公开(公告)号：US20180345452A1

公开(公告)日：2018-12-06

申请号：US15776733

申请日：2016-10-11

Applicant: EBARA CORPORATION

Inventor： Hideo AIZAWA ,  Junji KUNISAWA ,  Mitsuru MIYAZAKI ,  Naoki TOYOMURA

IPC: B24B41/047

CPC classification number: B24B41/047 ,  H01L21/304

Abstract: In-plane uniformity of buff processing is improved. According to a first form, a buff processing device for executing buff processing of a substrate is provided. Such buff processing device has a rotatable shaft, a buff head body, a torque transmission mechanism for transmitting rotation of the shaft to the buff head body, and an elastic member for elastically supporting the buff head body in a longitudinal direction of the shaft.

公开(公告)号：US20170236730A1

公开(公告)日：2017-08-17

申请号：US15432471

申请日：2017-02-14

Applicant: EBARA CORPORATION

Inventor： Akira IMAMURA ,  Mitsuru MIYAZAKI ,  Junji KUNISAWA ,  Shunsuke MATSUZAWA

IPC: H01L21/67 ,  H01L21/687 ,  B08B3/02 ,  B08B1/04 ,  B08B3/08

CPC classification number: H01L21/67051 ,  H01L21/67046 ,  H01L21/67253 ,  H01L21/68728

Abstract: A substrate cleaning apparatus comprises: a cleaning member 11,21 that comes into contact with a substrate W and cleans the substrate W; a member rotating unit 15, 25 that rotates the cleaning member 11, 21; a pressing drive unit 19, 29 that presses the cleaning member 11, 21 against the substrate W; a torque detecting unit 16, 26 for detecting torque applied to the member rotating unit 15, 25; and a control unit 50 that controls pressing force on the basis of a result of detection by the torque detecting unit 16, 26.

公开(公告)号：US20140302676A1

公开(公告)日：2014-10-09

申请号：US14309152

申请日：2014-06-19

Applicant: Ebara Corporation

Inventor： Mitsuru MIYAZAKI ,  Seiji KATSUOKA ,  Naoki MATSUDA ,  Junji KUNISAWA ,  Kenichi KOBAYASHI ,  Hiroshi SOTOZAKI ,  Hiroyuki SHINOZAKI ,  Osamu NABEYA ,  Shinya MORISAWA ,  Takahiro OGAWA ,  Natsuki MAKINO

IPC: H01L21/67 ,  H01L21/306

CPC classification number: B24B37/345 ,  H01L21/30625 ,  H01L21/67219 ,  H01L21/67739 ,  H01L21/67742 ,  H01L21/67754 ,  Y10T137/0318 ,  Y10T137/8593

Abstract: An apparatus for processing a substrate is disclosed. The apparatus includes a polishing section configured to polish a substrate, a transfer mechanism configured to transfer the substrate, and a cleaning section configured to clean and dry the polished substrate. The cleaning section has plural cleaning lines for cleaning plural substrates. The plural cleaning lines have plural cleaning modules and plural transfer robots for transferring the substrates.

Abstract translation: 公开了一种用于处理衬底的设备。 该装置包括：抛光部，其被配置为对基板进行抛光;移动机构，被配置为传送基板;以及清洁部，其构造成清洁和干燥被研磨的基板。 清洗部具有多个用于清洗多个基板的清洗线。 多个清洁线具有多个清洁模块和用于传送基板的多个传送机器人。

公开(公告)号：US20180337072A1

公开(公告)日：2018-11-22

申请号：US15978320

申请日：2018-05-14

Applicant: Ebara Corporation

Inventor： Hisajiro NAKANO ,  Junji KUNISAWA

IPC: H01L21/67

CPC classification number: H01L21/67046 ,  H01L21/67034 ,  H01L21/67051 ,  H01L21/67219 ,  H01L21/67742 ,  H01L21/68728 ,  H01L21/68785

Abstract: A substrate cleaning apparatus and related apparatuses/methods are disclosed. In one embodiment, a substrate cleaning apparatus includes: a first spindle group including a first driving spindle having a first driving roller configured to rotate a substrate and an idler spindle having a driven roller rotated by the substrate; a second spindle group including a plurality of second driving spindles each having a second driving roller configured to rotate the substrate; a cleaning mechanism configured to clean the substrate rotated by the first driving roller and the plurality of second driving rollers; and a rotation detector configured to detect the rotational speed of the driven roller. The driven roller is positioned on the opposite side to a direction in which the substrate receives a force from the cleaning mechanism.

公开(公告)号：US20180090347A1

公开(公告)日：2018-03-29

申请号：US15715847

申请日：2017-09-26

Applicant: EBARA CORPORATION

Inventor： Yoshitaka KITAGAWA ,  Hisajiro NAKANO ,  Junji KUNISAWA

IPC: H01L21/67 ,  H01L21/02 ,  B08B1/04

CPC classification number: H01L21/67092 ,  A46B13/02 ,  B08B1/04 ,  H01L21/02096 ,  H01L21/6704 ,  H01L21/67046 ,  H01L21/67219 ,  H01L21/67253

Abstract: A substrate cleaning apparatus for bringing an elongated roll cleaning member into sliding contact with a flat plate type substrate to perform cleaning processing on the substrate includes a roll holder for supporting the roil cleaning member so that the roll cleaning member is rotatable, an elevating mechanism that has a linking member for supporting the roll holder, and moves the roll holder up and down so that the roll cleaning member applies a predetermined roll load to the substrate, a sensor member that is provided to the linking member and measures frictional force between the roll cleaning member and the substrate, and a controller for performing feedback control on the frictional force between the roll cleaning member and the substrate based on a measured value of the sensor member.

公开(公告)号：US20150221536A1

公开(公告)日：2015-08-06

申请号：US14677479

申请日：2015-04-02

Applicant: EBARA CORPORATION

Inventor： Toshio YOKOYAMA ,  Junji KUNISAWA ,  Mitsuru MIYAZAKI ,  Kenichi SUZUKI ,  Hiroshi SOTOZAKI

IPC: H01L21/677 ,  B25J11/00

CPC classification number: H01L21/67718 ,  B25J11/0095 ,  H01L21/6704 ,  H01L21/67173 ,  H01L21/67196 ,  H01L21/67219 ,  H01L21/67706 ,  H01L21/67742 ,  H01L21/68707

Abstract: A substrate processing apparatus can prevent photo-corrosion of, e.g., copper interconnects due to exposure of a surface to be processed of a substrate to light, and can perform processing, such as cleaning, of a substrate surface while preventing photo-corrosion of, e.g., copper interconnects due to exposure to light. The substrate processing apparatus includes a plurality of processing areas housing therein processing units which have been subjected to light shielding processing; and at least one transfer area housing therein a transfer robot and disposed between two adjacent ones of the plurality of processing areas. A light shielding wall is provided between the transfer area and each of the two adjacent processing areas, and a light-shielding maintenance door is provided for the front opening of the transfer area. The processing units are coupled to the light shielding walls in a light-shielding manner.

Abstract translation: 基板处理装置可以防止由于基板的被处理表面暴露于光而导致的铜互连的光腐蚀，并且可以执行基板表面的处理，例如清洁基板表面，同时防止光蚀刻， 例如，由于曝光而导致的铜互连。 基板处理装置包括容纳其中已进行遮光处理的处理单元的多个处理区域; 以及至少一个传送区域，其中容纳有传送机器人并设置在所述多个处理区域中的两个相邻处理区域之间。 在传送区域和两个相邻的处理区域中的每一个之间设置遮光壁，并且为传送区域的前开口设置遮光维护门。 处理单元以遮光方式耦合到遮光壁。

公开(公告)号：US20240416390A1

公开(公告)日：2024-12-19

申请号：US18740592

申请日：2024-06-12

Applicant: EBARA CORPORATION

Inventor： Naoki TOYOMURA ,  Junji KUNISAWA ,  Mitsuru MIYAZAKI

IPC: B08B3/02 ,  B08B5/00 ,  H01L21/67

Abstract: The present disclosure provides a substrate processing apparatus capable of adjusting a flow rate of a liquid to be ejected from a nozzle. The substrate processing apparatus according to the present disclosure is a substrate processing apparatus including a nozzle configured to supply a liquid to a substrate, and a liquid supplier configured to supply the liquid to the nozzle, in which the liquid supplier includes a supply pipe which is configured to cause a liquid supply source and the nozzle to be in fluid communication and which has a first pipe constituting a first flow channel from a splitting point to a joining point located downstream of the splitting point and a second pipe constituting a second flow channel from the splitting point to the joining point, a first valve attached to the first pipe, a second valve attached to the second pipe, and a fluid resistance element attached to the second pipe and configured to set a pressure loss of the liquid flowing through the second pipe to be larger than a pressure loss of the liquid flowing through the first pipe.

公开(公告)号：US20220406633A1

公开(公告)日：2022-12-22

申请号：US17787565

申请日：2020-12-21

Applicant: EBARA CORPORATION

Inventor： Michiaki MATSUDA ,  Hisajiro NAKANO ,  Fuyuki OGAKI ,  Yusuke WATANABE ,  Junji KUNISAWA

IPC: H01L21/67 ,  B08B1/00 ,  B08B1/02 ,  B08B3/02 ,  B08B13/00

Abstract: A cleaning device includes: a plurality of rollers that hold a peripheral edge part of a substrate; a rotation driving unit that rotates the substrate by rotationally driving the plurality of rollers; a cleaning member that abuts on the substrate and cleans the substrate; a cleaning liquid supply nozzle that supplies a cleaning liquid to the substrate; a microphone that detects a sound generated when a notch of the peripheral edge part of the substrate hits the plurality of rollers; and a rotation speed calculation unit that calculates a rotation speed of the substrate on the basis of the sound detected by the microphone.

公开(公告)号：US20220319874A1

公开(公告)日：2022-10-06

申请号：US17607999

申请日：2020-05-29

Applicant: EBARA CORPORATION

Inventor： Akira IMAMURA ,  Mitsuru MIYAZAKI ,  Junji KUNISAWA

IPC: H01L21/67

Abstract: The present invention relates to a damper control system and a damper control method for controlling an opening degree of an exhaust damper connected to an exhaust duct. The damper control system (300) includes an exhaust damper (310), a first pressure sensor (311), and a controller (315) configured to control an opening degree of the exhaust damper (310). The controller (315) is configured to switch the opening degree of the exhaust damper (310) to an opening degree smaller than a full opening on condition that a shutter (217) is opened.

公开(公告)号：US20170252894A1

公开(公告)日：2017-09-07

申请号：US15601575

申请日：2017-05-22

Applicant: EBARA CORPORATION

Inventor： Mitsuru MIYAZAKI ,  Seiji KATSUOKA ,  Naoki MATSUDA ,  Junji KUNISAWA ,  Kenichi KOBAYASHI ,  Hiroshi SOTOZAKI ,  Hiroyuki SHINOZAKI ,  Osamu NABEYA ,  Shinya MORISAWA ,  Takahiro OGAWA ,  Natsuki MAKINO

IPC: B24B37/34 ,  H01L21/677 ,  H01L21/306 ,  H01L21/67

CPC classification number: B24B37/345 ,  H01L21/30625 ,  H01L21/67219 ,  H01L21/67739 ,  H01L21/67742 ,  H01L21/67754 ,  Y10T137/0318 ,  Y10T137/8593

Abstract: An apparatus for processing a substrate is disclosed. The apparatus includes a polishing section configured to polish a substrate, a transfer mechanism configured to transfer the substrate, and a cleaning section configured to clean and dry the polished substrate. The cleaning section has plural cleaning lines for cleaning plural substrates. The plural cleaning lines have plural cleaning modules and plural transfer robots for transferring the substrates.