公开(公告)号：DE50213033D1

公开(公告)日：2009-01-02

申请号：DE50213033

申请日：2002-09-13

Applicant: EPCOS AG

Inventor： HOFFMANN CHRISTIAN ,  AICHHOLZER KLAUS-DIETER

IPC: B32B15/04 ,  B32B18/00 ,  C04B35/457 ,  C04B35/48 ,  C04B35/622 ,  C04B35/64 ,  C04B37/00 ,  H01L21/48 ,  H05K1/03 ,  H05K3/46

Abstract: A ceramic substrate includes a stack of layers that contain a ceramic material and that are sintered together. One layer, such as a top layer in the stack, has a higher proportion of a sintering agent than an adjacent layer. A metal paste may be applied to a top layer of the stack.

公开(公告)号：DE102006000935A1

公开(公告)日：2007-07-19

申请号：DE102006000935

申请日：2006-01-05

Applicant: EPCOS AG

Inventor： HOFFMANN CHRISTIAN ,  FEICHTINGER THOMAS ,  DUDESEK PAVOL ,  BLOCK CHRISTIAN ,  PUDMICH GUENTER

IPC: C04B35/00 ,  H01C1/146 ,  H01C7/00 ,  H01G4/40 ,  H05K1/03

公开(公告)号：DE10340438A1

公开(公告)日：2005-04-14

申请号：DE10340438

申请日：2003-09-02

Applicant: EPCOS AG

Inventor： FLUEHR HOLGER ,  BLOCK CHRISTIAN ,  HOFFMANN CHRISTIAN

IPC: H04B1/036 ,  H05K1/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/28 ,  H05K7/20 ,  H01L23/34 ,  H01L25/10

Abstract: A transmitter module for mobile radio applications includes a multilayer module substrate with levels of metallization and intervening dielectric stacks in which a circuit is implemented by structuring the levels of metallization. In or on the module substrate, at least one HF filter or adjustment network is implemented. On the underside of the module substrate, a cutout, in which a chip element is soldered in a flip-chip-arrangement, is provided. The rear of the chip element pointing to the outside displays a metallization that makes a good thermal contact of the chip element with extrinsic circuit surroundings possible.

公开(公告)号：DE10321247A1

公开(公告)日：2004-12-09

申请号：DE10321247

申请日：2003-05-12

Applicant: EPCOS AG

Inventor： BLOCK CHRISTIAN ,  FLUEHR HOLGER ,  HOFFMANN CHRISTIAN

IPC: H03H7/01 ,  H04B1/04 ,  H04B1/48 ,  H04B1/54

Abstract: A transmitter module of a wireless transmission system with at least one transmission path having a power amplifier disposed at the input side includes a low-pass filter disposed at the output side and an impedance converter disposed therebetween. The power amplifier and the low-pass filter are, thereby, disposed on the top surface of a multi-layer carrier substrate. Preferably, the impedance converter is disposed in metallization planes of the carrier substrate. The inventive integration of all of these components in one module especially allows for a step-wise impedance adaptation between the low-impedance amplifier output and the output of the transmitter module having a defined output impedance (e.g. 50 ohm), whereby the impedance adaptation is partially carried out by the low-pass filter. A multistage impedance adaptation allows for a reduction of, e.g., the length of the line sections used in the impedance converter and the signal losses involved.

公开(公告)号：DE10259035A1

公开(公告)日：2004-07-15

申请号：DE10259035

申请日：2002-12-17

Applicant: EPCOS AG

Inventor： RAGOSSNIG HEINZ ,  FLUEHR HOLGER ,  PRZADKA ANDREAS ,  HOFFMANN CHRISTIAN ,  BLOCK CHRISTIAN

IPC: H01L23/522 ,  H01L23/60

Abstract: Spark discharge path i.e. a spark gap (1), is formed from conductive tracks (21-23) on a substrate (3). An inductance (2) is connected to the spark gap.

公开(公告)号：DE10164494A1

公开(公告)日：2003-07-17

申请号：DE10164494

申请日：2001-12-28

Applicant: EPCOS AG

Inventor： PORTMANN JUERGEN ,  KRUEGER HANS ,  HOFFMANN CHRISTIAN

IPC: H01L23/12 ,  H01L29/06 ,  H03H3/02 ,  H03H3/06 ,  H03H3/08 ,  H03H9/02 ,  H03H9/05 ,  H03H9/10 ,  H03H9/25 ,  H03H9/56 ,  H01L23/50 ,  H01L23/055 ,  H01L21/60 ,  H01L21/52

Abstract: The aim of the invention is to encapsulate components in a simple and reliable manner. To this end, the connection between a chip and a carrier substrate is made by means of bump contacts which are sunk in recesses on the carrier substrate. The component is placed directly on the carrier substrate, especially on a frame defining the component structures on the chip.

公开(公告)号：AU8172101A

公开(公告)日：2002-03-13

申请号：AU8172101

申请日：2001-08-03

Applicant: EPCOS AG

Inventor： SOMMARIVA HELMUT ,  HOFFMANN CHRISTIAN ,  VALANT MATJAZ ,  SUVOROV DANILO

IPC: C04B35/495 ,  H01G4/12

公开(公告)号：DE10042350C1

公开(公告)日：2002-01-31

申请号：DE10042350

申请日：2000-08-29

Applicant: EPCOS AG

Inventor： SOMMARIVA HELMUT ,  HOFFMANN CHRISTIAN ,  SUVOROV DANILO ,  VALANT MATJAZ

IPC: C04B35/00 ,  C04B35/495 ,  H01B3/12 ,  H05K1/03

Abstract: Ceramic material contains two different components in phases different from each other. The components have a perovskite structure containing silver on the A sites and niobium and tantalum on the B sites. The composition of the components is selected so that the temperature coefficients of their dielectric constants are different in a temperature interval. Preferred Features: The material is produced by sintering a mixture of particles of component A with particles of component B using H3BO3 or V2O5 as sintering aid.

公开(公告)号：DE102013110978A1

公开(公告)日：2015-04-16

申请号：DE102013110978

申请日：2013-10-02

Applicant: EPCOS AG

Inventor： TESTINO ANDREA ,  SCHOSSMANN MICHAEL ,  KOINI MARKUS ,  ORTNER MARKUS DR ,  ENGEL GÜNTER ,  HOFFMANN CHRISTIAN

IPC: H01G4/12 ,  C04B35/46 ,  C04B35/468 ,  H01G4/008 ,  H01G4/33

Abstract: Es wird ein keramischer Vielschichtkondensator mit einem Grundkörper (1) mit keramischen Schichten (2) und dazwischen angeordneten ersten und zweiten Elektrodenschichten (3, 4) angegeben, wobei die keramischen Schichten (2) ein Keramikmaterial auf Basis von BaTi1-yZryO3 mit 0 ≤ y ≤ 1 aufweisen, das eine temperaturabhängige Kapazitätsanomalie aufweist.

公开(公告)号：DE102009035425A1

公开(公告)日：2011-02-17

申请号：DE102009035425

申请日：2009-07-31

Applicant: EPCOS AG

Inventor： WANG YONGLI ,  KOUNGA NJIWA ALAIN BRICE ,  HOFFMANN CHRISTIAN

IPC: C04B35/453

Abstract: Die Erfindung betrifft eine piezoelektrische Keramikzusammensetzung, ein Verfahren zur Herstellung der Zusammensetzung und ein die Zusammensetzung umfassendes elektrisches Bauelement. Die piezoelektrische Keramikzusammensetzung umfasst ein Matrixmaterial, das mindestens zwei Matrixkomponenten mit einem Perowskit umfasst. Eine erste Matrixkomponente ist ausgewählt aus (BiA)EO, BaEOund Mischungen davon, und eine weitere Matrixkomponente ist Bi(MeE)O, wobei A ausgewählt ist aus einem Alkalimetall, E unabhängig ausgewählt ist aus Titan und Zirkonium und Me ausgewählt ist aus zweiwertigen Metallen.