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公开(公告)号：US20180103324A1
公开(公告)日：2018-04-12
申请号：US15364728
申请日：2016-11-30
Applicant: HYUNDAI MOTOR COMPANY
Inventor： Ilseon YOO
CPC classification number: H04R19/04 , B81B3/0094 , B81B2201/0257 , B81C1/00158 , B81C2201/013 , H04R1/342 , H04R31/003 , H04R2201/003
Abstract: Disclosed are a microphone and a manufacturing method thereof. The microphone includes a substrate with a through portion formed in a central portion thereof, a vibration membrane disposed on the substrate and covering the through portion, a fixed membrane installed above the vibration membrane and spaced apart from the vibration membrane with an air layer interposed therebetween, and including a plurality of air inlets perforated in a direction toward the air layer, a support layer supporting the fixed membrane installed above the vibration membrane and spaced apart from the vibration membrane, a back plate formed on the fixed membrane and the support layer and having the air inlet formed to extend in a central portion thereof, and an air outflow part allowing air of the air layer to flow to an outer area of an edge of a sensing area of the fixed membrane on the back plate.
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公开(公告)号：US20170008759A1
公开(公告)日：2017-01-12
申请号：US14945627
申请日：2015-11-19
Applicant: HYUNDAI MOTOR COMPANY
Inventor： Ilseon YOO
CPC classification number: H04R3/007 , H04R3/06 , H04R17/02 , H04R19/04 , H04R29/004 , H04R2499/11
Abstract: A microphone includes a case including a sound hole; a sound element which outputs a sound output signal based on a sound signal that enters the case through the sound hole; and a semiconductor chip connected to the sound element and configured to adjust an applied voltage which is applied to the sound element in accordance with the sound output signal. A rigidity of a vibration layer of the sound element is adjusted in accordance with the applied voltage.
Abstract translation: 麦克风包括一个包括一个声孔的壳体; 声音元件，其基于通过所述声孔进入所述壳体的声音信号输出声音输出信号; 以及连接到声音元件并被配置为根据声音输出信号调整施加到声音元件的施加电压的半导体芯片。 根据施加的电压来调整声音元件的振动层的刚度。
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公开(公告)号：US20160157011A1
公开(公告)日：2016-06-02
申请号：US14853524
申请日：2015-09-14
Applicant: HYUNDAI MOTOR COMPANY
Inventor： Ilseon YOO
IPC: H04R1/40
CPC classification number: H04R3/00 , H04R2410/01 , H04R2499/13
Abstract: A microphone device includes a case having a sound hole and a phase delay membrane. A plurality of non-directional microphones disposed in the case. A semiconductor chip is connected to the non-directional micro electro mechanical system (MEMS) microphones and operating in response to input signals, in which any one of the non-directional microphones forms a directional microphone by being connected with the sound hole and the phase delay membrane of the case.
Abstract translation: 麦克风装置包括具有声孔和相位延迟膜的壳体。 设置在壳体中的多个非定向麦克风。 半导体芯片连接到非定向微机电系统（MEMS）麦克风，并且响应于输入信号而工作，其中任何一个非定向麦克风通过与声孔和相位相连而形成定向麦克风 延迟膜的情况。
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14.发明申请公开(公告)号：US20160150319A1
公开(公告)日：2016-05-26
申请号：US14852310
申请日：2015-09-11
Applicant: HYUNDAI MOTOR COMPANY
Inventor： Ilseon YOO
CPC classification number: H04R31/00 , B81B3/00 , H04R1/342 , H04R1/38 , H04R19/005 , H04R19/04 , H04R29/004 , H04R2499/11 , H04R2499/13
Abstract: Disclosed are a method of manufacturing a microphone, a microphone, and a control method thereof. The method includes forming a sound sensing module on a main substrate including a first sound aperture such that the sound sensing module is connected to the first sound aperture. The method further include forming a cover for receiving the sound sensing module formed therein with a second sound aperture corresponding to the first sound aperture on the main substrate. The method also includes forming a sound delay filter at a receiving space of the cover to be connected to the second sound aperture. The method also includes forming a semiconductor chip electrically connected to the sound sensing module at the receiving space, to selectively operate the sound delay filter according to a signal output from the sound sensing module.
Abstract translation: 公开了麦克风，麦克风及其控制方法的制造方法。 该方法包括在包括第一声孔的主基板上形成声音传感模块，使得声音感测模块连接到第一声孔。 该方法还包括形成用于接收其中形成的声音传感模块的盖，其具有对应于主基板上的第一声孔的第二声孔。 该方法还包括在要连接到第二声孔的盖的接收空间处形成声音延迟滤波器。 该方法还包括形成在接收空间处电连接到声音感测模块的半导体芯片，以根据从声音传感模块输出的信号有选择地操作声音延迟滤波器。
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公开(公告)号：US20190230447A1
公开(公告)日：2019-07-25
申请号：US16371645
申请日：2019-04-01
Applicant: HYUNDAI MOTOR COMPANY , KIA MOTORS CORPORATION
Inventor： Ilseon YOO
CPC classification number: H04R19/04 , B81B3/0075 , B81B2201/0257 , B81B2203/0127 , B81C1/00158 , B81C2201/0109 , B81C2201/013 , H01L51/0048 , H04R19/005 , H04R31/00 , H04R31/003 , H04R2201/003
Abstract: A high sensitivity microphone includes a substrate having a through portion provided in a central portion thereof, a vibration membrane disposed on the substrate and covering the through portion, a fixed membrane installed above the vibration membrane, spaced apart from the vibration membrane with an air layer interposed therebetween, and having a plurality of air inlets perforated in a direction toward the air layer, and a plurality of support posts provided as vertical elastic posts between the fixed membrane and the vibration membrane and mechanically fixing the vibration membrane by a frictional force, regardless of an applied voltage.
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Patent Agency Ranking
公开(公告)号：US20190082268A1
公开(公告)日：2019-03-14
申请号：US15824321
申请日：2017-11-28
Applicant: HYUNDAI MOTOR COMPANY , KIA MOTORS CORPORATION
Inventor： Ilseon YOO
Abstract: A microphone includes: a vibration electrode disposed in an upper portion of a substrate which has an acoustic hole; a fixed electrode separated from the upper portion of the vibration electrode by a reference distance and having an insulation membrane on each of an upper surface and a lower surface of the fixed electrode; and a piezoelectric electrode having a plurality of beams disposed in a radial direction outwards from a center of an upper portion of the fixed electrode and uniformly maintaining a space between the vibration electrode and the fixed electrode by bending the fixed electrode in one direction according to an input voltage.
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公开(公告)号：US20180220240A1
公开(公告)日：2018-08-02
申请号：US15657925
申请日：2017-07-24
Applicant: HYUNDAI MOTOR COMPANY , KIA MOTORS CORPORATION
Inventor： Ilseon YOO
CPC classification number: H04R19/04 , B81B3/0037 , B81B2201/0257 , B81B2203/0127 , H04R7/06 , H04R7/18 , H04R7/20 , H04R19/005 , H04R31/003 , H04R2201/003
Abstract: A microphone includes: a substrate configured to have a through hole formed at a central portion thereof; a vibration membrane disposed to cover the through hole on the substrate to include a slit pattern in which slit patterns are arranged in a plurality of lines along a circular edge thereof; a fixed membrane separately mounted at an upper portion of the vibration membrane with an air layer therebetween to have a plurality of air inlets that extend therebetween in a direction of the air layer; and a support layer configured to support the fixed membrane separately mounted on the vibration membrane.
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公开(公告)号：US20180115834A1
公开(公告)日：2018-04-26
申请号：US15376012
申请日：2016-12-12
Applicant: HYUNDAI MOTOR COMPANY
Inventor： Ilseon YOO
CPC classification number: H04R19/005 , B81B3/0094 , B81B7/0061 , B81B2201/0257 , B81B2203/04 , B81B2207/07 , B81C1/00166 , H04R19/04 , H04R31/003 , H04R31/006
Abstract: A Micro Electro Mechanical System (MEMS) microphone is provided. The MEMS microphone includes: a substrate including an audio hole and having an oxide layer at a predetermined segment along an upper surface edge; a vibration electrode that is supported by a support layer that is formed along an upper surface edge in a state that is separated to the inside of the center from the oxide layer at an upper portion corresponding to the audio hole; a fixed electrode that is formed at an upper portion of the oxide layer and in which one side of the support layer is bonded to one side of a low surface; and a back plate that is formed at an upper portion of the fixed electrode and in which the other side of the support layer is bonded to one side of a low surface.
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公开(公告)号：US20180077499A1
公开(公告)日：2018-03-15
申请号：US15373176
申请日：2016-12-08
Applicant: HYUNDAI MOTOR COMPANY
Inventor： Ilseon YOO
CPC classification number: H04R19/04 , B81B3/0075 , B81B2201/0257 , B81B2203/0127 , B81C1/00158 , B81C2201/0109 , B81C2201/013 , H01L51/0048 , H04R19/005 , H04R31/00 , H04R31/003 , H04R2201/003
Abstract: A high sensitivity microphone includes a substrate having a through portion provided in a central portion thereof, a vibration membrane disposed on the substrate and covering the through portion, a fixed membrane installed above the vibration membrane, spaced apart from the vibration membrane with an air layer interposed therebetween, and having a plurality of air inlets perforated in a direction toward the air layer, and a plurality of support posts provided as vertical elastic posts between the fixed membrane and the vibration membrane and mechanically fixing the vibration membrane by a frictional force, regardless of an applied voltage.
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公开(公告)号：US20170171667A1
公开(公告)日：2017-06-15
申请号：US15163406
申请日：2016-05-24
Applicant: HYUNDAI MOTOR COMPANY
Inventor： Ilseon YOO
CPC classification number: H04R9/08 , H04R19/005 , H04R19/04 , H04R31/00
Abstract: A microphone includes a plurality of vibration membrane electrodes, and a plurality of fixing membrane electrodes that respectively faces the plurality of vibration membrane electrodes and forms a plurality of unit capacitors along with the facing vibration membrane electrodes, wherein the plurality of unit capacitors generates a plurality of unit output signals according to inputs of a power source and a sound source, and outputs a signal combining the plurality of unit output signals as an output signal corresponding to the sound source.
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