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公开(公告)号：US20180146299A1
公开(公告)日：2018-05-24
申请号：US15622602
申请日：2017-06-14
Applicant: HYUNDAI MOTOR COMPANY , KIA MOTORS CORPORATION
Inventor： Ilseon YOO
Abstract: The present disclosure provides a microphone including: a substrate having an acoustic hole; a vibrating electrode disposed on the substrate; and a fixing layer disposed on the vibrating electrode, wherein a central portion of the fixing layer corresponding to the acoustic hole of the substrate is formed upwardly convex.
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公开(公告)号：US20180288528A1
公开(公告)日：2018-10-04
申请号：US16001448
申请日：2018-06-06
Applicant: HYUNDAI MOTOR COMPANY , KIA MOTORS CORPORATION
Inventor： Hyunsoo KIM , Ilseon YOO
Abstract: A microphone includes a substrate including an acoustic hole; a supporting layer disposed along a circumference of the substrate; and a vibrating film disposed on the supporting layer and spaced apart from the substrate, wherein the vibrating film includes a first vibrating region positioned at a portion corresponding to the acoustic hole; a second vibrating region connected to the first vibrating region, and including an air inlet; and a third vibrating region connected to the second vibrating region through a plurality of connection parts.
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公开(公告)号：US20180070181A1
公开(公告)日：2018-03-08
申请号：US15385193
申请日：2016-12-20
Applicant: HYUNDAI MOTOR COMPANY
Inventor： Hyunsoo KIM , Ilseon YOO
CPC classification number: H04R7/26 , H04R19/005 , H04R19/04 , H04R31/003 , H04R2201/003 , H04R2410/03
Abstract: A microphone includes a substrate including an acoustic hole; a supporting layer disposed along a circumference of the substrate; and a vibrating film disposed on the supporting layer and spaced apart from the substrate, wherein the vibrating film includes a first vibrating region positioned at a portion corresponding to the acoustic hole; a second vibrating region connected to the first vibrating region, and including an air inlet; and a third vibrating region connected to the second vibrating region through a plurality of connection parts.
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公开(公告)号：US20170166443A1
公开(公告)日：2017-06-15
申请号：US15197418
申请日：2016-06-29
Applicant: HYUNDAI MOTOR COMPANY
Inventor： Ilseon YOO
IPC: B81C1/00
CPC classification number: B81C1/00269 , B81B7/007 , B81B2201/0235 , B81B2201/0242 , B81B2203/04 , B81C2201/013 , B81C2201/0159 , B81C2203/0118 , B81C2203/031 , B81C2203/035 , B81C2203/036
Abstract: A manufacturing method of a MEMS sensor includes forming a first substrate, wherein the first substrate includes a lower electrode provided at one surface thereof, forming a second substrate, wherein the second substrate includes a first concave-convex portion provided at one surface thereof, first-bonding one surface of the first substrate and one surface of the second substrate to face each other, forming a third substrate, wherein the third substrate includes an upper electrode provided at one surface thereof, second-bonding another surface of the second substrate and one surface of the third substrate to face each other, and forming an electrode line on another surface of the third substrate to be connected to the lower electrode and the upper electrode.
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公开(公告)号：US20160150324A1
公开(公告)日：2016-05-26
申请号：US14883527
申请日：2015-10-14
Applicant: HYUNDAI MOTOR COMPANY
Inventor： Ilseon YOO
CPC classification number: H04R19/04 , H04R1/342 , H04R19/005 , H04R31/00 , H04R31/003 , H04R2201/003
Abstract: A microphone includes: a first substrate having one or more first penetration holes; a vibrating membrane disposed on the first substrate and covering the first penetration holes; a fixed membrane disposed at a predetermined distance over the vibration membrane and having a plurality of air intake holes; and a phase delay unit bonded by a bonding pad on the fixed membrane, having a plurality of second penetration holes connected to the one or more first penetration holes, and having a phase delay material in the second penetration holes. A method of manufacturing a microphone including a phase delay unit is also disclosed.
Abstract translation: 麦克风包括：具有一个或多个第一穿透孔的第一基底; 振动膜，设置在所述第一基板上并覆盖所述第一穿透孔; 固定膜，其设置在所述振动膜上并且具有多个空气吸入孔; 以及相位延迟单元，其由所述固定膜上的接合焊盘接合，具有与所述一个以上的第一贯通孔连接的多个第二贯通孔，并且在所述第二贯通孔中具有相位延迟材料。 还公开了一种制造包括相位延迟单元的麦克风的方法。
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Patent Agency Ranking
公开(公告)号：US20230032424A1
公开(公告)日：2023-02-02
申请号：US17865289
申请日：2022-07-14
Applicant: HYUNDAI MOTOR COMPANY , Kia Corporation
Inventor： Ilseon YOO , Sang-Hyeok YANG , Dong Gu KIM , Hyunsoo KIM
IPC: B81B3/00
Abstract: A MEMS microphone according to an embodiment comprises a substrate including an air chamber in a central portion, a back-plate disposed above the substrate and including a plurality of penetration holes through which a sound wave passes, and a vibration membrane disposed between the back-plate and the substrate, forming compressive residual stress, having a base form convexly bent toward the back-plate, and configured to vibrate a sound pressure transferred through the plurality of penetration holes.
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公开(公告)号：US20180122356A1
公开(公告)日：2018-05-03
申请号：US15610852
申请日：2017-06-01
Applicant: Hyundai Motor Company , Kia Motors Corporation
Inventor： Ilseon YOO
IPC: G10K11/178 , H04R17/00 , H04R19/04 , H04R31/00 , H04R19/00
CPC classification number: G10K11/178 , B60J1/02 , B60R13/08 , G10K11/17823 , G10K11/1787 , G10K2210/12821 , G10K2210/129 , G10K2210/3044 , G10K2210/3045 , G10K2210/3211 , G10K2210/3212 , G10K2210/3218 , G10K2210/3226 , G10K2210/3229 , H04R3/005 , H04R17/00 , H04R19/005 , H04R19/04 , H04R31/003 , H04R2201/003 , H04R2410/05 , H04R2499/13
Abstract: A microphone system may include a measuring device that includes a plurality of sound elements and a semiconductor chip connected to the sound elements and receives a vibration signal and a noise signal from the outside to cancel the vibration signal and changes a phase of the noise signal to output a reverse phase noise signal; and a driver that is connected to the semiconductor chip and is included in a front glass of a vehicle and vibrates in response to the reverse phase noise signal to cancel a noise signal inputted from the outside.
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公开(公告)号：US20170347185A1
公开(公告)日：2017-11-30
申请号：US15263594
申请日：2016-09-13
Applicant: HYUNDAI MOTOR COMPANY
Inventor： Hyunsoo KIM , Ilseon YOO
CPC classification number: H04R1/2807 , H04R19/005 , H04R19/04 , H04R31/003
Abstract: A microphone includes an acoustic element including an acoustic hole; a case disposed below the acoustic element and including an acoustic inlet formed in a position corresponding to the acoustic hole; and a plurality of through holes formed between the acoustic element and the case and formed in a position corresponding to the acoustic hole.
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公开(公告)号：US20160112806A1
公开(公告)日：2016-04-21
申请号：US14853507
申请日：2015-09-14
Applicant: HYUNDAI MOTOR COMPANY
Inventor： Ilseon YOO
CPC classification number: H04R19/005 , B81B2201/0257 , B81C1/00182 , H04R7/04 , H04R7/16 , H04R7/26 , H04R31/00 , H04R2231/003
Abstract: A method of manufacturing a microphone includes preparing a substrate and forming an oxide layer pattern on the substrate and an oxide layer on a rear side of the substrate. The vibration membrane is formed over the substrate by injecting conductive ions into the substrate. A sacrificial layer and a fixed electrode are sequentially formed on the substrate and the vibration membrane by removing the oxide layer pattern. A first photoresist layer pattern is formed on the fixed electrode, and an air inlet is formed by patterning the fixed electrode. A second photoresist layer pattern is formed on a rear side of the oxide layer, and a penetration hole, through which a portion of the vibration membrane is exposed, is formed by etching the oxide layer and the rear side of the substrate. An air layer is formed between the fixed electrode and the vibration membrane.
Abstract translation: 麦克风的制造方法包括：准备基板，在基板上形成氧化物层图案，在基板的背面形成氧化物层。 振动膜通过将导电离子注入衬底而在衬底上形成。 通过去除氧化物层图案，在基板和振动膜上依次形成牺牲层和固定电极。 在固定电极上形成第一光致抗蚀剂层图案，并且通过图案化固定电极形成空气入口。 在氧化物层的后侧形成有第二光致抗蚀剂层图案，并且通过蚀刻氧化物层和衬底的后侧形成通过其暴露振动膜的一部分的穿透孔。 在固定电极和振动膜之间形成空气层。
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公开(公告)号：US20190090048A1
公开(公告)日：2019-03-21
申请号：US16192407
申请日：2018-11-15
Applicant: HYUNDAI MOTOR COMPANY , KIA MOTORS CORPORATION
Inventor： Hyunsoo KIM , Ilseon YOO
CPC classification number: H04R1/2807 , H04R19/005 , H04R19/04 , H04R31/003
Abstract: A microphone includes an acoustic element including an acoustic hole; a case disposed below the acoustic element and including an acoustic inlet formed in a position corresponding to the acoustic hole; and a plurality of through holes formed between the acoustic element and the case and formed in a position corresponding to the acoustic hole.
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