公开(公告)号：US20180117730A1

公开(公告)日：2018-05-03

申请号：US15790733

申请日：2017-10-23

Applicant: EBARA CORPORATION

Inventor： Osamu NABEYA ,  Makoto FUKUSHIMA ,  Keisuke NAMIKI ,  Shingo TOGASHI ,  Satoru YAMAKI ,  Masahiko KISHIMOTO ,  Tomoko OWADA

IPC: B24B37/30

CPC classification number: B24B37/30 ,  B24B37/32

Abstract: A substrate holding apparatus which can adjust polishing profile precisely is disclosed. The substrate holding apparatus includes an elastic membrane that forms a plurality of pressure chambers for pressing a substrate, and a head body to which the elastic membrane is coupled. The elastic membrane includes a contact portion to be brought into contact with the substrate for pressing the substrate against a polishing pad, an edge circumferential wall extending upwardly from a peripheral edge of the contact portion, and a plurality of inner circumferential walls arranged radially inwardly of the edge circumferential wall and extending upwardly from the contact portion. At least two adjacent inner circumferential walls of the plurality of inner circumferential walls include slope circumferential walls inclined radially inwardly. The slope circumferential walls are inclined radially inwardly in their entirety from their lower ends to upper ends, and extend upwardly.

公开(公告)号：US20170173756A1

公开(公告)日：2017-06-22

申请号：US15378761

申请日：2016-12-14

Applicant: EBARA CORPORATION

Inventor： Satoru YAMAKI ,  Hozumi YASUDA ,  Keisuke NAMIKI ,  Osamu NABEYA ,  Makoto FUKUSHIMA ,  Shingo TOGASHI ,  Shintaro ISONO

IPC: B24B37/005 ,  B24B37/20

CPC classification number: B24B37/005 ,  B24B37/20

Abstract: A polishing object is prevented from slipping out without depending on the process type or the polishing condition. A polishing apparatus for polishing a surface to be polished of an polishing object by sliding the surface to be polished and a polishing member relative to each other, including: a pressing unit that presses a back surface of the surface to be polished of the polishing object such that the surface to be polished is pressed against the polishing member; a retainer member that is arranged on an outer side of the pressing unit and presses the polishing member; a storage unit that stores information concerning a condition for preventing the polishing object from slipping out, the condition being defined by use of information concerning a pressing force of the retainer member; and a control unit that acquires information concerning a force of friction between the surface to be polished of the polishing object and the polishing member or information concerning the pressing force of the retainer member, and executes control for adapting to the condition for preventing the slipping-out by using the acquired information concerning the force of friction or the acquired information concerning the pressing force of the retainer member.

公开(公告)号：US20170050289A1

公开(公告)日：2017-02-23

申请号：US15234058

申请日：2016-08-11

Applicant: Ebara Corporation

Inventor： Hiroyuki SHINOZAKI ,  Makoto FUKUSHIMA ,  Osamu NABEYA

IPC: B24B37/30 ,  H01L21/683 ,  H01L21/67 ,  B24B37/11

Abstract: A method includes: vacuuming at least one area among a plurality of areas formed concentrically between a top face of the elastic film and the top ring body under a state where a bottom face of the substrate is supported by a support member and a top face of the substrate contacts a bottom face of the elastic film; measuring a flow volume of gas in an area located outside one or more areas to be vacuumed; determining whether the substrate is adsorbed to the top ring based on the flow volume of the gas; and after it is determined that the substrate is adsorbed to the top ring, separating the elastic film to which the substrate is adsorbed from the support member.

Abstract translation: 一种方法包括：在基板的底面被支撑构件支撑的状态下，将弹性膜的顶面和顶环体之间同心地形成的多个区域中的至少一个区域抽真空， 基板接触弹性膜的底面; 测量位于要被抽真空的一个或多个区域外的区域中的气体的流量; 基于气体的流量确定衬底是否被吸附到顶环; 并且在确定衬底被吸附到顶环之后，将从衬底吸附的弹性膜从支撑构件分离。

公开(公告)号：US20140329446A1

公开(公告)日：2014-11-06

申请号：US14332357

申请日：2014-07-15

Applicant: EBARA CORPORATION

Inventor： Osamu NABEYA ,  Tetsuji TOGAWA ,  Makoto FUKUSHIMA ,  Hozumi YASUDA

IPC: B24B37/005 ,  B24B49/00 ,  B24B37/10

CPC classification number: B24B37/20 ,  B24B37/005 ,  B24B37/042 ,  B24B37/10 ,  B24B37/105 ,  B24B37/30 ,  B24B37/32 ,  B24B47/22 ,  B24B49/00 ,  B24B49/16 ,  B24B49/18 ,  B24B49/183

Abstract: A polishing apparatus has a polishing pad, a top ring for holding a semiconductor wafer, and a vertical movement mechanism operable to move the top ring in a vertical direction. The polishing apparatus also has a distance measuring sensor operable to detect a position of the top ring when a lower surface of the top ring is brought into contact with the polishing pad, and a controller operable to calculate an optimal position of the top ring to polish the semiconductor wafer based on the position detected by the distance measuring sensor. The vertical movement mechanism includes a ball screw mechanism operable to move the top ring to the optimal position.

公开(公告)号：US20140302754A1

公开(公告)日：2014-10-09

申请号：US14312641

申请日：2014-06-23

Applicant: EBARA CORPORATION

Inventor： Osamu NABEYA ,  Tetsuji TOGAWA ,  Makoto FUKUSHIMA ,  Hozumi YASUDA

IPC: B24B37/32

CPC classification number: B24B37/20 ,  B24B37/005 ,  B24B37/10 ,  B24B37/105 ,  B24B37/30 ,  B24B37/32 ,  B24B47/22 ,  B24B49/00 ,  B24B49/16

Abstract: A polishing apparatus has a polishing pad, a top ring for holding a semiconductor wafer, and a vertical movement mechanism operable to move the top ring in a vertical direction. The polishing apparatus also has a distance measuring sensor operable to detect a position of the top ring when a lower surface of the top ring is brought into contact with the polishing pad, and a controller operable to calculate an optimal position of the top ring to polish the semiconductor wafer based on the position detected by the distance measuring sensor. The vertical movement mechanism includes a ball screw mechanism operable to move the top ring to the optimal position.

公开(公告)号：US20230065029A1

公开(公告)日：2023-03-02

申请号：US17895925

申请日：2022-08-25

Applicant: EBARA CORPORATION

Inventor： Osamu NABEYA ,  Shingo TOGASHI

IPC: B24B37/26 ,  B24B37/04 ,  B24B37/24 ,  B29C35/02 ,  B29C43/02

Abstract: An elastic membrane having a physical property required for each portion of the elastic membrane and capable of uniformly polishing a workpiece is disclosed. The elastic membrane includes: a contact portion having a workpiece pressing surface for pressing a workpiece against a polishing surface; and a partition wall extending upward from the contact portion and forming a pressure chamber. The contact portion and at least a part of the partition wall are composed of a first rubber structure and a second rubber structure which are integrally formed, the first rubber structure has a first hardness, and the second rubber structure has a second hardness lower than the first hardness, the first rubber structure includes the workpiece pressing surface, and the second rubber structure includes the at least a part of the partition wall.

公开(公告)号：US20230026543A1

公开(公告)日：2023-01-26

申请号：US17812738

申请日：2022-07-15

Applicant: EBARA CORPORATION

Inventor： Osamu NABEYA ,  Kenichi AKAZAWA

IPC: B24B37/005 ,  B24B57/02 ,  B24B49/12 ,  B24B49/16

Abstract: A break-in processing apparatus is disclosed, which can reliably perform a break-in process for an elastic membrane without reducing a utilization rate of a polishing apparatus. The break-in processing apparatus includes a stage to which an elastic membrane assembly including a carrier and an elastic membrane attached to the carrier is placed; a break-in determination module facing the elastic membrane placed to the stage; a fluid supply unit configured to supply a pressurized fluid into a pressure chamber formed between the outermost periphery portion of the elastic membrane and the carrier; and a controller configured to control operations of the break-in determination module and the fluid supply unit. The controller determines a completion of a break-in process of the elastic membrane based on a load applied to the break-in determination module by the elastic membrane which is expanded by the pressurized fluid supplied into the pressure chamber.

公开(公告)号：US20190224808A1

公开(公告)日：2019-07-25

申请号：US16374590

申请日：2019-04-03

Applicant: EBARA CORPORATION

Inventor： Osamu NABEYA ,  Tetsuji TOGAWA ,  Makoto FUKUSHIMA ,  Hozumi YASUDA

IPC: B24B37/20 ,  B24B49/18 ,  B24B37/04 ,  B24B37/10 ,  B24B49/00 ,  B24B37/30 ,  B24B37/005 ,  B24B37/32 ,  B24B49/16 ,  B24B47/22

Abstract: A polishing apparatus has a polishing pad, a top ring for holding a semiconductor wafer, and a vertical movement mechanism operable to move the top ring in a vertical direction. The polishing apparatus also has a distance measuring sensor operable to detect a position of the top ring when a lower surface of the top ring is brought into contact with the polishing pad, and a controller operable to calculate an optimal position of the top ring to polish the semiconductor wafer based on the position detected by the distance measuring sensor. The vertical movement mechanism includes a ball screw mechanism operable to move the top ring to the optimal position.

公开(公告)号：US20170266779A1

公开(公告)日：2017-09-21

申请号：US15458513

申请日：2017-03-14

Applicant: EBARA CORPORATION

Inventor： Shintaro ISONO ,  Hozumi YASUDA ,  Keisuke NAMIKI ,  Osamu NABEYA ,  Makoto FUKUSHIMA ,  Shingo TOGASHI ,  Satoru YAMAKI

IPC: B24B37/04 ,  B24B37/32 ,  B24B37/20

CPC classification number: B24B37/042 ,  B24B37/20 ,  B24B37/32

Abstract: According to one embodiment, a substrate polishing method includes: conveying a substrate to a position above a polishing pad by sucking the substrate by a first region of an elastic film; polishing the substrate while bringing the substrate into contact with the polishing pad; and lifting off the substrate by sucking the substrate by a second region of the elastic film, the second region being larger than the first region.

公开(公告)号：US20170252894A1

公开(公告)日：2017-09-07

申请号：US15601575

申请日：2017-05-22

Applicant: EBARA CORPORATION

Inventor： Mitsuru MIYAZAKI ,  Seiji KATSUOKA ,  Naoki MATSUDA ,  Junji KUNISAWA ,  Kenichi KOBAYASHI ,  Hiroshi SOTOZAKI ,  Hiroyuki SHINOZAKI ,  Osamu NABEYA ,  Shinya MORISAWA ,  Takahiro OGAWA ,  Natsuki MAKINO

IPC: B24B37/34 ,  H01L21/677 ,  H01L21/306 ,  H01L21/67

CPC classification number: B24B37/345 ,  H01L21/30625 ,  H01L21/67219 ,  H01L21/67739 ,  H01L21/67742 ,  H01L21/67754 ,  Y10T137/0318 ,  Y10T137/8593

Abstract: An apparatus for processing a substrate is disclosed. The apparatus includes a polishing section configured to polish a substrate, a transfer mechanism configured to transfer the substrate, and a cleaning section configured to clean and dry the polished substrate. The cleaning section has plural cleaning lines for cleaning plural substrates. The plural cleaning lines have plural cleaning modules and plural transfer robots for transferring the substrates.