silyloxy, halogen, epoxy, ester, fluoroalkyl, isocyanate, acrylate, methacrylate, nitrile, amino or phosphine group or substituents of type R containing at least one such group of type X, Y=hydroxyl, alkoxy or a substituent of type O-SiZ 1 Z 2 Z 3 , where Z 1 , Z 2 and Z 3 are fluoroalkyl, alkoxy, silyloxy, epoxy, ester, acrylate, methacrylate or a nitrile group or substituents of type R and are identical or different, not only the substituents of type R being identical or different but also the substituents of type X and Y in each case being identical or different, and comprising at least one hydroxyl group as substituent of type Y, for producing the film, and to low-k dielectric films produced by this process.

    Preparation of composition comprising functionalized silasesquioxane, comprises modifying aminosilane compound with acid, and converting modified aminosilane compound with silane compound

    公开(公告)号:DE102005024814A1

    公开(公告)日:2006-11-30

    申请号:DE102005024814

    申请日:2005-05-27

    Applicant: DEGUSSA

    Inventor: KUEHNLE ADOLF

    Abstract: Preparation of a composition comprising functionalized silsesquioxane comprises modifying aminosilane compound with an acid; and converting modified aminosilane compound with silane compound to obtain functionalized polyhedral silsesquioxane, where the velocity constant of the aminosilane and silane compound is modified. Preparation of a composition exhibiting functionalized silsesquioxane comprises modifying amino silane compound of formula (AmSiY1>n) with an acid; and converting modified aminosilane compound with silane compound of formula ((RaXb)mSiY1>n) to obtain functionalized silsesquioxane, where the velocity constant of the aminosilane and silane compound is modified. Either a, b : 0-1; and m, n : 1-3; a+b : 1; or m+n : 4; A : amino or substituted amino group of type R; R, : H, (cyclo)alkyl-, (cyclo)alkenyl-, cycloalkynyl-, or (hetero)aryl (optionally substituted); X : oxy, OH, alkoxy, carboxy, (alkyl)silyl, alkoxysilyl, (alkyl)siloxy, alkoxysiloxy, silylalkyl, alkoxysilylalkyl, alkylsilylalkyl, halo, epoxy, ester, fluoroalkyl, blocked isocyanate, (meth)acrylate, mercapto-nitrile, phosphino group or at least such a group of the type X of exhibits substituted type R; and Y1>OH, ONa, OK, OR1>, OCOR1>, OSiR3, Cl, Br, I or NR2. R1>R. Independent claims are included for: (1) a composition of functionalized polyhedral oligomer silsesquioxane compound of formula ((RaXbA1>rSiO1.5)m(RcXdA1>sSiO)n); and (2) a functionalized polyhedral oligomer silsesquioxane compound. Either a, b, c, r : 0-1; and d, s : 0-2; or m+n+o+p : 4-14; a+b+r : 1; c+d+s : 2 (where r+s is >= 1); and A1>amino, ammonium or substituted ammonium group with the type R.

    20.
    发明专利
    未知

    公开(公告)号:DE10331787A1

    公开(公告)日:2005-02-17

    申请号:DE10331787

    申请日:2003-07-11

    Applicant: DEGUSSA

    Abstract: Functional isocyanate compounds obtained by reacting polyisocyanates with polyhedral, oligomeric silicon-oxygen cluster compounds containing groups which react with isocyanate, so that 1-20 mol% of the original isocyanate groups undergo conversion (or 80-99 mol% if a blocking agent is used). NCO-containing compounds (I) with covalently-bonded, polyhedral, oligomeric silicon-oxygen cluster units (POSO) formed by the reaction of (A) aromatic, aliphatic and/or cycloaliphatic polyisocyanate(s) with an NCO functionality of 2-6 with (B) 0.001-20.0 wt.% POSO units containing NCO-reactive functional groups, with 1-20 mol% conversion based on originally-present free NCO groups and optionally (C) a blocking agent, with 80-99 mol% conversion of NCO groups. Independent claims are also included for: (1) paint containing (I) as crosslinker, with at least one polyol component (2) coatings obtained with this paint.

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