公开(公告)号：US20220344221A1

公开(公告)日：2022-10-27

申请号：US17694125

申请日：2022-03-14

Applicant: EBARA CORPORATION

Inventor： Osamu NABEYA ,  Shingo TOGASHI ,  Keisuke NAMIKI

IPC: H01L21/66 ,  H01L21/304 ,  H01L21/67 ,  H01L21/687

Abstract: A polishing method capable of accurately determining a polishing end point of a substrate is disclosed. The method is a film-thickness measuring method for a substrate W using a film-thickness measuring device, at least a part of which being mounted in a polishing table configured to support the polishing pad. The method includes measuring film thicknesses of the substrate W, while rotating the substrate W on a polishing surface of the polishing pad by a polishing head and controlling a position of the film-thickness measuring device relative to the polishing head.

公开(公告)号：US20190240801A1

公开(公告)日：2019-08-08

申请号：US16386681

申请日：2019-04-17

Applicant: EBARA CORPORATION

Inventor： Makoto FUKUSHIMA ,  Tetsuji TOGAWA ,  Shingo TOGASHI ,  Tomoshi INOUE

IPC: B24B37/20 ,  B24B37/005 ,  B24B37/34 ,  B24B37/04 ,  B24B49/12 ,  B24B49/10 ,  B24B37/32 ,  B24B37/30

CPC classification number: B24B37/20 ,  B24B37/005 ,  B24B37/042 ,  B24B37/30 ,  B24B37/32 ,  B24B37/34 ,  B24B37/345 ,  B24B49/10 ,  B24B49/12

Abstract: A polishing method is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. A method of polishing a substrate by a polishing apparatus includes a polishing table (100) having a polishing surface, a top ring (1) for holding a substrate and pressing the substrate against the polishing surface, and a vertically movable mechanism (24) for moving the top ring (1) in a vertical direction. The top ring (1) is moved to a first height before the substrate is pressed against the polishing surface, and then the top ring (1) is moved to a second height after the substrate is pressed against the polishing surface.

公开(公告)号：US20180301367A1

公开(公告)日：2018-10-18

申请号：US15950989

申请日：2018-04-11

Applicant: EBARA CORPORATION

Inventor： Satoru YAMAKI ,  Makoto FUKUSHIMA ,  Keisuke NAMIKI ,  Osamu NABEYA ,  Shingo TOGASHI ,  Tomoko OWADA ,  Yoshikazu KATO

IPC: H01L21/687 ,  B24B7/04

Abstract: An elastic membrane to be used for a polishing head includes a contact portion configured to come into contact with a wafer, an annular side wall provided to stand on an outer peripheral end of the contact portion, a first partition wall linearly extending inward in a radial direction in sectional view from the side wall, and a second partition wall linearly extending inward and upward in the radial direction in sectional view from an outer peripheral end portion of the contact portion, wherein the first partition wall, the second partition wall, and the side wall constitute an edge pressure chamber for pressing an edge of the wafer.

公开(公告)号：US20150273657A1

公开(公告)日：2015-10-01

申请号：US14668844

申请日：2015-03-25

Applicant: EBARA CORPORATION

Inventor： Makoto FUKUSHIMA ,  Hozumi YASUDA ,  Keisuke NAMIKI ,  Osamu NABEYA ,  Shingo TOGASHI ,  Satoru YAMAKI ,  Shintaro ISONO

IPC: B24B37/30

CPC classification number: B24B37/30

Abstract: An elastic membrane capable of precisely controlling a polishing profile in a narrow area of a wafer edge portion is disclosed. The elastic membrane includes a contact portion to be brought into contact with a substrate; a first edge circumferential wall extending upwardly from a peripheral edge of the contact portion; and a second edge circumferential wall having a horizontal portion connected to an inner circumferential surface of the first edge circumferential wall. The inner circumferential surface of the first edge circumferential wall includes an upper inner circumferential surface and a lower inner circumferential surface, both of which are perpendicular to the contact portion. The upper inner circumferential surface extends upwardly from the horizontal portion of the second edge circumferential wall, and the lower inner circumferential surface extends downwardly from the horizontal portion.

Abstract translation: 公开了一种能够精确地控制晶片边缘部分的狭窄区域中的抛光轮廓的弹性膜。 弹性膜包括与基板接触的接触部分; 从所述接触部分的周缘向上延伸的第一边缘周向壁; 以及第二边缘周壁，其具有连接到所述第一边缘周壁的内周表面的水平部分。 第一边缘周壁的内圆周表面包括两个垂直于接触部分的上内圆周表面和下内圆周表面。 上部内周面从第二边缘周壁的水平部分向上延伸，下部内圆周表面从水平部分向下延伸。

公开(公告)号：US20150133038A1

公开(公告)日：2015-05-14

申请号：US14537809

申请日：2014-11-10

Applicant: Ebara Corporation

Inventor： Satoru YAMAKI ,  Hozumi YASUDA ,  Keisuke NAMIKI ,  Osamu NABEYA ,  Makoto FUKUSHIMA ,  Shingo TOGASHI

IPC: B24B37/32 ,  B24B37/10

CPC classification number: B24B37/32 ,  B24B37/04 ,  B24B37/107

Abstract: A substrate holder capable of preventing an increase in a polishing rate of an edge portion of a substrate, even when polishing a plurality of substrates successively, is disclosed. The substrate holder includes: a top ring body configured to hold the substrate; and a retaining ring disposed so as to surround the substrate held by the top ring body. The retaining ring includes a pad pressing structure in an annular shape which is to be brought into contact with the polishing pad and the pad pressing structure has a width in a range of 3 mm to 7.5 mm.

Abstract translation: 公开了即使在连续地研磨多个基板的情况下也能够防止基板的边缘部的研磨速度的提高的基板保持架。 衬底保持器包括：构造成保持衬底的顶环体; 以及保持环，其设置成围绕由顶环体保持的基板。 保持环包括与抛光垫接触的环状的垫压结构，垫压结构的宽度在3mm至7.5mm的范围内。

公开(公告)号：US20140370794A1

公开(公告)日：2014-12-18

申请号：US14476680

申请日：2014-09-03

Applicant: EBARA CORPORATION

Inventor： Makoto FUKUSHIMA ,  Hozumi YASUDA ,  Keisuke NAMIKI ,  Osamu NABEYA ,  Shingo TOGASHI ,  Satoru YAMAKI

IPC: B24B37/32 ,  H01L21/304

CPC classification number: B24B37/32 ,  B24B37/005 ,  B24B49/16 ,  H01L21/304

Abstract: A polishing apparatus capable of precisely controlling a polishing profile, particularly a polishing profile in an edge portion, of a wafer is disclosed. The polishing apparatus includes: a top ring shaft; a housing fixed to the top ring shaft; a flexible membrane configured to press a wafer against a polishing pad; a top ring body configured to hold the flexible membrane; a retaining ring coupled to the top ring body and disposed so as to surround the flexible membrane; a gimbal mechanism configured to allow the top ring body and the retaining ring to tilt with respect to the housing; and a local load exerting mechanism configured to exert a downward local load on a part of the retaining ring.

Abstract translation: 公开了一种能够精确控制晶片的抛光轮廓，特别是边缘部分的抛光轮廓的抛光装置。 抛光装置包括：顶环轴; 固定到顶环轴的壳体; 柔性膜，其构造成将晶片压靠在抛光垫上; 构造成保持柔性膜的顶环体; 保持环，其联接到所述顶环体并且被设置成围绕所述柔性膜; 万向架机构，其构造成允许顶环主体和保持环相对于壳体倾斜; 以及局部负载施加机构，其构造成在保持环的一部分上施加向下的局部负载。

公开(公告)号：US20130196573A1

公开(公告)日：2013-08-01

申请号：US13752659

申请日：2013-01-29

Applicant: Ebara Corporation

Inventor： Makoto FUKUSHIMA ,  Hozumi YASUDA ,  Keisuke NAMIKI ,  Osamu NABEYA ,  Shingo TOGASHI ,  Satoru YAMAKI

IPC: B24B37/32 ,  B24B37/04

CPC classification number: B24B37/32 ,  B24B37/04 ,  B24B37/042 ,  B24B37/30

Abstract: The substrate holder is a device for holding a substrate and pressing it against a polishing pad. The substrate holder includes: an inner retaining ring vertically movable independently of the top ring body and arranged around the substrate; an inner pressing mechanism to press the inner retaining ring against the polishing surface of the polishing pad; an outer retaining ring to vertically movable independently of the inner retaining ring and the top ring body; an outer pressing mechanism to press the outer retaining ring against the polishing surface; and a supporting mechanism to receive a lateral force applied to the inner retaining ring from the substrate during polishing of the substrate and to tiltably support the outer retaining ring.

Abstract translation: 衬底保持器是用于保持衬底并将其按压在抛光垫上的装置。 衬底保持器包括：内保持环，其可独立于顶环体垂直移动并且布置在衬底周围; 内部按压机构，用于将内部保持环压靠在抛光垫的抛光表面上; 外保持环，能够独立于内保持环和顶环体垂直移动; 将外保持环压靠在研磨面上的外压机构; 以及支撑机构，用于在抛光基板期间接收从衬底施加到内保持环的横向力，并且可倾斜地支撑外保持环。

公开(公告)号：US20130136884A1

公开(公告)日：2013-05-30

申请号：US13687263

申请日：2012-11-28

Applicant: EBARA Corporation

Inventor： Hozumi YASUDA ,  Katsuhide WATANABE ,  Keisuke NAMIKI ,  Osamu NABEYA ,  Makoto FUKUSHIMA ,  Satoru YAMAKI ,  Shingo TOGASHI

IPC: B32B3/08

CPC classification number: B32B3/08 ,  B24B37/30 ,  B32B3/18 ,  B32B27/12 ,  Y10T428/21 ,  Y10T428/24174 ,  Y10T428/24851

Abstract: There is provided an elastic membrane which can uniformly reduce deformation (elongation) of its contact portion, having a contact surface for contact with a substrate, along the contact surface in substantially the entire area of the contact portion from the center to the periphery. The elastic membrane includes a contact portion having a contact surface for contact with the substrate; a first peripheral wall portion coupled to the peripheral end of the contact portion and extending upwardly; and a second peripheral wall portion located on the inside of the first peripheral wall portion, coupled to the contact portion and extending upwardly, and defining a first chamber on the outer side thereof and a second chamber on the inner side thereof. In the elastic membrane, substantially the entire area of the contact portion is reinforced with a reinforcing member having a higher rigidity than the elastic membrane.

Abstract translation: 提供了一种弹性膜，其能够均匀地减小其接触部分的接触部分的变形（伸长率），该接触部分具有与基板接触的接触表面，沿接触表面沿接触部分的中心到周边的大致整个区域。 弹性膜包括具有与基板接触的接触表面的接触部分; 耦合到所述接触部分的外周端并向上延伸的第一周壁部分; 以及位于所述第一周壁部分的内侧的第二周壁部分，其联接到所述接触部分并向上延伸，并且在其外侧上限定第一室，在其内侧限定第二室。 在弹性膜中，基本上接触部分的整个区域都被具有比弹性膜高的刚性的加强件增强。