公开(公告)号：EP1021792B1

公开(公告)日：2008-03-19

申请号：EP98947625.4

申请日：1998-10-08

Applicant: GEMPLUS

Inventor： AYALA, Stéphane ,  BOURNEIX, Gérard ,  BEAUSOLEIL, Christine ,  MARTIN, David ,  ODDOU, Laurent ,  PATRICE, Philippe ,  ZAFRANY, Michael

IPC: G06K19/077

CPC classification number: G06K19/07769 ,  G06K19/07749 ,  G06K19/0775 ,  G06K19/07779 ,  G06K19/07783 ,  Y10T29/49002 ,  Y10T29/49016

Abstract: The invention concerns a method for making smart cards capable of operating with or without contact called mixed cards and contactless smart cards. In order to avoid the risk of deteriorating the antenna the method consists in producing an antenna comprising at least two turns, on a support sheet, said antenna having its turns located outside the connecting pads, and in providing an insulating bridge so as to connect each of the antenna ends to a connection pad respectively.

公开(公告)号：EP1576866A1

公开(公告)日：2005-09-21

申请号：EP03789532.3

申请日：2003-12-01

Applicant: GEMPLUS

Inventor： CALVAS, Bernard ,  CHOMETTE, Michel ,  ELBAZ, Didier ,  PATRICE, Philippe

IPC: H05K5/02 ,  G06K7/00

CPC classification number: G06K7/0021 ,  G06K19/07741

Abstract: The invention concerns an adapter (10) for electrically connecting a integrated circuit mini-card (12) in a main electronic integrated circuit memory card connector with contact having greater space requirement than the mini-card (12), the mini-card (12) comprising surface contact strips (14) and said adapter (10) comprising a main body (22) capable of being connected to the main connector and a housing (32) for receiving the mini-card (12) emerging at the surface of the main body (22) and including inside bond pads (36) for connection to the electric contacts (14) of the mini-card (12). The invention is characterized in that it comprises a mobile cover (52) which is capable of taking up a position wherein it closes at least partly the housing (32) while maintaining the mini-card (12) in electrically connecting position in the housing (32) and stiffening the structure of the adapter (10).

公开(公告)号：EP1194885A1

公开(公告)日：2002-04-10

申请号：EP00925435.0

申请日：2000-05-11

Applicant: Gemplus

Inventor： BOCCIA, Henri ,  BRUNET, Olivier ,  LIMOUSIN, Isabelle ,  PATRICE, Philippe

IPC: G06K19/077

CPC classification number: G06K19/07739 ,  G06K19/077 ,  G06K19/07745 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The invention relates to an adapter for a portable integrated circuit device of the chip card variety having a reduced format in comparison with the standard mini-card format. The device with a reduced format (60) comprises a body on which a microcircuit (10) defining contact pads (11) is disposed and is characterized in that it comprises a support (100) which has a standard mini-card format, is provided with a cavity (110) having the dimensions of the device with a reduced format (60) and means for detachably fixing said device (60) in the cavity (110), further characterized in that the cavity (110) is located in the support (100) in such a way that the location of the contact pads (11) of the microcircuit (10) of the device with a reduced format (60) coincides with the standardized location of the contact pads (11') of a microcircuit (10') having a standard format mini-card.

公开(公告)号：EP1116179B1

公开(公告)日：2004-07-28

申请号：EP99943021.8

申请日：1999-09-22

Applicant: Gemplus

Inventor： FIDALGO, Jean-Christophe ,  BRUNET, Olivier ,  FREEMAN, Ray ,  PATRICE, Philippe

IPC: G06K19/077 ,  G06K19/073

CPC classification number: G06K19/07726 ,  G06K19/073 ,  G06K19/07749 ,  G06K19/0775

Abstract: The invention concerns a contactless smart card comprising inhibiting means. It comprises a card body, an antenna (25) and, connected to said antenna connecting terminals (23, 24), an integrated circuit chip. Said card is characterised in particular in that the connecting terminals to the antenna are further connected to conductive via holes (28) emerging at the card surface, and the junction (26) based on an electrically conductive substance, designed to be removed by scraping when it is first used, is flush with the card surface and connects the conductive via holes.

公开(公告)号：EP1084482B1

公开(公告)日：2004-02-18

申请号：EP99923643.3

申请日：1999-05-31

Applicant: Gemplus

Inventor： FIDALGO, Jean, Christophe ,  ELBAZ, Didier ,  ZAFRANY, Michael ,  PATRICE, Philippe

IPC: G06K19/077

CPC classification number: G06K19/07747 ,  G06K19/07743 ,  G06K19/07745 ,  H01L21/56 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/49855 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/24226 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: The invention relates to a method for producing an integrated circuit, including a step whereby a module (12) is created and fixed on the body of a card (20) and provided with an integrated circuit (14) and contact pads (16). The invention is characterised in that the step in which the module (12) is created comprises a stage that consists in forming slots in a plate element (26) that is made from a conducting material, whereby said slots define at least partially the areas of the plate element (20) that will form the contact pads. The invention is also characterised by a subsequent step that consists in coating a lower face (32) of the plate element at least partially with adhesive matter (30) to enable the module (12) to be fixed to the body of the card (20) at a later stage.

公开(公告)号：EP1192592B1

公开(公告)日：2003-04-23

申请号：EP00938859.6

申请日：2000-05-30

Applicant: Gemplus

Inventor： CALVAS, Bernard ,  FIDALGO, Jean-Christophe ,  PATRICE, Philippe

IPC: G06K19/077

CPC classification number: H01L24/83 ,  G06K19/07743 ,  H01L23/49855 ,  H01L23/5388 ,  H01L24/29 ,  H01L24/48 ,  H01L2221/68313 ,  H01L2224/29101 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The invention concerns a method for mounting on a support (16) at least a microcircuit in the form of a chip (2) produced on a very thin semiconductor substrate. The invention is characterised in that it comprises, for the or each chip, the following steps: a) providing at the chip at least an interconnection point in the form of a bump contact (8) in weldable material, the bump contact having a welding surface in the same plane as at least one of the chip faces (2a); b) providing at the level of the support at least an interconnection pad (14a) designed to be welded with a corresponding bump contact of the chip; c) placing the welding face of the or of each bump contact of the chip opposite the or each corresponding interconnection pad of the support; and d) welding the or each bump contact of the chip with the or each corresponding interconnection pad of the support. The invention also concerns a device, such as a chip card, produced from a chip as defined at point a).

公开(公告)号：EP1062635B1

公开(公告)日：2002-12-04

申请号：EP99939227.7

申请日：1999-02-26

Applicant: Gemplus

Inventor： PATRICE, Philippe

IPC: G06K19/077

CPC classification number: G06K19/0775 ,  G06K19/07749 ,  H01L2223/6677 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16238 ,  H01L2224/8114 ,  H01L2924/00013 ,  H01L2924/01057 ,  H01L2924/01079 ,  Y10T29/49016 ,  Y10T29/49018 ,  Y10T29/4913 ,  Y10T29/49149 ,  H01L2924/00014 ,  H01L2224/13099

Abstract: The invention concerns a method for making a contactless chip card, more particularly a method for making a contactless chip card comprising an integrated circuit (3) and an antenna (2), which consists in producing metal-coated bumps (5) on two contact pads (4) of the chip (3). The invention is characterised in that the chip (3) connection to the antenna (2) is produced by embedding the metal-coated bumps (5) in the antenna (2) thickness, when the chip (3) is being mounted on said antenna (2). Said method provides good quality electrical connection between the chip (3) and the antenna (2):

公开(公告)号：EP1062635A1

公开(公告)日：2000-12-27

申请号：EP99939227.7

申请日：1999-02-26

Applicant: Gemplus

Inventor： PATRICE, Philippe

IPC: G06K19/077

CPC classification number: G06K19/0775 ,  G06K19/07749 ,  H01L2223/6677 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16238 ,  H01L2224/8114 ,  H01L2924/00013 ,  H01L2924/01057 ,  H01L2924/01079 ,  Y10T29/49016 ,  Y10T29/49018 ,  Y10T29/4913 ,  Y10T29/49149 ,  H01L2924/00014 ,  H01L2224/13099

Abstract: The invention concerns a method for making a contactless chip card, more particularly a method for making a contactless chip card comprising an integrated circuit (3) and an antenna (2), which consists in producing metal-coated bumps (5) on two contact pads (4) of the chip (3). The invention is characterised in that the chip (3) connection to the antenna (2) is produced by embedding the metal-coated bumps (5) in the antenna (2) thickness, when the chip (3) is being mounted on said antenna (2). Said method provides good quality electrical connection between the chip (3) and the antenna (2):

公开(公告)号：EP1057139A1

公开(公告)日：2000-12-06

申请号：EP99903730.2

申请日：1999-02-10

Applicant: Gemplus

Inventor： ODDOU, Laurent ,  FREEMAN, Ray ,  AYALA, Stéphane ,  ZAFRANY, Michael ,  PATRICE, Philippe ,  BOURNEIX, Gérard ,  MARTIN, David

IPC: G06K19/077

CPC classification number: G06K19/0775 ,  G06K19/07749 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/10253 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The invention concerns a contactless electronic device (10) such as a card, a label, a ticket or a token, comprising at least an electronic microcircuit (20) arranged in the thickness of a rigid or semirigid support and comprising pads (26) connected to an interface antenna (24) arranged in the thickness of the support, the latter comprising at least two opposite, lower (12) and upper (14), protective sheets. The invention is characterised in that it comprises a stack: of a lower protective sheet (12) whereof the inner face (22) bears at least one electronic microcircuit and at least one interface antenna (24); of an intermediate bonding sheet (14) whereof the two opposite faces lower and upper are provided with adhesive; and of an upper protective sheet (16).