公开(公告)号：EP2067550A4

公开(公告)日：2012-07-25

申请号：EP07807430

申请日：2007-09-11

Applicant: DOWA ELECTRONICS MATERIALS CO

Inventor： OGI KOZO ,  OKANO TAKU

IPC: B22F1/00 ,  B22F9/24 ,  H01B1/22 ,  H01B5/00 ,  H01B5/14 ,  H01B13/00 ,  H01L51/00 ,  H05K1/09

CPC classification number: B82Y30/00 ,  B22F1/0022 ,  B22F1/0062 ,  B22F9/24 ,  B22F2998/00 ,  H01B1/02 ,  H01B1/22 ,  H05K1/097 ,  H05K2201/0224 ,  H05K2201/0266 ,  H05K2203/1131

公开(公告)号：EP2119518A4

公开(公告)日：2013-04-17

申请号：EP08703172

申请日：2008-01-08

Applicant: DOWA ELECTRONICS MATERIALS CO

Inventor： SATO KIMITAKA ,  OKANO TAKU

IPC: B22F1/02 ,  B22F1/00 ,  B22F9/24 ,  B82Y30/00 ,  B82Y40/00 ,  C09D11/00 ,  C09D11/38 ,  C09D11/52 ,  H01B1/22 ,  H01B5/00 ,  H01B13/00 ,  H01L21/288

CPC classification number: B22F9/24 ,  B22F1/0007 ,  B22F1/0022 ,  B22F1/0062 ,  B82Y30/00 ,  C09D11/30 ,  C09D11/36 ,  C09D11/52 ,  H01B1/02 ,  H01B1/22 ,  H05K1/097 ,  H05K2201/0224 ,  Y10T428/2982 ,  Y10T428/2991 ,  Y10T428/2998

公开(公告)号：EP2233230A4

公开(公告)日：2012-02-01

申请号：EP08869325

申请日：2008-12-25

Applicant: DOWA ELECTRONICS MATERIALS CO

Inventor： SATO KIMITAKA ,  OKANO TAKU ,  NAKANOYA TARO

IPC: B22F1/02 ,  B22F1/00 ,  B22F9/24 ,  B82Y20/00 ,  B82Y30/00 ,  B82Y40/00 ,  B82Y99/00 ,  C09C1/62 ,  C09C3/08 ,  C09D1/00 ,  C09D5/24 ,  C09D7/12 ,  C09D11/00 ,  C09D11/52 ,  C09D201/00 ,  H01B1/22 ,  H01B5/00 ,  H01B13/00

CPC classification number: C09C1/62 ,  B22F1/0018 ,  B22F1/0022 ,  B22F9/24 ,  B22F2998/00 ,  B22F2999/00 ,  B82Y30/00 ,  C01P2002/88 ,  C01P2004/04 ,  C01P2004/64 ,  C01P2006/40 ,  C09D5/24 ,  C09D11/52 ,  H01B1/22 ,  Y10T428/2991 ,  B22F2301/255 ,  B22F2304/054 ,  B22F1/0059

Abstract: Provided is a silver micropowder coated with a protective material and capable of more drastically reducing the sintering temperature than before. The silver micropowder comprises silver particles processed to adsorb hexylamine (C 6 H 13 -NH 2 ) on the surfaces thereof and having a mean particle diameter D TEM of from 3 to 20 nm or an X-ray crystal particle diameter D X of from 1 to 20 nm. The silver micropowder has the property of forming a conductive film having a specific resistivity of not more than 25 µ©·cm when it is mixed with an organic medium to prepare a silver coating material and when a coating film formed of it is fired in air at 120°C. Even when fired at 100°C, it may form a conductive film having a specific resistivity of not more than 25 µ©·cm. The silver micropowder can be produced by mixing a silver particle dispersion, as monodispersed in an organic medium, of silver particles coated with a primary amine A having an unsaturated bond and having a molecular weight of from 200 to 400, and hexylamine, and then keeping the mixture at 5 to 80°C with stirring to thereby form precipitated particles.