公开(公告)号：US20180238480A1

公开(公告)日：2018-08-23

申请号：US15789741

申请日：2017-10-20

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Michael Scott ,  Steven J. Dean ,  Harvey J. Lunsman

IPC: F16L37/36 ,  F16L37/14 ,  F16L37/086

CPC classification number: F16L37/36 ,  F16L37/006 ,  F16L37/086 ,  F16L37/14 ,  F16L37/34 ,  F16L37/35 ,  F16L37/56

Abstract: Male and female fittings are configured to mate to form a valved connector system. Some embodiments of the female fitting include movable poppet configured to sealingly engage a flared projection within the female fitting. Some embodiments of the male fitting include a male mating aperture, and a movable plug configured to sealingly engage the male mating aperture. When the female fitting is mated with a male fitting, the male fitting forces the poppet to disengage from the flared projection, and the flared projection forces the plug to recede into the male fitting, to open a fluid path through the valved connector system.

公开(公告)号：US11765848B2

公开(公告)日：2023-09-19

申请号：US17388412

申请日：2021-07-29

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Michael Scott

IPC: H05K7/14 ,  H05K7/20

CPC classification number: H05K7/1402 ,  H05K7/20436 ,  H05K7/205 ,  H05K7/20154 ,  H05K7/20509

Abstract: Example implementations relate to a host electronic device configured for establishing a thermal contact between a heat generating component of a removable electronic device, and a cooling component of the host electronic device, when the removable electronic device is detachably connected to the host electronic device. The host electronic device includes a support structure, the cooling component, a driver, and an actuator. The cooling component is movably connected to the support structure. The driver is also movably connected to the support structure. The actuator is movably connected to the support structure and the driver. The actuator, upon contact by the removable device, causes a movement of the cooling component via the driver for establishing the thermal contact between the cooling component and the heat generating component.

公开(公告)号：US20220342465A1

公开(公告)日：2022-10-27

申请号：US17237529

申请日：2021-04-22

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Michael Scott

IPC: G06F1/20 ,  G06F1/18 ,  H05K7/20

Abstract: Example implementations relate to a host electronic device and a method of establishing a thermal contact with a removable electronic device by a cooling component of the host electronic device. The host electronic device includes a housing, the cooling component, and a plurality of flexible arms. The cooling component is movably coupled to the housing. The plurality of flexible arms extend towards an internal cavity of the housing to hold the cooling component in a first position (retracted position). Further, the plurality of flexible arms are displaceable from the internal cavity by a movement of the removable electronic device into the host electronic device, to allow the cooling component to drop down to a second position (extended position) for establishing the thermal contact with a heat generating component of the removable electronic device.

公开(公告)号：US20200229319A1

公开(公告)日：2020-07-16

申请号：US16247350

申请日：2019-01-14

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Michael Scott ,  Bret Cuda ,  David Petersen ,  Eng Lim Goh ,  Mark R. Fernandez ,  John Kichury ,  Robert Behringer ,  Calandra Szulgit

IPC: H05K7/20 ,  G06F1/20

Abstract: Example containers are provided to retain and cool electronic devices in environments where power and/or coolant (e.g., airflow) is limited or finite. In examples, a container can include a housing and a conduit system. The housing can include a plurality of sides including a front side and a back side, and can be structured to retain at least a first computing device. In addition, the housing can provide for a first and second inlet opening and a first and second outlet opening on the back side of the container. The conduit system can be provided within the housing to guide the airflow received from each of the first and second outlet openings through an interior volume of the container to cause the airflow to exit from each of the first and second outlet openings. Further, the conduit system can include a plurality of structures that combine to guide at least a portion of the airflow received through the first and second inlet openings through a top region of the interior volume as the airflow is moved from the back side of the container to the front side of the container. Further still, the conduit system can guide at least a portion of the warmed airflow to a bottom region of the interior volume as the warmed airflow is moved from the front side to the back side of the container.

公开(公告)号：US20250013253A1

公开(公告)日：2025-01-09

申请号：US18887195

申请日：2024-09-17

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Michael Scott ,  Harvey J. Lunsman ,  David Collins

IPC: G05D16/10 ,  F15B1/02 ,  F15B1/027 ,  F15B1/033 ,  F15B1/24 ,  F15B21/00 ,  F16L55/052 ,  F16L55/053 ,  H05K7/20

Abstract: Example implementations relate to a pressure regulator assembly for a closed fluid loop of a CDU. The pressure regulator assembly has a cylinder having an internal volume, and first and second hollow pistons slidably connected to the cylinder to split the internal volume into a first volume portion having cooling fluid, a second volume portion having driver fluid, and a third volume portion having compressible matter. The first volume portion is fluidically connected to the closed fluid loop. The first hollow piston is reciprocated by the compressible matter to maintain operating pressure of the cooling fluid in the closed fluid loop. The second hollow piston is driven by the driver fluid in response to predefined pressure drop of the cooling fluid during predefined time period, to inject additional cooling fluid from the first volume portion into the closed fluid loop to restore pressure level of cooling fluid to operating pressure.

公开(公告)号：US20240061453A1

公开(公告)日：2024-02-22

申请号：US17821028

申请日：2022-08-19

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Michael Scott ,  Harvey J. Lunsman ,  David Collins

IPC: G05D16/10 ,  H05K7/20

CPC classification number: G05D16/109 ,  H05K7/20281 ,  H05K7/20272

Abstract: Example implementations relate to a pressure regulator assembly for a closed fluid loop of a CDU. The pressure regulator assembly has a cylinder having an internal volume, and first and second hollow pistons slidably connected to the cylinder to split the internal volume into a first volume portion having cooling fluid, a second volume portion having driver fluid, and a third volume portion having compressible matter. The first volume portion is fluidically connected to the closed fluid loop. The first hollow piston is reciprocated by the compressible matter to maintain operating pressure of the cooling fluid in the closed fluid loop. The second hollow piston is driven by the driver fluid in response to predefined pressure drop of the cooling fluid during predefined time period, to inject additional cooling fluid from the first volume portion into the closed fluid loop to restore pressure level of cooling fluid to operating pressure.

公开(公告)号：US20230315133A1

公开(公告)日：2023-10-05

申请号：US17708270

申请日：2022-03-30

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Michael Scott ,  Harvey J. Lunsman

IPC: G05D16/10 ,  H05K7/20

CPC classification number: G05D16/10 ,  H05K7/20781

Abstract: Example implementations relate to an accumulator for regulating variations in operating pressure of a cool fluid in a closed fluid loop of a coolant distribution unit (CDU). The accumulator includes a cylinder having an internal volume defined between an inlet and outlet, and a hollow piston slidably connected to the cylinder through one of the inlet or outlet to split the internal volume into a first volume portion filled with the cool fluid and a second volume portion filled with a compressible matter that is maintained at the operating pressure by the cool fluid filled in the first volume portion via the hollow piston. The first volume portion is fluidically connected to the closed fluid loop functioning at the operating pressure via the hollow piston and other one of the inlet or the outlet to direct a flow of the cool fluid into the closed fluid loop via the accumulator.

公开(公告)号：US20230262928A1

公开(公告)日：2023-08-17

申请号：US17669753

申请日：2022-02-11

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Steven Dean ,  Michael Scott ,  Harvey J. Lunsman

IPC: H05K7/20 ,  F15B1/04

CPC classification number: H05K7/20272 ,  F15B1/04 ,  H05K7/20781 ,  F15B2201/405 ,  F15B2201/605

Abstract: Examples described herein relate to compact and replaceable accumulator to be utilized in a chassis-level cooling device. The accumulator is a low pressurized device having a housing, a bladder, and a compressible fluid. The housing has an inner surface defining a volume and an opening. The bladder is disposed within a volume portion and attached to the opening. The bladder includes a plurality of elongated wall sections foldably coupled to each other and defining a bladder volume therebetween. The bladder inflates by unfolding the plurality of elongated wall sections to increase the bladder volume in response to an increase in a pressure of a working fluid inside the bladder volume. The compressible fluid is contained in a remaining volume portion between the inner surface of the housing and the bladder. The compressible fluid is compressed to an offset pressure in response to inflation of the plurality of elongated wall sections.

公开(公告)号：US10955883B1

公开(公告)日：2021-03-23

申请号：US16653335

申请日：2019-10-15

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： John Franz ,  Robert Mascia ,  Harvey Lunsman ,  Steven Dean ,  Michael Scott

IPC: G06F1/20 ,  G06F1/26 ,  H05K7/20

Abstract: A computing apparatus includes an enclosure to house computing nodes; a slot to receive a power supply unit that is to provide power to the computing nodes; and a cold plate assembly positioned in the slot. The cold plate assembly includes a first thermal exchange surface and a cooling loop. The first thermal exchange surface is inclined relative to a horizontal dimension of the slot and is to make thermal contact with a complementary thermal exchange surface of the power supply unit when the power supply unit is received by the slot, the complementary thermal exchange surface also being inclined relative to a horizontal dimension of the slot. The cooling loop is thermally coupled to the first interface and through which liquid coolant is to flow.

公开(公告)号：US20250048595A1

公开(公告)日：2025-02-06

申请号：US18362358

申请日：2023-07-31

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Harvey J. Lunsman ,  Michael Scott ,  Steven Dean

IPC: H05K7/20

Abstract: Cooling module includes a mounting element, a force application member, a lever, and a cold plate movably coupled to the mounting element. The mounting element having engagement members, is coupled to a receptacle of an electronic device that is configured to receive a removable electronic device at the receptacle. The force application member having spring fingers, is disposed between the mounting element and the cold plate, and movable relative to the mounting element. The lever is connected to the mounting element and the force application member and shiftable between actuated and unactuated states. In the actuated state, the lever pushes the force application member along a first direction causing the engagement members to move the force application member along a second direction perpendicular to the first direction and urge the cold plate to compress the spring fingers and establish thermal contact between the cold plate and the removable electronic module.