-
公开(公告)号：WO02052644A9
公开(公告)日：2002-10-03
申请号：PCT/US0145063
申请日：2001-11-28
Applicant: HARRIS CORP
Inventor： NEWTON CHARLES , RUMPF RAYMOND , GAMLEN CAROL
IPC: B81B1/00 , B81C1/00 , F28D15/04 , H01L23/427 , H01L23/473
CPC classification number: F28D15/043 , B81C1/00119 , F28D2015/0225 , H01L23/427 , H01L2224/48091 , H01L2224/48227 , H01L2924/01015 , H01L2924/09701 , H01L2924/10253 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/1461 , H01L2924/00014 , H01L2924/00
Abstract: A thermally enhanced microcircuit package includes a microcircuit having a microcircuit device cavity that receives a microcircuit device. A microelectromechanical (MEMS) cooling module is operatively connected to the microcircuit package and forms a capillary pumped loop cooling circuit having an evaporator, condenser and interconnecting cooling fluid channels for passing vapor and fluid between the evaporator and condenser and evaporating and condensing the cooling fluid.
Abstract translation: 热增强微电路封装包括具有接收微电路器件的微电路器件空腔的微电路。 微机电（MEMS）冷却模块可操作地连接到微电路封装并形成毛细管泵回路冷却回路，其具有蒸发器，冷凝器和互连冷却流体通道，用于使蒸发器和冷凝器之间的蒸汽和流体通过并蒸发和冷凝冷却流体。
-
公开(公告)号：WO02052644A2
公开(公告)日：2002-07-04
申请号：PCT/US0145063
申请日：2001-11-28
Applicant: HARRIS CORP
Inventor： NEWTON CHARLES , RUMPF RAYMOND , GAMLEN CAROL
IPC: B81B1/00 , B81C1/00 , F28D15/04 , H01L23/427 , H01L23/473
CPC classification number: F28D15/043 , B81C1/00119 , F28D2015/0225 , H01L23/427 , H01L2224/48091 , H01L2224/48227 , H01L2924/01015 , H01L2924/09701 , H01L2924/10253 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/1461 , H01L2924/00014 , H01L2924/00
Abstract: A thermally enhanced microcircuit package includes a microcircuit having a microcircuit device cavity that receives a microcircuit device. A microelectromechanical (MEMS) cooling module is operatively connected to the microcircuit package and forms a capillary pumped loop cooling circuit having an evaporator, condenser and interconnecting cooling fluid channels for passing vapor and fluid between the evaporator and condenser and evaporating and condensing the cooling fluid.
Abstract translation: 热增强型微电路封装包括具有接收微电路器件的微电路器件空腔的微电路。 微机电（MEMS）冷却模块可操作地连接到微电路封装并且形成具有蒸发器，冷凝器和互连冷却流体通道的毛细管泵回路冷却回路，用于在蒸发器和冷凝器之间通过蒸气和流体并蒸发并冷凝冷却流体。
-
公开(公告)号：WO0212114A3
公开(公告)日：2002-04-25
申请号：PCT/US0124645
申请日：2001-08-04
Applicant: HARRIS CORP
Inventor： NEWTON CHARLES , RUMPF RAYMOND , GAMLEN CAROL
CPC classification number: B81C1/0015 , B81B2201/0271 , B81C2201/0109 , H01H59/0009 , H01P1/127 , H05K1/092 , H05K3/02 , Y10T29/49117 , Y10T428/24926 , Y10T428/2495
Abstract: A microelectromechanical structure having a ceramic substrate formed from low temperature co-fired ceramic sheets. A low loss photodefinable dielectric planarizing layer is formed over one surface of the ceramic substrate. This layer can be a sacrificial layer or a subsequent sacrificial layer added. A photodefined conductor is printed over the low loss dielectric planarizing layer and formed with the sacrificial layer into a structural circuit component. A switch is formed with a biasing actuator and deflectable member formed over the biasing actuator and moveable into open and closed circuit positions.
-
公开(公告)号：DE60144195D1
公开(公告)日：2011-04-21
申请号：DE60144195
申请日：2001-11-28
Applicant: HARRIS CORP
Inventor： NEWTON CHARLES , RUMPF RAYMOND , GAMLEN CAROL
IPC: H01L23/473 , B81B1/00 , B81C1/00 , F28D15/04 , H01L23/427
-
公开(公告)号：AT501525T
公开(公告)日：2011-03-15
申请号：AT01993188
申请日：2001-11-28
Applicant: HARRIS CORP
Inventor： NEWTON CHARLES , RUMPF RAYMOND , GAMLEN CAROL
IPC: H01L23/473 , B81B1/00 , B81C1/00 , F28D15/04 , H01L23/427
Abstract: A thermally enhanced microcircuit package includes a microcircuit having a microcircuit device cavity that receives a microcircuit device. A microelectromechanical (MEMS) cooling module is operatively connected to the microcircuit package and forms a capillary pumped loop cooling circuit having an evaporator, condenser and interconnecting cooling fluid channels for passing vapor and fluid between the evaporator and condenser and evaporating and condensing the cooling fluid.
-
Patent Agency Ranking
公开(公告)号：AU2002245046A1
公开(公告)日：2002-07-08
申请号：AU2002245046
申请日：2001-11-28
Applicant: HARRIS CORP
Inventor： RUMPF RAYMOND , NEWTON CHARLES , GAMLEN CAROL
IPC: B81B1/00 , B81C1/00 , F28D15/04 , H01L23/427 , H01L23/473 , B81B7/00
Abstract: A thermally enhanced microcircuit package includes a microcircuit having a microcircuit device cavity that receives a microcircuit device. A microelectromechanical (MEMS) cooling module is operatively connected to the microcircuit package and forms a capillary pumped loop cooling circuit having an evaporator, condenser and interconnecting cooling fluid channels for passing vapor and fluid between the evaporator and condenser and evaporating and condensing the cooling fluid.
-
公开(公告)号：DE60117811D1
公开(公告)日：2006-05-04
申请号：DE60117811
申请日：2001-08-04
Applicant: HARRIS CORP
Inventor： NEWTON CHARLES , RUMPF RAYMOND , GAMLEN CAROL
-
公开(公告)号：AU8111501A
公开(公告)日：2002-02-18
申请号：AU8111501
申请日：2001-08-04
Applicant: HARRIS CORP
Inventor： NEWTON CHARLES , RUMPF RAYMOND , GAMLEN CAROL
-
公开(公告)号：CA2417352C
公开(公告)日：2006-12-12
申请号：CA2417352
申请日：2001-08-04
Applicant: HARRIS CORP
Inventor： NEWTON CHARLES , RUMPF RAYMOND , GAMLEN CAROL
Abstract: A microelectromechanical structure having a ceramic substrate formed from lo w temperature co-fired ceramic sheets. A low loss photodefinable dielectric planarizing layer is formed over one surface of the ceramic substrate. This layer can be a sacrificial layer or a subsequent sacrificial layer added. A photodefined conductor is printed over the low loss dielectric planarizing layer and formed with the sacrificial layer into a structural circuit component. A switch is formed with a biasing actuator and deflectable member formed over the biasing actuator and moveable into open and closed circuit positions.
-
公开(公告)号：DE60117811T2
公开(公告)日：2006-08-31
申请号：DE60117811
申请日：2001-08-04
Applicant: HARRIS CORP
Inventor： NEWTON CHARLES , RUMPF RAYMOND , GAMLEN CAROL
-
-
-
-
-
-
-
-
-
Search Results
12
records
(took 0.02 seconds)
