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    SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THEREOF
    1.
    发明申请
    SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THEREOF 审中-公开

    公开(公告)号：US20200227371A1

    公开(公告)日：2020-07-16

    申请号：US16836441

    申请日：2020-03-31

    Applicant: EPISTAR CORPORATION

    Inventor： Shih-An LIAO ,  Shau-Yi CHEN ,  Ming-Chi HSU ,  Chun-Hung LIU ,  Min-Hsun HSIEH

    IPC: H01L23/00 ,  H01L33/62

    Abstract: A light-emitting module includes a common carrier; a plurality of semiconductor devices formed on the common carrier, and each of the plurality of semiconductor devices including three semiconductor dies; a carrier including a connecting surface; a third bonding pad and a fourth bonding pad formed on the connecting surface; and a connecting layer. One of the three semiconductor dies includes a stacking structure; a first bonding pad; and a second bonding pad with a shortest distance less than 150 microns between the first bonding pad. The connecting layer includes a first conductive part including a first conductive material having a first shape; and a blocking part covering the first conductive part and including a second conductive material having a second shape with a diameter in a cross-sectional view. The first shape has a height greater than the diameter.

    METHOD AND STRUCTURE FOR DIE BONDING USING ENERGY BEAM
    8.
    发明申请
    METHOD AND STRUCTURE FOR DIE BONDING USING ENERGY BEAM 有权

    公开(公告)号：US20220310555A1

    公开(公告)日：2022-09-29

    申请号：US17838307

    申请日：2022-06-13

    Applicant: EPISTAR CORPORATION

    Inventor： Min-Hsun HSIEH ,  Shih-An LIAO ,  Ying-Yang SU ,  Hsin-Mao LIU ,  Tzu-Hsiang WANG ,  Chi-Chih PU

    IPC: H01L23/00 ,  H01L25/16 ,  H01L25/075 ,  H01L23/498 ,  B23K26/22

    Abstract: Disclosed is a die-bonding method which provides a target substrate having a circuit structure with multiple electrical contacts and multiple semiconductor elements each semiconductor element having a pair of electrodes, arranges the multiple semiconductor elements on the target substrate with the pair of electrodes of each semiconductor element aligned with two corresponding electrical contacts of the target substrate, and applies at least one energy beam to join and electrically connect the at least one pair of electrodes of every at least one of the multiple semiconductor elements and the corresponding electrical contacts aligned therewith in a heating cycle by heat carried by the at least one energy beam in the heating cycle. The die-bonding method delivers scattering heated dots over the target substrate to avoid warpage of PCB and ensures high bonding strength between the semiconductor elements and the circuit structure of the target substrate.

    LIGHT EMITTING BULB
    9.
    发明申请
    LIGHT EMITTING BULB 有权

    公开(公告)号：US20210381659A1

    公开(公告)日：2021-12-09

    申请号：US17367820

    申请日：2021-07-06

    Applicant: EPISTAR CORPORATION

    Inventor： Chiu-Lin YAO ,  Min-Hsun HSIEH ,  Been-Yu LIAW ,  Wei-Chiang HU ,  Po-Hung LAI ,  Chun-Hung LIU ,  Shih-An LIAO ,  Yu-His SUNG ,  Ming-Chi HSU

    IPC: F21K9/235 ,  H01L25/075 ,  F21K9/232

    Abstract: This disclosure discloses a light-emitting bulb. The light-emitting bulb includes a cover, an electrical associated with the cover, a board arranged between the cover and the electrical connector, and a first light-emitting device disposed on the board. The first light-emitting device includes a carrier having a first side and a second side, a first electrode part disposed near the first side and extending to the second side, a bended part disposed near to the second side and spaced apart from the first electrode part, and a second electrode part extending from the bended part to the first side. No light-emitting diode unit is arranged on the second electrode part.

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