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公开(公告)号：US10277983B2
公开(公告)日：2019-04-30
申请号：US15821333
申请日：2017-11-22
Applicant: HYUNDAI MOTOR COMPANY , KIA MOTORS CORPORATION
Inventor： Ilseon Yoo
Abstract: A microphone apparatus is disclosed. A microphone apparatus according to an exemplary embodiment includes a vibration membrane disposed inside a case and formed on an upper surface of a main substrate; an acoustic component including an absorbing unit cut over a predetermined section toward the outside of a fixed membrane and having a predetermined pattern; a microphone module including a semiconductor chip electrically connected to the acoustic component inside the case; and a printed circuit board on which the microphone module is mounted.
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公开(公告)号：US20180338208A1
公开(公告)日：2018-11-22
申请号：US15798836
申请日：2017-10-31
Applicant: Hyundai Motor Company , Kia Motors Corporation
Inventor： Ilseon Yoo
CPC classification number: H04R19/04 , H04R7/16 , H04R19/005 , H04R31/003 , H04R2231/003
Abstract: The present disclosure provides a microphone and a manufacturing method thereof. The microphone includes: a fixed membrane disposed on a substrate; a diaphragm spaced apart from the fixed membrane, wherein an air layer is positioned between the fixed membrane and the diaphragm; a supporting layer configured to support the diaphragm on the fixed membrane; and a damping hole configured to flow air in the air layer to a non-sensing area of the supporting layer.
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公开(公告)号：US20180332405A1
公开(公告)日：2018-11-15
申请号：US15804083
申请日：2017-11-06
Applicant: Hyundai Motor Company , Kia Motors Corporation
Inventor： Hyunsoo Kim , Ilseon Yoo
CPC classification number: H04R19/04 , H04R1/04 , H04R3/007 , H04R7/14 , H04R7/18 , H04R19/005 , H04R31/00 , H04R31/003
Abstract: A microphone and a manufacturing method thereof are provided. The microphone includes a substrate that has a cavity formed in a central portion thereof, and a diaphragm that is disposed on the substrate to cover the cavity and includes a first non-doped area formed at predetermined intervals. A fixed membrane is spaced apart from the diaphragm with an air layer interposed therebetween. A second non-doped area protrudes upward to prevent direct contact with the diaphragm and a supporting layer supports the fixed membrane and the diaphragm.
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公开(公告)号：US09736596B2
公开(公告)日：2017-08-15
申请号：US14946000
申请日：2015-11-19
Applicant: Hyundai Motor Company
Inventor： Hyunsoo Kim , Ilseon Yoo
CPC classification number: H04R19/04 , H04R1/04 , H04R1/406 , H04R3/005 , H04R19/005 , H04R2201/003 , H04R2410/01
Abstract: A microphone includes a case including a plurality of sound holes; a first sound device installed at positions corresponding to at least two sound holes in the case; a second sound device spaced apart from the first sound device in the case and installed at a position corresponding to at least one sound hole; and a semiconductor chip electrically connected to the first sound device and the second sound device, where the at least two sound holes formed in the positions corresponding to the first sound device are each formed in upper and lower surfaces of the case on the basis of the first sound device.
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公开(公告)号：US20170094405A1
公开(公告)日：2017-03-30
申请号：US15274419
申请日：2016-09-23
Applicant: Hyundai Motor Company
Inventor： Ilseon Yoo , Hyunsoo Kim
CPC classification number: H04R1/326 , H04R1/04 , H04R1/347 , H04R19/005 , H04R31/006 , H04R2201/003 , H04R2410/07
Abstract: A microphone and a method for manufacturing the same are disclosed. The microphone includes: a main substrate in which a first sound hole is formed; a sound sensing module formed in the main substrate corresponding to the first sound hole; a semiconductor chip electrically connected with the sound sensing module and formed on the main substrate; a cover mounted to the main substrate, and in which a second sound hole is formed; and a sound delay filter mounted corresponding to the second sound hole, and in which a plurality of filter holes are formed.
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Patent Agency Ranking
公开(公告)号：US20170064459A1
公开(公告)日：2017-03-02
申请号：US14955341
申请日：2015-12-01
Applicant: Hyundai Motor Company
Inventor： Ilseon Yoo
CPC classification number: H04R19/04 , B81B2201/0257 , H04R1/025 , H04R17/005 , H04R17/02 , H04R31/00 , H04R31/006 , H04R2201/003 , H04R2499/13
Abstract: A detachable microphone includes: a body part made of a flexible polymer; a capacitance part positioned in the body part and including a support interposed between a first capacitive electrode and a second capacitive electrode; and a piezoelectric part positioned on the capacitance part and positioned in the body part, and including a piezoelectric body interposed between a first piezoelectric electrode and a second piezoelectric electrode.
Abstract translation: 可拆卸麦克风包括：由柔性聚合物制成的主体部分; 电容部，其位于所述主体部，并且包括插入在第一电容电极和第二电容电极之间的支撑体; 以及位于所述电容部上且位于所述主体部的压电体，并且包括插入在第一压电电极和第二压电电极之间的压电体。
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公开(公告)号：US20170011752A1
公开(公告)日：2017-01-12
申请号：US14937593
申请日：2015-11-10
Applicant: Hyundai Motor Company
Inventor： Ilseon Yoo
CPC classification number: H04R31/006 , H04R1/04 , H04R3/005 , H04R19/005 , H04R19/04 , H04R2499/13 , H04S7/00 , H04S2420/01
Abstract: A microphone includes: a case that is vibrated by a vibration signal, a sound inlet through which a sound signal is input being formed at a portion of the case; a first sound element that is formed in the case at a position corresponding to the sound inlet and receives the sound signal and the vibration signal to output a first initial signal; a second sound element that is formed to be adjacent to the first sound element and receives the vibration signal to output a second initial signal; and a semiconductor chip that is connected to the first sound element and the second sound element and receives the first initial signal and the second initial signal to output a final signal.
Abstract translation: 麦克风包括：通过振动信号振动的壳体，在壳体的一部分处形成声音输入的声音入口; 在与所述声音入口相对应的位置处形成的第一声音元件，并接收所述声音信号和所述振动信号以输出第一初始信号; 形成为与第一声音元件相邻并接收振动信号以输出第二初始信号的第二声音元件; 以及连接到第一声音元件和第二声音元件并接收第一初始信号和第二初始信号以输出最终信号的半导体芯片。
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公开(公告)号：US09485571B2
公开(公告)日：2016-11-01
申请号：US14798716
申请日：2015-07-14
Applicant: Hyundai Motor Company
Inventor： Ilseon Yoo
CPC classification number: H04R3/00 , H04R1/20 , H04R31/00 , H04R2201/003
Abstract: A method of manufacturing a microphone, a microphone, and a method of controlling the microphone are provided. The method includes forming a sound sensing module on a mainboard having a first sound aperture, to be connected with the first sound aperature and forming a cover having a second sound aperature that corresponds to the first sound aperature, mounted on the mainboard, and housing the sound sensing module. A first and second sound delay filters are formed in a space defined by the cover, to be connected with the second sound hole and thermal actuators are disposed at both sides of the first sound delay filter and move the first sound delay filter based on whether power is supplied. A semiconductor chip is electrically connected with the sound sensing module in the space and selectively operates the thermal actuators in response to signals from the sound sensing module.
Abstract translation: 提供一种麦克风的制造方法，麦克风和麦克风的控制方法。 该方法包括在具有第一声孔的主板上形成声音传感模块，以与第一声音温度相连，并形成具有安装在主板上的具有对应于第一声音的第二声音的盖子，并且将 声音传感模块。 第一和第二声音延迟滤波器形成在由盖限定的空间中，以与第二声孔连接，并且热致动器设置在第一声音延迟滤波器的两侧，并且基于电源是否移动第一声音延迟滤波器 被提供。 半导体芯片与空间中的声音传感模块电连接，响应于来自声音传感模块的信号选择性地操作热致动器。
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公开(公告)号：US20150187704A1
公开(公告)日：2015-07-02
申请号：US14445653
申请日：2014-07-29
Applicant: Hyundai Motor Company
Inventor： Ilseon Yoo , Hiwon Lee , Soon-myung Kwon , Hyunsoo Kim
IPC: H01L23/544 , H01L21/311 , H01L21/027 , H01L23/00
CPC classification number: H01L23/544 , H01L21/0272 , H01L21/31133 , H01L21/31144 , H01L24/83 , H01L2223/54426 , H01L2224/83139 , H01L2224/83201 , H01L2224/83902
Abstract: A method of joining semiconductor substrates, which may include: forming an alignment key on a first semiconductor substrate; forming an insulating layer on the first semiconductor substrate and the alignment key; forming a first metal layer pattern and a second metal layer pattern on the insulating layer; forming a first protrusion and a second protrusion, and an alignment recess positioned between the first protrusion and the second protrusion on a second semiconductor substrate; forming a third metal layer pattern and a fourth metal layer pattern on the first protrusion and the second protrusion, respectively; and joining the first semiconductor substrate and the second semiconductor substrate, in which the alignment key is positioned at the alignment recess when the first semiconductor substrate and the second semiconductor substrate are joined, is provided.
Abstract translation: 一种连接半导体衬底的方法，其可以包括：在第一半导体衬底上形成对准键; 在所述第一半导体衬底和所述对准键上形成绝缘层; 在所述绝缘层上形成第一金属层图案和第二金属层图案; 形成第一突起和第二突起，以及位于第二半导体衬底上的第一突起和第二突起之间的对准凹槽; 在所述第一突起和所述第二突起上分别形成第三金属层图案和第四金属层图案; 并且提供在第一半导体衬底和第二半导体衬底接合时将对准键定位在对准凹槽处的第一半导体衬底和第二半导体衬底。
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公开(公告)号：US10582308B2
公开(公告)日：2020-03-03
申请号：US16371645
申请日：2019-04-01
Applicant: HYUNDAI MOTOR COMPANY , KIA MOTORS CORPORATION
Inventor： Ilseon Yoo
Abstract: A high sensitivity microphone includes a substrate having a through portion provided in a central portion thereof, a vibration membrane disposed on the substrate and covering the through portion, a fixed membrane installed above the vibration membrane, spaced apart from the vibration membrane with an air layer interposed therebetween, and having a plurality of air inlets perforated in a direction toward the air layer, and a plurality of support posts provided as vertical elastic posts between the fixed membrane and the vibration membrane and mechanically fixing the vibration membrane by a frictional force, regardless of an applied voltage.
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