公开(公告)号：US20210381659A1

公开(公告)日：2021-12-09

申请号：US17367820

申请日：2021-07-06

Applicant: EPISTAR CORPORATION

Inventor： Chiu-Lin YAO ,  Min-Hsun HSIEH ,  Been-Yu LIAW ,  Wei-Chiang HU ,  Po-Hung LAI ,  Chun-Hung LIU ,  Shih-An LIAO ,  Yu-His SUNG ,  Ming-Chi HSU

IPC: F21K9/235 ,  H01L25/075 ,  F21K9/232

Abstract: This disclosure discloses a light-emitting bulb. The light-emitting bulb includes a cover, an electrical associated with the cover, a board arranged between the cover and the electrical connector, and a first light-emitting device disposed on the board. The first light-emitting device includes a carrier having a first side and a second side, a first electrode part disposed near the first side and extending to the second side, a bended part disposed near to the second side and spaced apart from the first electrode part, and a second electrode part extending from the bended part to the first side. No light-emitting diode unit is arranged on the second electrode part.

公开(公告)号：US20210151405A1

公开(公告)日：2021-05-20

申请号：US17163746

申请日：2021-02-01

Applicant: EPISTAR CORPORATION

Inventor： Shih-An LIAO ,  Shau-Yi CHEN ,  Ming-Chi HSU ,  Chun-Hung LIU ,  Min-Hsun HSIEH

IPC: H01L23/00 ,  H01L33/62

Abstract: A semiconductor device comprises a semiconductor die, comprising a stacking structure, a first bonding pad with a first bonding surface positioned away from the stack structure, and a second bonding pad; a carrier comprising a connecting surface; a third bonding pad which comprises a second bonding surface and is arranged on the connecting surface, and a fourth bonding pad arranged on the connecting surface of the carrier; and a conductive connecting layer comprising a first conductive part, comprising a first outer contour, and formed between and directly contacting the first bonding pad and the third bonding pad; a second conductive part formed between the second bonding pad and the fourth bonding pad; and a blocking part covering the first conductive part to form a covering area, wherein the first bonding surface comprises a first position which is the closest to the carrier within the covering area and a second position which is the farthest from the carrier within the covering area in a cross section view, and a distance from the first position to the first out contour is greater than that from the second position to the first outer contour.

公开(公告)号：US20190207069A1

公开(公告)日：2019-07-04

申请号：US16298648

申请日：2019-03-11

Applicant: EPISTAR CORPORATION

Inventor： Lung-Kuan LAI ,  Ching-Tai CHENG ,  Yih-Hua RENN ,  Min-Hsun HSIEH ,  Chun-Hung LIU ,  Shih-An LIAO ,  Ming-Chi HSU ,  Yu Chen LIAO

IPC: H01L33/60 ,  H01L33/54 ,  H01L25/075 ,  H01L33/62 ,  H01L33/46 ,  H01L33/50 ,  H01L33/38 ,  F21V8/00

CPC classification number: H01L33/60 ,  G02B6/0051 ,  G02B6/0073 ,  H01L25/0753 ,  H01L33/385 ,  H01L33/46 ,  H01L33/505 ,  H01L33/507 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/04105 ,  H01L2224/18 ,  H01L2224/96 ,  H01L2924/1815 ,  H01L2933/0016 ,  H01L2933/0025 ,  H01L2933/0041 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: A light-emitting device includes a light body having an internal electrode layer, and a conductive layer. The conductive layer has a first portion formed on the internal electrode layer and overlapping the light body in a first direction, and a second portion overlapping the light body in a second direction. The first direction is perpendicular to the second direction.

公开(公告)号：US20230017939A1

公开(公告)日：2023-01-19

申请号：US17947536

申请日：2022-09-19

Applicant: EPISTAR CORPORATION

Inventor： Shih-An LIAO ,  Shau-Yi CHEN ,  Ming-Chi HSU ,  Chun-Hung LIU ,  Min-Hsun HSIEH

IPC: H01L23/00 ,  H01L33/62

Abstract: A semiconductor device comprises a semiconductor die, comprising a stacking structure, a first bonding pad with a first bonding surface positioned away from the stack structure, and a second bonding pad; a carrier comprising a connecting surface; a third bonding pad which comprises a second bonding surface and is arranged on the connecting surface, and a fourth bonding pad arranged on the connecting surface of the carrier; and a conductive connecting layer comprising a first conductive part, comprising a first outer contour, and formed between and directly contacting the first bonding pad and the third bonding pad; a second conductive part formed between the second bonding pad and the fourth bonding pad; and a blocking part covering the first conductive part to form a covering area, wherein the first bonding surface comprises a first position which is the closest to the carrier within the covering area and a second position which is the farthest from the carrier within the covering area in a cross section view, and a distance from the first position to the first out contour is greater than that from the second position to the first outer contour.

公开(公告)号：US20190109111A1

公开(公告)日：2019-04-11

申请号：US16196315

申请日：2018-11-20

Applicant: EPISTAR CORPORATION

Inventor： Shih-An LIAO ,  Shau-Yi CHEN ,  Ming-Chi HSU ,  Chun-Hung LIU ,  Min-Hsun HSIEH

IPC: H01L23/00 ,  H01L33/62 ,  H01L33/30 ,  H01L33/64

Abstract: A semiconductor device comprises a semiconductor die, comprising a stacking structure, a first bonding pad with a first bonding surface positioned away from the stack structure, and a second bonding pad; a carrier comprising a connecting surface; a third bonding pad which comprises a second bonding surface and is arranged on the connecting surface, and a fourth bonding pad arranged on the connecting surface of the carrier; and a conductive connecting layer comprising a first conductive part, comprising a first outer contour, and formed between and directly contacting the first bonding pad and the third bonding pad; a second conductive part formed between the second bonding pad and the fourth bonding pad; and a blocking part covering the first conductive part to form a covering area, wherein the first bonding surface comprises a first position which is the closest to the carrier within the covering area and a second position which is the farthest from the carrier within the covering area in a cross section view, and a distance from the first position to the first out contour is greater than that from the second position to the first outer contour.

公开(公告)号：US20200227371A1

公开(公告)日：2020-07-16

申请号：US16836441

申请日：2020-03-31

Applicant: EPISTAR CORPORATION

Inventor： Shih-An LIAO ,  Shau-Yi CHEN ,  Ming-Chi HSU ,  Chun-Hung LIU ,  Min-Hsun HSIEH

IPC: H01L23/00 ,  H01L33/62

Abstract: A light-emitting module includes a common carrier; a plurality of semiconductor devices formed on the common carrier, and each of the plurality of semiconductor devices including three semiconductor dies; a carrier including a connecting surface; a third bonding pad and a fourth bonding pad formed on the connecting surface; and a connecting layer. One of the three semiconductor dies includes a stacking structure; a first bonding pad; and a second bonding pad with a shortest distance less than 150 microns between the first bonding pad. The connecting layer includes a first conductive part including a first conductive material having a first shape; and a blocking part covering the first conductive part and including a second conductive material having a second shape with a diameter in a cross-sectional view. The first shape has a height greater than the diameter.

公开(公告)号：US20190172987A1

公开(公告)日：2019-06-06

申请号：US16234066

申请日：2018-12-27

Applicant: EPISTAR CORPORATION

Inventor： Chien-Liang LIU ,  Ming-Chi HSU ,  Shih-An LIAO ,  Chun-Hung LIU ,  Zhi-Ting YE ,  Cheng-Teng YE ,  Po-Chang CHEN ,  Sheng-Che CHIOU

IPC: H01L33/60 ,  H01L33/20 ,  H01L33/38 ,  H01L33/50 ,  H01L25/075

Abstract: A light-emitting device includes a light-emitting structure with a side surface, and a reflective layer covering the side surface. The light-emitting structure has a first light-emitting angle and a second light-emitting angle. The difference between the first light-emitting angle and the second light-emitting angle is larger than 15°.

公开(公告)号：US20170194540A1

公开(公告)日：2017-07-06

申请号：US15394951

申请日：2016-12-30

Applicant: EPISTAR CORPORATION

Inventor： Chien-Liang LIU ,  Ming-Chi HSU ,  Shih-An LIAO ,  Chun-Hung LIU ,  Zhi-Ting YE ,  Cheng-Teng YE ,  Po-Chang CHEN ,  Sheng-Che CHIOU

IPC: H01L33/60 ,  H01L25/075 ,  H01L33/20 ,  H01L33/38 ,  H01L33/50

CPC classification number: H01L33/60 ,  G02B6/0068 ,  G02B6/0073 ,  H01L21/568 ,  H01L25/0753 ,  H01L33/0095 ,  H01L33/20 ,  H01L33/38 ,  H01L33/486 ,  H01L33/504 ,  H01L33/62 ,  H01L2224/19 ,  H01L2933/0058

Abstract: A light-emitting device includes a light-emitting structure with a side surface, and a reflective layer covering the side surface. The light-emitting structure has a first light-emitting angle and a second light-emitting angle. The difference between the first light-emitting angle and the second light-emitting angle is larger than 15°.

公开(公告)号：US20220252228A1

公开(公告)日：2022-08-11

申请号：US17724021

申请日：2022-04-19

Applicant: EPISTAR CORPORATION

Inventor： Chiu-Lin YAO ,  Min-Hsun HSIEH ,  Been-Yu LIAW ,  Wei-Chiang HU ,  Po-Hung LAI ,  Chun-Hung LIU ,  Shih-An LIAO ,  Yu-His SUNG ,  Ming-Chi HSU

IPC: F21K9/235 ,  H01L25/075 ,  F21K9/232

Abstract: This disclosure discloses a light-emitting bulb. The light-emitting bulb includes a cover, an electrical associated with the cover, a board arranged between the cover and the electrical connector, and a first light-emitting device disposed on the board. The first light-emitting device includes a carrier having a first side and a second side, a first electrode part disposed near the first side and extending to the second side, a bended part disposed near to the second side and spaced apart from the first electrode part, and a second electrode part extending from the bended part to the first side. No light-emitting diode unit is arranged on the second electrode part.

公开(公告)号：US20190154209A1

公开(公告)日：2019-05-23

申请号：US16258281

申请日：2019-01-25

Applicant: EPISTAR CORPORATION

Inventor： Chiu-Lin YAO ,  Min-Hsun HSIEH ,  Been-Yu LIAW ,  Wei-Chiang HU ,  Po-Hung LAI ,  Chun-Hung LIU ,  Shih-An LIAO ,  Yu-His SUNG ,  Ming-Chi HSU

IPC: F21K9/235 ,  H01L25/075 ,  F21K9/232

Abstract: This disclosure discloses a light-emitting bulb. The light-emitting bulb includes a cover, an electrical associated with the cover, a board arranged between the cover and the electrical connector, and a first light-emitting device disposed on the board. The first light-emitting device includes a carrier having a first side and a second side, a first electrode part disposed near the first side and extending to the second side, a bended part disposed near to the second side and spaced apart from the first electrode part, and a second electrode part extending from the bended part to the first side. No light-emitting diode unit is arranged on the second electrode part.