CERAMIC MICROELECTROMECHANICAL STRUCTURE

    公开(公告)号:CA2417352A1

    公开(公告)日:2002-02-14

    申请号:CA2417352

    申请日:2001-08-04

    Applicant: HARRIS CORP

    Abstract: A microelectromechanical structure having a ceramic substrate formed from lo w temperature co-fired ceramic sheets. A low loss photodefinable dielectric planarizing layer is formed over one surface of the ceramic substrate. This layer can be a sacrificial layer or a subsequent sacrificial layer added. A photodefined conductor is printed over the low loss dielectric planarizing layer and formed with the sacrificial layer into a structural circuit component. A switch is formed with a biasing actuator and deflectable member formed over the biasing actuator and moveable into open and closed circuit positions.

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