公开(公告)号：US20170252894A1

公开(公告)日：2017-09-07

申请号：US15601575

申请日：2017-05-22

Applicant: EBARA CORPORATION

Inventor： Mitsuru MIYAZAKI ,  Seiji KATSUOKA ,  Naoki MATSUDA ,  Junji KUNISAWA ,  Kenichi KOBAYASHI ,  Hiroshi SOTOZAKI ,  Hiroyuki SHINOZAKI ,  Osamu NABEYA ,  Shinya MORISAWA ,  Takahiro OGAWA ,  Natsuki MAKINO

IPC: B24B37/34 ,  H01L21/677 ,  H01L21/306 ,  H01L21/67

CPC classification number: B24B37/345 ,  H01L21/30625 ,  H01L21/67219 ,  H01L21/67739 ,  H01L21/67742 ,  H01L21/67754 ,  Y10T137/0318 ,  Y10T137/8593

Abstract: An apparatus for processing a substrate is disclosed. The apparatus includes a polishing section configured to polish a substrate, a transfer mechanism configured to transfer the substrate, and a cleaning section configured to clean and dry the polished substrate. The cleaning section has plural cleaning lines for cleaning plural substrates. The plural cleaning lines have plural cleaning modules and plural transfer robots for transferring the substrates.

公开(公告)号：US20150151398A1

公开(公告)日：2015-06-04

申请号：US14618426

申请日：2015-02-10

Applicant: EBARA CORPORATION

Inventor： Masaya SEKI ,  Tetsuji TOGAWA ,  Masayuki NAKANISHI ,  Naoki MATSUDA ,  Atsushi YOSHIDA

IPC: B24B21/00 ,  B24B21/20

CPC classification number: B24B21/002 ,  B24B9/065 ,  B24B21/004 ,  B24B21/006 ,  B24B21/008 ,  B24B21/20

Abstract: The polishing apparatus has a polishing unit capable of polishing a peripheral portion of the substrate to form a right-angled cross section. The polishing apparatus includes: a substrate holder that holds and rotates the substrate; guide rollers that support a polishing tape; and a polishing head having a pressing member that presses an edge of the polishing tape against the peripheral portion of the substrate from above. The guide rollers are arranged such that the polishing tape extends parallel to a tangential direction of the substrate and a polishing surface of the polishing tape is parallel to a surface of the substrate. The substrate holder includes: a holding stage that holds the substrate; and a supporting stage that supports a lower surface of the peripheral portion of the substrate in its entirety. The supporting stage rotates in unison with the holding stage.

Abstract translation: 抛光装置具有能够抛光基板的周边部分以形成直角横截面的抛光单元。 抛光装置包括：保持和旋转衬底的衬底保持器; 支撑抛光带的导辊; 以及抛光头，其具有从上方将研磨带的边缘压靠在基板的周边部分的按压部件。 引导辊布置成使得抛光带平行于基板的切线方向延伸，并且抛光带的抛光表面平行于基板的表面。 基板保持器包括：保持基板的保持台; 以及支撑台，其整体地支撑基板的周边部分的下表面。 支撑台与保持台一致地旋转。

公开(公告)号：US20140302676A1

公开(公告)日：2014-10-09

申请号：US14309152

申请日：2014-06-19

Applicant: Ebara Corporation

Inventor： Mitsuru MIYAZAKI ,  Seiji KATSUOKA ,  Naoki MATSUDA ,  Junji KUNISAWA ,  Kenichi KOBAYASHI ,  Hiroshi SOTOZAKI ,  Hiroyuki SHINOZAKI ,  Osamu NABEYA ,  Shinya MORISAWA ,  Takahiro OGAWA ,  Natsuki MAKINO

IPC: H01L21/67 ,  H01L21/306

CPC classification number: B24B37/345 ,  H01L21/30625 ,  H01L21/67219 ,  H01L21/67739 ,  H01L21/67742 ,  H01L21/67754 ,  Y10T137/0318 ,  Y10T137/8593

Abstract: An apparatus for processing a substrate is disclosed. The apparatus includes a polishing section configured to polish a substrate, a transfer mechanism configured to transfer the substrate, and a cleaning section configured to clean and dry the polished substrate. The cleaning section has plural cleaning lines for cleaning plural substrates. The plural cleaning lines have plural cleaning modules and plural transfer robots for transferring the substrates.

Abstract translation: 公开了一种用于处理衬底的设备。 该装置包括：抛光部，其被配置为对基板进行抛光;移动机构，被配置为传送基板;以及清洁部，其构造成清洁和干燥被研磨的基板。 清洗部具有多个用于清洗多个基板的清洗线。 多个清洁线具有多个清洁模块和用于传送基板的多个传送机器人。

公开(公告)号：US20150050863A1

公开(公告)日：2015-02-19

申请号：US14530589

申请日：2014-10-31

Applicant: EBARA CORPORATION

Inventor： Mitsuru MIYAZAKI ,  Seiji KATSUOKA ,  Naoki MATSUDA ,  Junji KUNISAWA ,  Kenichi KOBAYASHI ,  Hiroshi SOTOZAKI ,  Hiroyuki SHINOZAKI ,  Osamu NABEYA ,  Shinya MORISAWA ,  Takahiro OGAWA ,  Natsuki MAKINO

IPC: B24B37/34 ,  H01L21/677 ,  H01L21/67

CPC classification number: B24B37/345 ,  H01L21/30625 ,  H01L21/67219 ,  H01L21/67739 ,  H01L21/67742 ,  H01L21/67754 ,  Y10T137/0318 ,  Y10T137/8593

Abstract: An apparatus for processing a substrate is disclosed. The apparatus includes a polishing section configured to polish a substrate, a transfer mechanism configured to transfer the substrate, and a cleaning section configured to clean and dry the polished substrate. The cleaning section has plural cleaning lines for cleaning plural substrates. The plural cleaning lines have plural cleaning modules and plural transfer robots for transferring the substrates.

Abstract translation: 公开了一种用于处理衬底的设备。 该装置包括：抛光部，其被配置为对基板进行抛光;移动机构，被配置为传送基板;以及清洁部，其构造成清洁和干燥被抛光的基板。 清洗部具有多个用于清洗多个基板的清洗线。 多个清洁线具有多个清洁模块和用于传送基板的多个传送机器人。