公开(公告)号：WO02052644A9

公开(公告)日：2002-10-03

申请号：PCT/US0145063

申请日：2001-11-28

Applicant: HARRIS CORP

Inventor： NEWTON CHARLES ,  RUMPF RAYMOND ,  GAMLEN CAROL

IPC: B81B1/00 ,  B81C1/00 ,  F28D15/04 ,  H01L23/427 ,  H01L23/473

CPC classification number: F28D15/043 ,  B81C1/00119 ,  F28D2015/0225 ,  H01L23/427 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01015 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A thermally enhanced microcircuit package includes a microcircuit having a microcircuit device cavity that receives a microcircuit device. A microelectromechanical (MEMS) cooling module is operatively connected to the microcircuit package and forms a capillary pumped loop cooling circuit having an evaporator, condenser and interconnecting cooling fluid channels for passing vapor and fluid between the evaporator and condenser and evaporating and condensing the cooling fluid.

Abstract translation: 热增强微电路封装包括具有接收微电路器件的微电路器件空腔的微电路。 微机电（MEMS）冷却模块可操作地连接到微电路封装并形成毛细管泵回路冷却回路，其具有蒸发器，冷凝器和互连冷却流体通道，用于使蒸发器和冷凝器之间的蒸汽和流体通过并蒸发和冷凝冷却流体。

公开(公告)号：WO0250888A3

公开(公告)日：2003-08-07

申请号：PCT/US0146775

申请日：2001-12-10

Applicant: HARRIS CORP

Inventor： PIKE RANDY T ,  NEWTON CHARLES M ,  GAMLEN CAROL ,  RUMPF RAYMOND C ,  O'DOWD BETTY

IPC: H01L21/48 ,  H01L23/373 ,  H01L23/427 ,  H01L23/473 ,  H01L21/58 ,  B81B1/00

CPC classification number: H01L21/4882 ,  H01L21/4857 ,  H01L23/3735 ,  H01L23/427 ,  H01L23/473 ,  H01L24/31 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/83894 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/09701 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/85399 ,  H01L2224/05599 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method for making an electronic device includes positioning first (12) and second members (14) so that opposing surfaces thereof are in contact with one another, the first member (12) comprising silicon and the second member (14) comprising a low temperature co-fired ceramic (LTCC) material. The method further includes anodically bonding together the opposing surfaces of the first and second members to form a hermetic seal therebetween. The anodic bonding provides a secure and strong bond between the members without using adhesive. The method may further include forming at least one cooling (16, 17) structure in at least one of the first and second members. The least one cooling structure may comprise at least one first micro-fluidic cooling structure in the first member, and at least one second micro-fluidic cooling structure in the second member aligned with the at least one first micro-fluidic cooling structure.

Abstract translation: 一种制造电子设备的方法包括定位第一（12）和第二构件（14），使得其相对表面彼此接触，第一构件（12）包括硅，第二构件（14）包括低温 共烧陶瓷（LTCC）材料。 该方法还包括将第一和第二构件的相对表面阳极结合在一起，以在其间形成气密密封。 阳极接合在不使用粘合剂的情况下在构件之间提供牢固且牢固的结合。 该方法还可以包括在第一和第二构件中的至少一个中形成至少一个冷却（16,17）结构。 至少一个冷却结构可以包括第一构件中的至少一个第一微流体冷却结构，以及与第一微流体冷却结构对准的第二构件中的至少一个第二微流体冷却结构。

公开(公告)号：WO02052644A2

公开(公告)日：2002-07-04

申请号：PCT/US0145063

申请日：2001-11-28

Applicant: HARRIS CORP

Inventor： NEWTON CHARLES ,  RUMPF RAYMOND ,  GAMLEN CAROL

IPC: B81B1/00 ,  B81C1/00 ,  F28D15/04 ,  H01L23/427 ,  H01L23/473

CPC classification number: F28D15/043 ,  B81C1/00119 ,  F28D2015/0225 ,  H01L23/427 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01015 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A thermally enhanced microcircuit package includes a microcircuit having a microcircuit device cavity that receives a microcircuit device. A microelectromechanical (MEMS) cooling module is operatively connected to the microcircuit package and forms a capillary pumped loop cooling circuit having an evaporator, condenser and interconnecting cooling fluid channels for passing vapor and fluid between the evaporator and condenser and evaporating and condensing the cooling fluid.

Abstract translation: 热增强型微电路封装包括具有接收微电路器件的微电路器件空腔的微电路。 微机电（MEMS）冷却模块可操作地连接到微电路封装并且形成具有蒸发器，冷凝器和互连冷却流体通道的毛细管泵回路冷却回路，用于在蒸发器和冷凝器之间通过蒸气和流体并蒸发并冷凝冷却流体。

公开(公告)号：WO0212114A3

公开(公告)日：2002-04-25

申请号：PCT/US0124645

申请日：2001-08-04

Applicant: HARRIS CORP

Inventor： NEWTON CHARLES ,  RUMPF RAYMOND ,  GAMLEN CAROL

IPC: B81B3/00 ,  H01H59/00 ,  H01P1/12 ,  H05K1/09 ,  H05K3/02 ,  H01H1/00

CPC classification number: B81C1/0015 ,  B81B2201/0271 ,  B81C2201/0109 ,  H01H59/0009 ,  H01P1/127 ,  H05K1/092 ,  H05K3/02 ,  Y10T29/49117 ,  Y10T428/24926 ,  Y10T428/2495

Abstract: A microelectromechanical structure having a ceramic substrate formed from low temperature co-fired ceramic sheets. A low loss photodefinable dielectric planarizing layer is formed over one surface of the ceramic substrate. This layer can be a sacrificial layer or a subsequent sacrificial layer added. A photodefined conductor is printed over the low loss dielectric planarizing layer and formed with the sacrificial layer into a structural circuit component. A switch is formed with a biasing actuator and deflectable member formed over the biasing actuator and moveable into open and closed circuit positions.

公开(公告)号：DE60144195D1

公开(公告)日：2011-04-21

申请号：DE60144195

申请日：2001-11-28

Applicant: HARRIS CORP

Inventor： NEWTON CHARLES ,  RUMPF RAYMOND ,  GAMLEN CAROL

IPC: H01L23/473 ,  B81B1/00 ,  B81C1/00 ,  F28D15/04 ,  H01L23/427

公开(公告)号：AT501525T

公开(公告)日：2011-03-15

申请号：AT01993188

申请日：2001-11-28

Applicant: HARRIS CORP

Inventor： NEWTON CHARLES ,  RUMPF RAYMOND ,  GAMLEN CAROL

IPC: H01L23/473 ,  B81B1/00 ,  B81C1/00 ,  F28D15/04 ,  H01L23/427

Abstract: A thermally enhanced microcircuit package includes a microcircuit having a microcircuit device cavity that receives a microcircuit device. A microelectromechanical (MEMS) cooling module is operatively connected to the microcircuit package and forms a capillary pumped loop cooling circuit having an evaporator, condenser and interconnecting cooling fluid channels for passing vapor and fluid between the evaporator and condenser and evaporating and condensing the cooling fluid.

公开(公告)号：AU2002245046A1

公开(公告)日：2002-07-08

申请号：AU2002245046

申请日：2001-11-28

Applicant: HARRIS CORP

Inventor： RUMPF RAYMOND ,  NEWTON CHARLES ,  GAMLEN CAROL

IPC: B81B1/00 ,  B81C1/00 ,  F28D15/04 ,  H01L23/427 ,  H01L23/473 ,  B81B7/00

Abstract: A thermally enhanced microcircuit package includes a microcircuit having a microcircuit device cavity that receives a microcircuit device. A microelectromechanical (MEMS) cooling module is operatively connected to the microcircuit package and forms a capillary pumped loop cooling circuit having an evaporator, condenser and interconnecting cooling fluid channels for passing vapor and fluid between the evaporator and condenser and evaporating and condensing the cooling fluid.

公开(公告)号：DE60117811D1

公开(公告)日：2006-05-04

申请号：DE60117811

申请日：2001-08-04

Applicant: HARRIS CORP

Inventor： NEWTON CHARLES ,  RUMPF RAYMOND ,  GAMLEN CAROL

IPC: B81B3/00 ,  H01H1/00 ,  H01H59/00 ,  H01P1/12 ,  H05K1/09 ,  H05K3/02

公开(公告)号：AU8111501A

公开(公告)日：2002-02-18

申请号：AU8111501

申请日：2001-08-04

Applicant: HARRIS CORP

Inventor： NEWTON CHARLES ,  RUMPF RAYMOND ,  GAMLEN CAROL

IPC: B81B3/00 ,  H01H59/00 ,  H01P1/12 ,  H05K1/09 ,  H05K3/02 ,  H01H1/00

公开(公告)号：CA2417352C

公开(公告)日：2006-12-12

申请号：CA2417352

申请日：2001-08-04

Applicant: HARRIS CORP

Inventor： NEWTON CHARLES ,  RUMPF RAYMOND ,  GAMLEN CAROL

IPC: B81B3/00 ,  H01H1/00 ,  H01H59/00 ,  H01P1/12 ,  H05K1/09 ,  H05K3/02

Abstract: A microelectromechanical structure having a ceramic substrate formed from lo w temperature co-fired ceramic sheets. A low loss photodefinable dielectric planarizing layer is formed over one surface of the ceramic substrate. This layer can be a sacrificial layer or a subsequent sacrificial layer added. A photodefined conductor is printed over the low loss dielectric planarizing layer and formed with the sacrificial layer into a structural circuit component. A switch is formed with a biasing actuator and deflectable member formed over the biasing actuator and moveable into open and closed circuit positions.