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    Electric multilayer component
    1.
    发明专利
    Electric multilayer component 审中-公开
    电动多层组件

    公开(公告)号：JP2011066439A

    公开(公告)日：2011-03-31

    申请号：JP2010250256

    申请日：2010-11-08

    Applicant: Epcos Ag ,  エプコス アクチエンゲゼルシャフトEpcos Ag

    Inventor： FEICHTINGER THOMAS ,  PUDMICH GUENTER ,  BRUNNER SEBASTIAN ,  KLEEWEIN ALOIS ,  KRUMPHALS ROBERT

    IPC: H01G4/30 ,  H01C1/144 ,  H01C7/04 ,  H01C7/10 ,  H01C7/112 ,  H01C7/18 ,  H01G4/12 ,  H01G4/232

    CPC classification number: H01G4/232 ,  H01C1/144 ,  H01C7/112 ,  H01C7/18 ,  H01G4/30

    Abstract: PROBLEM TO BE SOLVED: To provide an electric multilayer component having a higher integration density that has significantly reduced parasitic capacitances and inductances on one hand, and allows especially simple and space-saving mounting on a print board on the other hand.
    SOLUTION: The electric multilayer component has a substrate constructed using stacked dielectric material layers, wherein multiple conductive electrode areas are arranged in the substrate at intervals between the dielectric layers, and electrodes are formed in the electrode areas. Furthermore, at least two solder balls (bumps) are arranged on the surface of the substrate for electrical contact of the component, each bump being connected in an electrically conductive way to at least one electrode via a through contact arranged in the substrate, so that first and second electrode stacks are formed, each of the electrode stacks contacting only one solder ball.
    COPYRIGHT: (C)2011,JPO&INPIT

    Abstract translation: 要解决的问题：为了提供一方面具有显着降低的寄生电容和电感的较高集成密度的电气多层组件，另一方面在印刷电路板上安装尤其简单和节省空间。 解决方案：电气多层组件具有使用堆叠的电介质层构成的衬底，其中在电介质层之间间隔地在衬底中布置多个导电电极区域，并且在电极区域中形成电极。 此外，在基板的表面上设置至少两个焊球（凸块），用于部件的电接触，每个凸块通过布置在基板中的贯通触头以导电方式连接到至少一个电极，使得 形成第一和第二电极堆叠，每个电极堆叠仅接触一个焊球。 版权所有（C）2011，JPO＆INPIT

    METHOD FOR THE PRODUCTION OF AN ELECTRIC COMPONENT AND COMPONENT
    3.
    发明申请
    METHOD FOR THE PRODUCTION OF AN ELECTRIC COMPONENT AND COMPONENT 审中-公开
    方法带有电气部件和部件

    公开(公告)号：WO2006005317A3

    公开(公告)日：2006-06-15

    申请号：PCT/DE2005001200

    申请日：2005-07-06

    Applicant: EPCOS AG ,  BRUNNER SEBASTIAN ,  FEICHTINGER THOMAS ,  PUDMICH GUENTER ,  SCHLICK HORST ,  SCHMIDT-WINKEL PATRICK

    Inventor： BRUNNER SEBASTIAN ,  FEICHTINGER THOMAS ,  PUDMICH GUENTER ,  SCHLICK HORST ,  SCHMIDT-WINKEL PATRICK

    IPC: H01L21/60 ,  H01L21/48 ,  H01L23/485 ,  H01L23/498 ,  H05K3/40

    CPC classification number: H05K3/4061 ,  H01L2924/0002 ,  H05K3/248 ,  H05K3/28 ,  H05K2201/035 ,  Y10T29/49155 ,  H01L2924/00

    Abstract: The invention relates to a method for the production of an electric component (1). Said method consists of the following steps; A) a ceramic base body (5) which comprises a through-contact (10) and at least one metal surface (20C) which is connected in an electrically conductive manner to the through-contact, is prepared. In step B), one first electrically insulating material is arranged in a layered manner on the surface of the base body and at least over the through-contact, and subsequently in step C) an electrically conductive second material is applied over the through-contact (10). In step D) a soldering contact (30B) is formed by means of hardening, said soldering contact binding, in an electrically conductive manner, the through-contact (10) through the passivation layer (25B) which is formed from a first material by means of sintering.

    Abstract translation: 它提出了一种方法，用于经由导电连接的金属化制造（1），其中，在一个方法步骤A中的陶瓷基体）被提供（5）的电组件，其包括通过（10）和至少一个与所述（20℃） ， 在基体的第一，在工艺步骤B的电绝缘材料）在方法步骤C的导电性的第二材料）的表面通过设置在层中的至少在所施加的，并且此后在通孔（10）。 在方法步骤D）中，焊料接触（30B）然后通过中，（通过在钝化层25B），其由所述第一材料通过烧结而形成，通过上述通路孔（10）导电地连接的固化来形成。

    5.
    发明专利
    未知

    公开(公告)号：DE102004032706A1

    公开(公告)日：2006-02-02

    申请号：DE102004032706

    申请日：2004-07-06

    Applicant: EPCOS AG

    Inventor： FEICHTINGER THOMAS ,  SCHLICK HORST ,  BRUNNER SEBASTIAN ,  PUDMICH GUENTER ,  SCHMIDT-WINKEL PATRICK

    IPC: H01C1/146 ,  H01G4/242 ,  H01L21/312 ,  H01L21/60 ,  H01L41/04 ,  H05K3/40

    Abstract: A method for producing an electrical component (1) is proposed, in which a ceramic base body (5) that contains a through-hole contact (10) and at least one metallization surface (20C) electroconductively connected to the through-hole contact is provided in a method step A). On the surface of the base body, an electrically insulating first material is arranged in layer form at least above the through-hole contact in method step B), and thereafter an electrically conductive second material is applied above through-hole contact (10) in method step C). Then a solder contact (30B) that electroconductively connects through-hole contact (10) through passivation layer (25B), which is formed from the first material by sintering, is formed by hardening in method step D).

    CERAMIC COMPONENT AND METHOD FOR PRODUCING A CERAMIC COMPONENT
    6.
    发明申请
    CERAMIC COMPONENT AND METHOD FOR PRODUCING A CERAMIC COMPONENT 审中-公开
    陶瓷元件及其制造方法陶瓷成分

    公开(公告)号：WO2012028659A3

    公开(公告)日：2012-07-26

    申请号：PCT/EP2011065049

    申请日：2011-08-31

    Applicant: EPCOS AG ,  FEICHTINGER THOMAS ,  PUDMICH GUENTER

    Inventor： FEICHTINGER THOMAS ,  PUDMICH GUENTER

    IPC: H01C7/105 ,  H01C7/10 ,  H01C7/18

    CPC classification number: H01C7/18 ,  H01C7/1006 ,  H01C7/105

    Abstract: A ceramic component (100) comprises a basic body (101) with two connecting contacts (102, 103) fitted thereon. The component (100) has a first longitudinally extended via electrode (104) and a second longitudinally extended via electrode (105), said electrodes each being coupled to one of the connecting contacts (102, 103). The first via electrode (104) and the second via electrode (105) each have an extended area (106, 107) in projection in the longitudinal direction. For production purposes, a plurality of ceramic layers (117, 118, 119) is layered to form a layer stack, which forms the basic body (101), and the two via electrodes (104, 105) are introduced into the layer stack transversely to the layer sequence.

    Abstract translation: 的陶瓷部件（100）包括基体（101）与两个连接的连接触头（102，103）。 的装置（100）具有第一（104）和上细长延伸通路电极，其各自耦合到所述连接触头（102，103）中的一个的第二（105）。 第一（104）和第二（105）通过电极各具有在延伸表面（106，107）的纵向方向突出。 用于制备多个陶瓷层（117，118，119）的一个层堆叠形成层叠在该基体（101）和所述两个通孔电极（104，105）横向地放置在层序列中的层堆叠。

    ELECTRIC COMPONENT
    7.
    发明申请
    ELECTRIC COMPONENT 审中-公开
    电气元件

    公开(公告)号：WO2007112736A2

    公开(公告)日：2007-10-11

    申请号：PCT/DE2007000622

    申请日：2007-04-05

    Applicant: EPCOS AG ,  KARTASHEV IGOR ,  PUDMICH GUENTER

    Inventor： KARTASHEV IGOR ,  PUDMICH GUENTER

    IPC: H01L41/107

    CPC classification number: H01L41/107

    Abstract: The invention relates to an electric component comprising a ceramic substrate (1) and a piezoelectric transformer (3) which is electrically and mechanically connected to the ceramic substrate (1).

    Abstract translation: 提供了一种包括一陶瓷基板（1）和一个压电变压器（3），其被电和机械地连接到所述陶瓷基板（1）的电组件。

    Mehrschichtbauelement und Verfahren zur Herstellung
    9.
    发明专利
    Mehrschichtbauelement und Verfahren zur Herstellung 未知

    公开(公告)号：DE102009014542B3

    公开(公告)日：2010-12-02

    申请号：DE102009014542

    申请日：2009-03-24

    Applicant: EPCOS AG

    Inventor： DUDESEK PAVOL ,  PUDMICH GUENTER ,  SCHIECHL HANNES ,  PAYR EDMUND ,  FEICHTINGER THOMAS ,  SALZ WERNER ,  HOFFMANN CHRISTIAN

    IPC: C04B35/00 ,  H01C7/12 ,  H01G4/12 ,  H01G4/40

    Abstract: Es wird ein Mehrschichtbauelement angegeben, das ein dielektrisches keramisches Material umfasst, welches sich mit einer Varistorkeramik zu einem erfindungsgemäßen monolithischen Mehrschichtbauelement co-sintern lässt. Das Mehrschichtbauelement umfasst daher eine Schicht einer Varistorkeramik und eine andere Schicht eines Dielektrikums. Beide Schichten können im Mehrschichtbauelement unmittelbar benachbart angeordnet sein. Im Mehrschichtbauelement sind auf oder zwischen den keramischen Schichten Metallisierungen angeordnet, die zu Leiterabschnitten und metallisierten Flächen strukturiert sind. Die Metallisierungen bilden zusammen mit den Keramikschichten neben einem Varistor zumindest ein weiteres Bauelement aus, welches ausgewählt ist aus zumindest einer der Bauelementfunktionen Kapazität, Widerstand und Induktivität.

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