中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

19 records (took 0.02 seconds)

    PHASED ARRAY ANTENNA WITH INTERCONNECT MEMBER FOR ELECTRICALLY CONNECTING ORTHOGONALLY POSITIONED ELEMENTS USED AT MILLIMETER WAVELENGTH FREQUENCIES
    2.
    发明申请
    PHASED ARRAY ANTENNA WITH INTERCONNECT MEMBER FOR ELECTRICALLY CONNECTING ORTHOGONALLY POSITIONED ELEMENTS USED AT MILLIMETER WAVELENGTH FREQUENCIES 审中-公开
    具有互连连接器的相连阵列天线，用于电连接以毫米波长频率使用的正交定位元件

    公开(公告)号：WO0207263A3

    公开(公告)日：2002-05-30

    申请号：PCT/US0122873

    申请日：2001-07-19

    Applicant: HARRIS CORP

    Inventor： NEWTON CHARLES ,  SNYDER STEVEN ,  JANDZIO GREG ,  WHYBREW WALTER ,  PALMER EDWARD ,  WARSHOWSKY JAY

    IPC: H01Q9/04 ,  H01Q19/00 ,  H01Q21/00 ,  H01Q21/06 ,  H01Q23/00

    CPC classification number: H01Q23/00 ,  H01Q9/0428 ,  H01Q19/005 ,  H01Q21/0093 ,  H01Q21/065

    Abstract: A phased array antenna includes an antenna housing including a subarray assembly and a plurality of beam forming modules positioned on the subarea assembly. An antenna support and interconnect member are mounted on the antenna housing and include a carrier member having a front antenna mounting surface substantially orthogonal to the module support for supporting at least one antenna element. A rear surface has a receiving slot. At least one conductive via is associated with the receiving slot and positioned to extend through the carrier member to a circuit element, such as an antenna element, supported by the mounting surface. A launcher member is fitted into the receiving slot and has a module connecting end that extends rearward to a beam forming network.

    Abstract translation: 相控阵天线包括天线壳体，其包括子阵列组件和定位在子区域组件上的多个波束形成模块。 天线支撑和互连构件安装在天线壳体上，并且包括载体构件，其具有基本上正交于模块支撑件的前天线安装表面，用于支撑至少一个天线元件。 后表面具有接收槽。 至少一个导电通孔与接收槽相关联并且定位成延伸穿过载体构件到由安装表面支撑的电路元件，例如天线元件。 发射器构件装配到接收槽中，并且具有向后延伸到波束形成网络的模块连接端。

    ELECTRONIC MODULE INCLUDING A COOLING SUBSTRATE AND RELATED METHODS
    7.
    发明公开
    ELECTRONIC MODULE INCLUDING A COOLING SUBSTRATE AND RELATED METHODS 有权
    与冷却用基体及相关手续电子模块

    公开(公告)号：EP1378153A4

    公开(公告)日：2009-05-06

    申请号：EP02723395

    申请日：2002-03-12

    Applicant: HARRIS CORP

    Inventor： SNYDER STEVEN ,  NEWTON CHARLES ,  LANGE MICHAEL

    IPC: H01L23/473 ,  F28D15/02 ,  F28D15/06 ,  H01L23/36 ,  H01L23/427 ,  H05K7/20

    CPC classification number: H01L23/427 ,  F28D15/0233 ,  F28D15/06 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

    Abstract: An electronic module (20) includes a cooling substrate (21a), an electronic device (22) mounted thereon, and a heat sink (23) adjacent the cooling substrate (21a). More particularly, the cooling substrate (21a) may have an evaporator chamber (25) adjacent the electronic device (22), at least one condenser chamber (26) adjacent the heat sink (23), and at least one cooling fluid passageway (27) connecting the evaporator chamber (25) in fluid communication with the at least one condenser chamber (26). Furthermore, an evaporator thermal transfer body (28) may be connected in thermal communication between the evaporator chamber (25) and the electronic device (22). Additionally, at least one condenser thermal transfer body (36) may be connected in thermal communication between the at least one condenser chamber (26) and the heat sink (23). The evaporator thermal transfer body (28) and the at least one condenser thermal transfer body (36) preferably each have a higher thermal conductivity than adjacent cooling substrate portions.

    8.
    发明专利
    未知

    公开(公告)号：AT501525T

    公开(公告)日：2011-03-15

    申请号：AT01993188

    申请日：2001-11-28

    Applicant: HARRIS CORP

    Inventor： NEWTON CHARLES ,  RUMPF RAYMOND ,  GAMLEN CAROL

    IPC: H01L23/473 ,  B81B1/00 ,  B81C1/00 ,  F28D15/04 ,  H01L23/427

    Abstract: A thermally enhanced microcircuit package includes a microcircuit having a microcircuit device cavity that receives a microcircuit device. A microelectromechanical (MEMS) cooling module is operatively connected to the microcircuit package and forms a capillary pumped loop cooling circuit having an evaporator, condenser and interconnecting cooling fluid channels for passing vapor and fluid between the evaporator and condenser and evaporating and condensing the cooling fluid.

    Electronic module including a cooling substrate and related methods
    10.
    发明专利
    Electronic module including a cooling substrate and related methods 未知

    公开(公告)号：AU2002254176B2

    公开(公告)日：2004-05-20

    申请号：AU2002254176

    申请日：2002-03-12

    Applicant: HARRIS CORP

    Inventor： SNYDER STEVEN ,  NEWTON CHARLES ,  LANGE MICHAEL

    IPC: H01L23/473 ,  F28D15/02 ,  F28D15/06 ,  H01L23/36 ,  H01L23/427 ,  H05K007/20

    Abstract: An electronic module includes a cooling substrate, an electronic device mounted thereon, and a heat sink adjacent the cooling substrate. More particularly, the cooling substrate may have an evaporator chamber adjacent the electronic device, at least one condenser chamber adjacent the heat sink, and at least one cooling fluid passageway connecting the evaporator chamber in fluid communication with the at least one condenser chamber. Furthermore, an evaporator thermal transfer body may be connected in thermal communication between the evaporator chamber and the electronic device. Additionally, at least one condenser thermal transfer body may be connected in thermal communication between the at least one condenser chamber and the heat sink. The evaporator thermal transfer body and the at least one condenser thermal transfer body preferably each have a higher thermal conductivity than adjacent cooling substrate portions.

Patent Agency Ranking