公开(公告)号：US20170261160A1

公开(公告)日：2017-09-14

申请号：US15605535

申请日：2017-05-25

Applicant: EPISTAR CORPORATION

Inventor： Chiu-Lin YAO ,  Min-Hsun HSIEH ,  Been-Yu LIAW ,  Wei-Chiang HU ,  Po-Hung LAI ,  Chun-Hung LIU ,  Shih-An LIAO ,  Yu-His SUNG ,  Ming-Chi HSU

IPC: F21K9/235 ,  F21K9/232 ,  H01L25/075 ,  F21Y107/10 ,  F21Y107/30 ,  F21Y115/10 ,  H01L33/54 ,  H01L33/62

CPC classification number: F21K9/235 ,  F21K9/232 ,  F21Y2107/10 ,  F21Y2107/30 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

Abstract: This disclosure discloses a light-emitting bulb. The light-emitting bulb includes a cover, an electrical associated with the cover, a board arranged between the cover and the electrical connector, and a first light-emitting device disposed on the board. The first light-emitting device includes a carrier having a first side and a second side, a first electrode part disposed near the first side and extending to the second side, a bended part disposed near to the second side and spaced apart from the first electrode part, and a second electrode part extending from the bended part to the first side. No light-emitting diode unit is arranged on the second electrode part.

公开(公告)号：US20140362565A1

公开(公告)日：2014-12-11

申请号：US14301060

申请日：2014-06-10

Applicant: EPISTAR CORPORATION

Inventor： Chiu-Lin YAO ,  Min-Hsun HSIEH ,  Been-Yu LIAW ,  Wei-Chiang HU ,  Po-Hung LAI ,  Chun-Hung LIU ,  Shih-An LIAO ,  Yu-His SUNG ,  Ming-Chi HSU

IPC: H01L33/38 ,  F21K99/00

CPC classification number: F21K9/235 ,  F21K9/232 ,  F21Y2107/10 ,  F21Y2107/30 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

Abstract: This disclosure discloses a light-emitting device. The light-emitting device comprises: a first electrode part; a second electrode part; a third electrode part, spaced apart from the first electrode part and the second electrode part; and a light-emitting unit partially covering the first electrode part and the second electrode part and fully covering the second electrode part, the light-emitting unit having a conductive structure contacting the second electrode part.

Abstract translation: 本公开公开了一种发光装置。 发光装置包括：第一电极部分; 第二电极部分; 与第一电极部分和第二电极部分间隔开的第三电极部分; 以及部分地覆盖所述第一电极部分和所述第二电极部分并且完全覆盖所述第二电极部分的发光单元，所述发光单元具有与所述第二电极部分接触的导电结构。

公开(公告)号：US20180159004A1

公开(公告)日：2018-06-07

申请号：US15827549

申请日：2017-11-30

Applicant: EPISTAR CORPORATION

Inventor： Lung-Kuan LAI ,  Ching-Tai CHENG ,  Yih-Hua RENN ,  Min-Hsun HSIEH ,  Chun-Hung LIU ,  Shih-An LIAO ,  Ming-Chi HSU ,  Yu Chen LIAO

IPC: H01L33/60 ,  H01L33/62 ,  H01L33/46 ,  H01L33/38 ,  H01L33/50 ,  H01L33/54 ,  H01L25/075 ,  F21V8/00

CPC classification number: H01L33/60 ,  G02B6/0051 ,  G02B6/0073 ,  H01L25/0753 ,  H01L33/385 ,  H01L33/46 ,  H01L33/505 ,  H01L33/507 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/18 ,  H01L2933/0016 ,  H01L2933/0025 ,  H01L2933/0041 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: A light-emitting device includes a light body having an internal electrode layer, and a conductive layer. The conductive layer has a first portion formed on the internal electrode layer and overlapping the light body in a first direction, and a second portion overlapping the light body in a second direction. The first direction is perpendicular to the second direction.

公开(公告)号：US20170271290A1

公开(公告)日：2017-09-21

申请号：US15459310

申请日：2017-03-15

Applicant: EPISTAR CORPORATION

Inventor： Shih-An LIAO ,  Shau-Yi CHEN ,  Ming-Chi HSU ,  Chun-Hung LIU ,  Min-Hsun HSIEH

IPC: H01L23/00 ,  H01L33/64 ,  H01L33/62

CPC classification number: H01L24/16 ,  H01L24/06 ,  H01L24/13 ,  H01L24/20 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L33/30 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/04105 ,  H01L2224/0612 ,  H01L2224/13309 ,  H01L2224/13311 ,  H01L2224/13313 ,  H01L2224/13339 ,  H01L2224/13499 ,  H01L2224/16058 ,  H01L2224/16105 ,  H01L2224/16227 ,  H01L2224/165 ,  H01L2224/2929 ,  H01L2224/29309 ,  H01L2224/29311 ,  H01L2224/29313 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/83121 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83851 ,  H01L2224/83862 ,  H01L2224/8388 ,  H01L2224/83886 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/10331 ,  H01L2924/12041 ,  H01L2924/15156 ,  H01L2924/00014 ,  H01L2924/01083 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/00012

Abstract: A semiconductor device comprises a semiconductor die, comprising a stacking structure, a first bonding pad, and a second bonding pad on a top surface of the stacking structure, wherein a shortest distance between the first bonding pad and the second bonding pad is less than 150 μm; a carrier comprising a connecting surface; a third bonding pad and a fourth bonding pad on the connecting surface of the carrier; and a conductive connecting layer comprising a current conductive area between the first bonding pad and the third bonding pad and between the second bonding pad and the fourth bonding pad.